Abstract: A sense amplifier circuit senses and amplifies a signal read from memory cells arranged at intersections of word-lines and bit-lines. A write circuit reads first data held in a first memory cell of the memory cells, and writes second data corresponding to the first data in a second memory cell different from the first memory cell. A data latch circuit holds data read from the first memory cell. A logic operation circuit performs a logic operation using data read from the second memory cell and data held in the data latch circuit as input values and outputs third data as an operation value. A write-back circuit writes the third data back to the first memory cell.

Abstract: A fuse link is formed between first and second terminals. The first and second terminals and fuse link have a polysilicon layer and a layer formed on the polysilicon layer and containing a metal element. At least a portion of the fuse link is an amorphous silicon layer.

Abstract: A sense amplifier circuit senses and amplifies a signal read from memory cells arranged at intersections of word-lines and bit-lines. A write circuit reads first data held in a first memory cell of the memory cells, and writes second data corresponding to the first data in a second memory cell different from the first memory cell. A data latch circuit holds data read from the first memory cell. A logic operation circuit performs a logic operation using data read from the second memory cell and data held in the data latch circuit as input values and outputs third data as an operation value. A write-back circuit writes the third data back to the first memory cell.

Abstract: A fuse link is formed between first and second terminals. The first and second terminals and fuse link have a polysilicon layer and a layer formed on the polysilicon layer and containing a metal element. At least a portion of the fuse link is an amorphous silicon layer.

Abstract: A memory system includes a ferroelectric memory formed by arranging a plurality of memory cells having a ferroelectric capacitor and cell transistor, a flash EEPROM formed by arranging a plurality of memory cells having a floating gate and capable of electrically erasing and writing data, a control circuit configured to control the ferroelectric memory and flash EEPROM, and an interface circuit configured to communicate with the outside. The flash EEPROM stores data. The ferroelectric memory stores at least one of root information for storing the data, directory information, the file name of the data, the file size of the data, file allocation table information storing the storage location of the data, and the write completion time of the data.

Abstract: A fuse link is formed between first and second terminals. The first and second terminals and fuse link have a polysilicon layer and a layer formed on the polysilicon layer and containing a metal element. At least a portion of the fuse link is an amorphous silicon layer.

Abstract: A memory system includes a ferroelectric memory, flash EEPROM, control circuit, and interface circuit. The control circuit is configured to control the ferroelectric memory and flash EEPROM. The interface circuit is configured to communicate externally. Data is programmed in the flash EEPROM by a write unit which is smaller than a block as an erase unit and larger than a page as a program unit. The ferroelectric memory stores a logical address-physical address conversion table using the write unit.

Abstract: A semiconductor memory device includes a fuse element including a first terminal and a second terminal, which stores data based on whether or not it is electrically blown by a laser beam, a resistance element connected to the first terminal, a node in which the data is transferred, and a transistor provided between the resistance element and the node, which sets the data to the node.

Abstract: A memory system includes a ferroelectric memory, flash EEPROM, control circuit, and interface circuit. The control circuit is configured to control the ferroelectric memory and flash EEPROM. The interface circuit is configured to communicate externally. Data is programmed in the flash EEPROM by a write unit which is smaller than a block as an erase unit and larger than a page as a program unit. The ferroelectric memory stores a logical address-physical address conversion table using the write unit.

Abstract: A memory system includes a ferroelectric memory formed by arranging a plurality of memory cells having a ferroelectric capacitor and cell transistor, a flash EEPROM formed by arranging a plurality of memory cells having a floating gate and capable of electrically erasing and writing data, a control circuit configured to control the ferroelectric memory and flash EEPROM, and an interface circuit configured to communicate with the outside. The flash EEPROM stores data. The ferroelectric memory stores at least one of root information for storing the data, directory information, the file name of the data, the file size of the data, file allocation table information storing the storage location of the data, and the write completion time of the data.

Abstract: A semiconductor memory device includes a fuse element including a first terminal and a second terminal, which stores data based on whether or not it is electrically blown by a laser beam, a resistance element connected to the first terminal, a node in which the data is transferred, and a transistor provided between the resistance element and the node, which sets the data to the node.

Abstract: A fuse link is formed between first and second terminals. The first and second terminals and fuse link have a polysilicon layer and a layer formed on the polysilicon layer and containing a metal element. At least a portion of the fuse link is an amorphous silicon layer.

Abstract: A semiconductor memory includes a plurality of primary memory cells arranged in a row and column matrix formed on a semiconductor chip area and a plurality of redundant memory cells which replace primary memory cells which are found to be defective. The semiconductor memory includes a first test circuit for simultaneously writing one data value to a first number of the primary memory cells and simultaneously reading stored data from the first number of the primary memory cells to determine whether all of the stored data have the same data value, thereby performing a first parallel bit test on the first number of the primary memory cells. The first parallel bit test is performed while the semiconductor memory is in a wafer state. The semiconductor memory also includes a second test circuit which performs a second parallel bit test on a second number of primary memory cells.

Abstract: A fault-tolerant DRAM design minimizes current flow in the even of a cross-fail. A bit-line precharge current limiter is provided for the bit-line precharge equalizer circuit. The bit-line precharge current limiter is both simple and effective, requiring very little silicon area to implement. The current limiter provides self current-limiting for defective bit-lines, without the necessity for a reference cell.