Patents by Inventor Shunsuke Yatsunami

Shunsuke Yatsunami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9920420
    Abstract: Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members configured to be movable relative to each other to accommodate an expansion of a green body which takes place at the time of reducing the pressure after the completion of pressing.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: March 20, 2018
    Assignee: TOSOH CORPORATION
    Inventors: Kenichi Itoh, Masami Mesuda, Hitoshi Nagayama, Tetsuo Shibutami, Shunsuke Yatsunami
  • Publication number: 20150368791
    Abstract: Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members configured to be movable relative to each other to accommodate an expansion of a green body which takes place at the time of reducing the pressure after the completion of pressing.
    Type: Application
    Filed: July 21, 2015
    Publication date: December 24, 2015
    Applicant: TOSOH CORPORATION
    Inventors: Kenichi ITOH, Masami MESUDA, Hitoshi NAGAYAMA, Tetsuo SHIBUTAMI, Shunsuke YATSUNAMI
  • Publication number: 20130213801
    Abstract: Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members configured to be movable relative to each other to accommodate an expansion of a green body which takes place at the time of reducing the pressure after the completion of pressing.
    Type: Application
    Filed: March 18, 2013
    Publication date: August 22, 2013
    Inventors: Kenichi ITOH, Masami MESUDA, Hitoshi NAGAYAMA, Tetsuo SHIBUTAMI, Shunsuke YATSUNAMI
  • Patent number: 8419400
    Abstract: Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members configured to be movable relative to each other to accommodate an expansion of a green body which takes place at the time of reducing the pressure after the completion of pressing.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: April 16, 2013
    Assignee: Tosoh Corporation
    Inventors: Kenichi Itoh, Masami Mesuda, Hitoshi Nagayama, Tetsuo Shibutami, Shunsuke Yatsunami
  • Publication number: 20080274351
    Abstract: To provide a large sputtering target excellent in discharge characteristics during sputtering and in characteristics of a thin film thereby obtainable. Further, a process for producing a sintered body is provided, whereby a large green body excellent in shape accuracy can be obtained by means of cold isostatic pressing directly without preforming, and a sintered body capable of providing the above-mentioned excellent sputtering target, can be produced efficiently at a low cost. The sputtering target is produced by using a sintered body having the content of carbon contained as an impurity reduced to less than 0.005 wt %. Such a sintered body is obtainable by molding a raw material powder by cold isostatic pressing directly without adding a binder containing an organic substance or a molding aid, followed by firing.
    Type: Application
    Filed: January 27, 2006
    Publication date: November 6, 2008
    Applicant: TOSOH CORPORATION
    Inventors: Kenichi Itoh, Masami Mesuda, Hitoshi Nagayama, Tetsuo Shibutami, Shunsuke Yatsunami
  • Patent number: 6036939
    Abstract: A novel heat-resistant low-silica zeolite, an industrial production process, and uses of the low-silica zeolite are provided. The heat-resistant low-silica zeolite contains Si and Al in a molar ratio of SiO.sub.2 /Al.sub.2 O.sub.3 ranging from 1.9 to 2.1, and has sodium and/or potassium as metal cation, wherein the low-silica zeolite contains low-silica faujasite type zeolite at a content of not lower than 88%, and has a thermal decomposition temperature ranging from 870.degree. C. to 900.degree. C. in the air. The process for producing the heat-resistant low-silica zeolite comprises mixing a solution containing an aluminate with another solution containing a silicate, allowing the resulting mixture to gel, and aging the resulting gel, at the temperature of from 0.degree. C. to 60.degree. C., to prepare a slurry having a viscosity ranging from 10 to 10000 cp and containing amorphous aluminosilicate having a specific surface area of not less than 10 m.sup.2 /g with an SiO.sub.2 /Al.sub.2 O.sub.
    Type: Grant
    Filed: August 28, 1997
    Date of Patent: March 14, 2000
    Assignee: Tosoh Corporation
    Inventors: Hajime Funakoshi, Yoshinori Shirakura, Shunsuke Yatsunami, Kazuaki Yamamoto, Nobuhiro Ogawa, Takashi Mori, Atsushi Harada