Patents by Inventor Shuntaro YAMADA

Shuntaro YAMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • VEHICLE CONTROL APPARATUS
    Publication number: 20240092337
    Abstract: A vehicle control apparatus includes front-wheel and rear-wheel driving systems, and a control system. The front-wheel driving system includes a first travel motor mechanically coupled to a front wheel of a vehicle and a first accumulator electrically coupled to the first travel motor. The rear-wheel driving system includes a second travel motor mechanically coupled to a rear wheel of the vehicle and a second accumulator electrically coupled to the second travel motor. The control system includes one or more processors and one or more memories communicably coupled to the one or more processors, and controls the first and second travel motors. When a difference between an SOC of the first accumulator and an SOC of the second accumulator is greater than a threshold value, the one or more processors change a torque distribution ratio between the first and second travel motors from a reference distribution ratio.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 21, 2024
    Inventors: Hiroshi KUSANO, Yoshinobu YAMAZAKI, Masami OGURI, Akihiro NABESHIMA, Yoshiyuki JIN, Takeshi YONEDA, Fumiya SATO, Keigo YAMADA, Takumi ARAKI, Shuntaro MIURA
  • Manufacturing method of semiconductor device with attached film
    Patent number: 11145515
    Abstract: In a manufacturing method of a semiconductor device including a substrate having a front surface and a rear surface, and a film attached to the rear surface, the film is attached on the rear surface, a rear surface side groove is provided by half-cutting the substrate from the rear surface together with the film, a protective member is attached to the film after the rear surface side groove is provided, and a front surface side groove connected to the rear surface side groove is provided by dicing the substrate from the front surface after the protective member is attached.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: October 12, 2021
    Assignee: DENSO CORPORATION
    Inventors: Shuntaro Yamada, Akinori Kanda, Tetsuo Yoshioka, Takashige Nagao, Kouichi Miyashita
  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    Publication number: 20200058510
    Abstract: In a manufacturing method of a semiconductor device including a substrate having a front surface and a rear surface, and a film attached to the rear surface, the film is attached on the rear surface, a rear surface side groove is provided by half-cutting the substrate from the rear surface together with the film, a protective member is attached to the film after the rear surface side groove is provided, and a front surface side groove connected to the rear surface side groove is provided by dicing the substrate from the front surface after the protective member is attached.
    Type: Application
    Filed: October 24, 2019
    Publication date: February 20, 2020
    Inventors: Shuntaro YAMADA, Akinori KANDA, Tetsuo YOSHIOKA, Takashige NAGAO, Kouichi MIYASHITA