Patents by Inventor Shusaku Mochizuki

Shusaku Mochizuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of light emitting device in a flip-chip configuration with reduced package size
    Patent number: 9490398
    Abstract: Provided is an LED device which is compact while having good luminous efficiency and a focused light distribution. This LED device is provided with: a reflective frame around the outer periphery of the LED device; an LED die which has a transparent insulating substrate, a semiconductor layer formed on the bottom surface of the transparent insulating substrate, and an outer connection electrode disposed on the semiconductor layer; and a fluorescent member which is disposed on at least the top surface of the LED die and which converts the wavelength of the light emitted from the LED die. On the inside of the reflective frame is an inclined surface in contact with the lateral surface of the fluorescent member, and the inclined surface is formed such that the inner diameter of the reflective frame widens from the bottom surface towards the top surface of the LED die. Also provided is a manufacturing method of the LED device.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: November 8, 2016
    Assignees: CITIZEN HOLDINGS CO., LTD., CITIZEN ELECTRONICS CO., LTD.
    Inventors: Nodoka Oyamada, Kenji Imazu, Shusaku Mochizuki
  • LED DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20150311405
    Abstract: Provided is an LED device which is compact while having good luminous efficiency and a focused light distribution. This LED device is provided with: a reflective frame around the outer periphery of the LED device; an LED die which has a transparent insulating substrate, a semiconductor layer formed on the bottom surface of the transparent insulating substrate, and an outer connection electrode disposed on the semiconductor layer; and a fluorescent member which is disposed on at least the top surface of the LED die and which converts the wavelength of the light emitted from the LED die. On the inside of the reflective frame is an inclined surface in contact with the lateral surface of the fluorescent member, and the inclined surface is formed such that the inner diameter of the reflective frame widens from the bottom surface towards the top surface of the LED die. Also provided is a manufacturing method of the LED device.
    Type: Application
    Filed: November 25, 2013
    Publication date: October 29, 2015
    Applicants: CITIZEN HOLDING CO., LTD., CITIZEN ELECTRONICS CO., LTD.
    Inventors: Nodoka Oyamada, Kenji Imazu, Shusaku Mochizuki