Abstract: The present disclosure discloses a frame structure, which can make the assembling process simple and time-saving and achieve a thin profile and a light weight. A technical solution adopted in the present disclosure is: a frame structure, comprising a frame, a front cover, and a connector for connecting the frame with the front cover that are all integrally formed, and also comprising fixing elements for securing an end of the front cover that is away from the connector to the frame. The present disclosure further discloses a liquid crystal module comprising the frame structure.

Abstract: The present invention discloses a liquid crystal display (LCD) and a backplane of a back light module thereof. The LCD comprises a back cover, one or more circuit boards and a backplane of a back light module. One or more circuit board attaching devices for attaching the circuit boards are arranged on the interior sidewall of the back cover and void spaces for avoiding the circuit boards are arranged at the corresponding position of the backplane. As the circuit boards installed prior to this invention on the backplane is now installed on the back cover instead, the backplane of the back light module of the LCD is not provided with the bumps for attaching the circuit boards any more; the structure of the backplane and the manufacturing process of the backplane are simpler. Furthermore, as the back cover is insulated, the bumps are not arranged, and the circuit boards can be attached by simple circuit board attaching devices, significantly simplifying the process.

Abstract: An integrated appliance is disclosed in the present disclosure. The integrated appliance comprises a backplate and a circuit board. The circuit board comprises a baseplate and an electronic component disposed on the baseplate. The baseplate is fixed to an inner wall of the backplate, and the electronic component is located between the baseplate and the backplate. With the aforesaid arrangement, an uneven surface structure of the backplate itself is utilized in the integrated appliance of the present disclosure to dispose the circuit board on the inner wall of the backplate in such a way that the electronic component on the circuit board is disposed facing towards an inner wall surface of the backplate. As this eliminates the use of the back cover, the structure is simplified and both the mold cost and the material cost associated with the back cover are saved, thus resulting in a reduced manufacturing cost.