Patents by Inventor Shurui Shang
Shurui Shang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9723713Abstract: In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, a flexible section of the printed circuit board is configured to have a non-linear portion that functions as a hinge when the flexible section is bent, flexed, twisted or otherwise subjected to a motion related force. The hinge configuration improves durability and flexibility while minimizing ripping and cracking of the printed circuit board, particularly interconnects within the flexible section and a transition region between the flexible section and a rigid section of the printed circuit board. The hinge is configured to have a non-linear shape, such as a serpentine or circuitous path that can include curved portions, different linear portions or some combination of curved and linear portions.Type: GrantFiled: May 14, 2015Date of Patent: August 1, 2017Assignee: Multek Technologies, Ltd.Inventors: Joan K. Vrtis, Michael James Glickman, Mark Bergman, Shurui Shang
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Patent number: 9549463Abstract: A circuit board comprises one or more rigid sections, one or more flexible sections, and one or more transition areas where the circuit board transitions from the rigid section to the flexible section. One or more mechanically restrictive components are applied at a transition area to prevent failure and/or breakage of the circuit as it is bent and flexed. The mechanically restrictive components can be dispersed throughout the circuit as a coverlay, an underlay, and symmetrically positioned within the circuit board as an overlay and an underlay.Type: GrantFiled: May 14, 2015Date of Patent: January 17, 2017Assignee: Multek Technologies, Ltd.Inventors: Joan K. Vrtis, Michael James Glickman, Mark Bergman, Shurui Shang
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Patent number: 9521754Abstract: An embedded component is formed in a PCB stack by applying an adhesive layer across an entire surface of a copper layer and selectively positioning the component on a portion of the adhesive layer. A B stage pre-preg layer having a component cut-out is added onto the adhesive layer such that the component adhered to the adhesive layer fits within the component cut-out of the B stage pre-preg layer. Another copper layer is added onto the B stage pre-preg layer and the PCB stack is laminated. Since B stage pre-preg is not fully cured, a gap between the component and a side wall of the component cut-out is filled by flow of the surrounding B stage pre-preg during the lamination step. One or more additional pre-preg and copper layers are added to the PCB stack with corresponding interconnects formed and coupled to the contact pads on the component.Type: GrantFiled: August 19, 2014Date of Patent: December 13, 2016Assignee: Multek Technologies LimitedInventors: Mark Bergman, Shurui Shang, Joan K. Vrtis
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Patent number: 9226391Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.Type: GrantFiled: December 22, 2010Date of Patent: December 29, 2015Assignee: LITTELFUSE, INC.Inventors: Shurui Shang, Robert Fleming
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Patent number: 9084354Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.Type: GrantFiled: August 28, 2012Date of Patent: July 14, 2015Assignee: LITTELFUSE, INC.Inventors: Robert Fleming, Lex Kosowsky, Shurui Shang, Bhret Graydon, Xiaofeng Chen, Glen Irvin
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Patent number: 8399773Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.Type: GrantFiled: January 27, 2010Date of Patent: March 19, 2013Assignee: Shocking Technologies, Inc.Inventors: Lex Kosowsky, Bhret Graydon, Djabbar Moustafaev, Shurui Shang, Robert Fleming
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Publication number: 20120318569Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.Type: ApplicationFiled: August 28, 2012Publication date: December 20, 2012Inventors: Robert Fleming, Lex Kosowsky, Shurui Shang, Bhret Graydon, Xiaofeng Chen, Glen Irvin
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Patent number: 8272123Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.Type: GrantFiled: January 19, 2011Date of Patent: September 25, 2012Assignee: Shocking Technologies, Inc.Inventors: Robert Fleming, Lex Kosowsky, Shurui Shang, Bhret Graydon, Xiaofeng Chen, Glen Irvin
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Publication number: 20110173806Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.Type: ApplicationFiled: January 19, 2011Publication date: July 21, 2011Inventors: Robert Flemming, Lex Kowsowsky, Shurui Shang, Bhret Graydon, Xiaofeng Chen, Glen Irvin
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Publication number: 20110132647Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.Type: ApplicationFiled: December 22, 2010Publication date: June 9, 2011Inventors: Shurui Shang, Robert Fleming
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Publication number: 20100187006Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.Type: ApplicationFiled: January 27, 2010Publication date: July 29, 2010Inventors: Lex Kosowsky, Bhret Graydon, Djabbar Moustafaev, Shurui Shang, Robert Fleming