Patents by Inventor SHUO-WEI HUANG

SHUO-WEI HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11740394
    Abstract: An optical power prism that may be used in folded lens systems that consists of a glass prism and a glass lens attached to a surface of the prism using a thin layer of optical glue or by optical contact. The glass lens does not have a flange and thus the prism can be smaller than prisms used in conventional power prisms with the same lens effective area, thus reducing the Z-height of the power prism when compared to conventional power prisms. An optical glass may be used for the lens that has a higher refractive index than can be provided by optical plastic which allows the lens to be thinner than plastic lenses. The lenses may be formed by molding a glass wafer to form lens shapes on a first surface of the wafer; the molded wafer is then ground from a second surface to singulate the lenses.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: August 29, 2023
    Assignee: Apple Inc.
    Inventors: Norimichi Shigemitsu, Kazuya Fujita, Hideki Tanaka, Shuo Wei Huang
  • Publication number: 20220350058
    Abstract: An optical power prism that may be used in folded lens systems that consists of a glass prism and a glass lens attached to a surface of the prism using a thin layer of optical glue or by optical contact. The glass lens does not have a flange and thus the prism can be smaller than prisms used in conventional power prisms with the same lens effective area, thus reducing the Z-height of the power prism when compared to conventional power prisms. An optical glass may be used for the lens that has a higher refractive index than can be provided by optical plastic which allows the lens to be thinner than plastic lenses. The lenses may be formed by molding a glass wafer to form lens shapes on a first surface of the wafer; the molded wafer is then ground from a second surface to singulate the lenses.
    Type: Application
    Filed: May 20, 2022
    Publication date: November 3, 2022
    Applicant: Apple Inc.
    Inventors: Norimichi Shigemitsu, Kazuya Fujita, Hideki Tanaka, Shuo Wei Huang
  • Patent number: 11340388
    Abstract: An optical power prism that may be used in folded lens systems that consists of a glass prism and a glass lens attached to a surface of the prism using a thin layer of optical glue or by optical contact. The glass lens does not have a flange and thus the prism can be smaller than prisms used in conventional power prisms with the same lens effective area, thus reducing the Z-height of the power prism when compared to conventional power prisms. An optical glass may be used for the lens that has a higher refractive index than can be provided by optical plastic which allows the lens to be thinner than plastic lenses. The lenses may be formed by molding a glass wafer to form lens shapes on a first surface of the wafer; the molded wafer is then ground from a second surface to singulate the lenses.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: May 24, 2022
    Assignee: Apple Inc.
    Inventors: Norimichi Shigemitsu, Kazuya Fujita, Hideki Tanaka, Shuo Wei Huang
  • Publication number: 20200073028
    Abstract: An optical power prism that may be used in folded lens systems that consists of a glass prism and a glass lens attached to a surface of the prism using a thin layer of optical glue or by optical contact. The glass lens does not have a flange and thus the prism can be smaller than prisms used in conventional power prisms with the same lens effective area, thus reducing the Z-height of the power prism when compared to conventional power prisms. An optical glass may be used for the lens that has a higher refractive index than can be provided by optical plastic which allows the lens to be thinner than plastic lenses. The lenses may be formed by molding a glass wafer to form lens shapes on a first surface of the wafer; the molded wafer is then ground from a second surface to singulate the lenses.
    Type: Application
    Filed: August 26, 2019
    Publication date: March 5, 2020
    Applicant: Apple Inc.
    Inventors: Norimichi Shigemitsu, Kazuya Fujita, Hideki Tanaka, Shuo Wei Huang
  • Publication number: 20090153706
    Abstract: An imaging module package includes a substrate, an imaging sensor chip, a functional unit, a housing, and a lens module positioned in the housing. The substrate defines an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof. The imaging sensor chip is positioned in the upper chamber and is electrically connected to the substrate. The functional unit is positioned in the lower chamber and is electrically connected to the substrate. The housing is mounted on the top surface of the substrate and is disposed above the imaging sensor chip.
    Type: Application
    Filed: April 9, 2008
    Publication date: June 18, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: STEVEN WEBSTER, YING-CHENG WU, SHUO-WEI HUANG, SHIH-MIN LO