Abstract: Provided is a pressure-resistant underwater acoustic coating structure with a mesh structure interlayer, including an outer coating, a mesh structure interlayer, an inner coating, and a metal backing; wherein the outer coating is used for inputting acoustic waves, the mesh structure interlayer and the inner coating are used for consuming acoustic wave energy, and the metal backing is used for enriching a sound absorption mode; and the outer coating, the mesh structure interlayer, the inner coating and the metal backing are attached in sequence.

Abstract: The present invention relates to the field of biomedicine, and in particular to an engineered migrasome, a method for preparing the engineered migrasome, a delivery system comprising the engineered migrasome, and a method for preparing the delivery system.

Abstract: A method of forming a semiconductor structure includes following steps. A substrate is formed. The substrate has an active region, an isolation structure adjacent to the active region, and a contact on the active region. A dielectric stack is formed on the substrate. The dielectric stack is etched to form an opening such that the contact of the substrate is exposed. The opening has a bottom portion and a top portion communicated to the bottom portion. The dielectric stack is etched again to expand the bottom portion of the opening.