Patents by Inventor Shuo-Jieh Wu

Shuo-Jieh Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making and using alloy susceptor with improved properties for film deposition
    Patent number: 8147909
    Abstract: Provided is a method for processing a wafer that includes providing an alloy susceptor including an exterior surface and a wafer contact surface. The exterior surface of the alloy susceptor is treated to produce a roughness of the exterior surface. The roughened exterior surface of is coated with a ceramic material. The alloy susceptor including the ceramic-coated roughened exterior surface is positioned in a wafer process chamber. A plurality of layers of a film are deposited on the ceramic-coated roughened exterior surface of the alloy susceptor, wherein a first adhesion exists between the plurality of layers of the film and the ceramic material coated on the roughened exterior surface of the alloy susceptor that is greater than a second adhesion that would exist between the plurality of layers of the film and a non-roughened exterior surface of the alloy susceptor without the ceramic material.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: April 3, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shuo-Jieh Wu, Hsu Chun Yuan, Tung-Li Lee, Steven Li, Hs Chiu, Yen-Yu Chen, Alan Chen, Ming Jie He, Yu-Wei Hsueh
  • ALLOY SUSCEPTOR WITH IMPROVED PROPERTIES FOR FILM DEPOSITION
    Publication number: 20100247773
    Abstract: Provided is a method for processing a wafer that includes providing an alloy susceptor including an exterior surface and a wafer contact surface. The exterior surface of the alloy susceptor is treated to produce a roughness of the exterior surface. The roughened exterior surface of is coated with a ceramic material. The alloy susceptor including the ceramic-coated roughened exterior surface is positioned in a wafer process chamber. A plurality of layers of a film are deposited on the ceramic-coated roughened exterior surface of the alloy susceptor, wherein a first adhesion exists between the plurality of layers of the film and the ceramic material coated on the roughened exterior surface of the alloy susceptor that is greater than a second adhesion that would exist between the plurality of layers of the film and a non-roughened exterior surface of the alloy susceptor without the ceramic material.
    Type: Application
    Filed: March 26, 2009
    Publication date: September 30, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shuo-Jieh Wu, Hsu Chun Yuan, Tung-Li Lee, Steven Lin, Hs Chiu, Yen-Yu Chen, Alan Chen, Ming Jie He, Yu-Wei Hsueh