Patents by Inventor Shusuke Yoshihara

Shusuke Yoshihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11889623
    Abstract: A metal-clad laminate and techniques using the metal-clad laminate are provided where the metal-clad laminate has excellent adhesiveness between a substrate and metal foil in addition to good dielectric characteristics and heat resistance. The metal-clad laminate includes an insulating layer in contact with metal foil where the insulating layer further includes a resin composition and a fibrous base material. The resin composition contains a specific resin (A) and specific core-shell polymer particles (B), and a surface of the metal foil has a ten-point average roughness (Rz) of not more than 2.0 ?m.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: January 30, 2024
    Assignee: KANEKA CORPORATION
    Inventor: Shusuke Yoshihara
  • Patent number: 11629237
    Abstract: A solvent composition includes an organic solvent including one or more organic solvents (A) and one or more organic solvents (B), and one or more types of core-shell polymer particles each comprising a core layer and a shell layer. The organic sol vents (A) have a polar teen ?p of a Hansen solubility parameter of less than 11 and a hydrogen bond term ?h of less than 10, and the organic solvents (B) satisfy at least one of 11 or more of the polar term ?p or 10 or more of the hydrogen bond term ?h. A weight ratio of (A) to (B) ranges from 15:85 to 95:5. Based on a total weight of the solvent composition, a content of the core-shell polymer particles is 20 to 40% by weight and a water content is 1% by weight or less.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: April 18, 2023
    Assignee: KANEKA CORPORATION
    Inventor: Shusuke Yoshihara
  • Publication number: 20230062748
    Abstract: A viscosity modifier for a condensation polymer may include a chain extender comprising at least one reactive monomer and at least one vinyl monomer copolymerizable with the reactive monomer, the chain extender being present in an amount ranging from 15 to 70 wt % of the viscosity modifier; and a non-condensation carrier resin present in an amount ranging from 30 to 85 wt % of the viscosity modifier. Condensation polymer compositions, methods of forming viscosity modifiers, and methods of molding condensation polymer compositions are also provided.
    Type: Application
    Filed: February 5, 2021
    Publication date: March 2, 2023
    Applicant: Kaneka Americas Holding, Inc.
    Inventors: Tetsuro Yamamoto, Noah Boyd, Yoshiaki Matsuoka, Shusuke Yoshihara, Ian Winters
  • Publication number: 20210153346
    Abstract: A metal-clad laminate and techniques using the metal-clad laminate are provided where the metal-clad laminate has excellent adhesiveness between a substrate and metal foil in addition to good dielectric characteristics and heat resistance. The metal-clad laminate includes an insulating layer in contact with metal foil where the insulating layer further includes a resin composition and a fibrous base material. The resin composition contains a specific resin (A) and specific core-shell polymer particles (B), and a surface of the metal foil has a ten-point average roughness (Rz) of not more than 2.0 ?m.
    Type: Application
    Filed: January 29, 2021
    Publication date: May 20, 2021
    Applicant: KANEKA CORPORATION
    Inventor: Shusuke Yoshihara
  • Patent number: 10619004
    Abstract: It is possible to enhance flowability of a polycarbonate resin during molding of the polycarbonate resin without impairment of inherent properties of the polycarbonate resin by blending a flowability enhancing agent and an antioxidant with the polycarbonate resin, the flowability enhancing agent including polyester which is a polycondensate of a monomer mixture, the monomer mixture being a mixture of monomers (A), (B), and (C), which are biphenol (A), bisphenol (B), and dicarboxylic acid (C), respectively, the monomer mixture containing the biphenol (A) in an amount of 0 mol % to 55 mol %, the bisphenol (B) in an amount of 5 mol % to 60 mol %, and the dicarboxylic acid (C) in an amount of 40 mol % to 60 mol %, with respect to 100 mol % of a total amount of the monomers (A), (B), and (C), and the polyester having terminals 60% or more of which are sealed with a terminal sealing agent having a number average molecular weight of not less than 160.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: April 14, 2020
    Assignee: KANEKA CORPORATION
    Inventors: Keika Hattori, Shusuke Yoshihara
  • Publication number: 20200095385
    Abstract: A solvent composition includes an organic solvent including one or more organic solvents (A) and one or more organic solvents (B), and one or more types of core-shell polymer particles each comprising a core layer and a shell layer. The organic sol vents (A) have a polar teen ?p of a Hansen solubility parameter of less than 11 and a hydrogen bond term ?h of less than 10, and the organic solvents (B) satisfy at least one of 11 or more of the polar term ?p or 10 or more of the hydrogen bond term ?h. A weight ratio of (A) to (B) ranges from 15:85 to 95:5. Based on a total weight of the solvent composition, a content of the core-shell polymer particles is 20 to 40% by weight and a water content is 1% by weight or less.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 26, 2020
    Applicant: KANEKA CORPORATION
    Inventor: Shusuke Yoshihara
  • Publication number: 20200062893
    Abstract: It is possible to enhance flowability of a polycarbonate resin during molding of the polycarbonate resin without impairment of inherent properties of the polycarbonate resin by blending a flowability enhancing agent and an antioxidant with the polycarbonate resin, the flowability enhancing agent including polyester which is a polycondensate of a monomer mixture, the monomer mixture being a mixture of monomers (A), (B), and (C), which are biphenol (A), bisphenol (B), and dicarboxylic acid (C), respectively, the monomer mixture containing the biphenol (A) in an amount of 0 mol % to 55 mol %, the bisphenol (B) in an amount of 5 mol % to 60 mol %, and the dicarboxylic acid (C) in an amount of 40 mol % to 60 mol %, with respect to 100 mol % of a total amount of the monomers (A), (B), and (C), and the polyester having terminals 60% or more of which are sealed with a terminal sealing agent having a number average molecular weight of not less than 160.
    Type: Application
    Filed: April 5, 2017
    Publication date: February 27, 2020
    Applicant: KANEKA CORPORATION
    Inventors: Keika HATTORI, Shusuke YOSHIHARA
  • Publication number: 20200040180
    Abstract: Provided is a polycarbonate resin composition containing a polycarbonate resin whose flowability during molding of the polycarbonate resin is enhanced, without loss of properties such as transparency, mechanical strength, and heat resistance, by adding, to the polycarbonate resin, a polycarbonate oligomer and a flowability enhancing agent which is obtained through polycondensation of a monomer mixture containing a bisphenol component and a dicarboxylic acid and, optionally, biphenol component. Further provided is a molded article obtained from the polycarbonate resin composition.
    Type: Application
    Filed: April 5, 2017
    Publication date: February 6, 2020
    Applicant: KANEKA Corporation
    Inventors: Keika HATTORI, Shusuke YOSHIHARA
  • Publication number: 20190119490
    Abstract: A resin composition in accordance with an embodiment of the present invention includes an engineering resin, a graft copolymer, and a flowability enhancing agent which includes a polyester obtained through polycondensation of bisphenol and dicarboxylic acid and, optionally, biphenol in specific proportions. The resin composition has melt flowability improved without loss of an excellent plating property of the graft copolymer and without loss of an excellent property of the engineering resin.
    Type: Application
    Filed: April 5, 2017
    Publication date: April 25, 2019
    Applicant: KANEKA CORPORATION
    Inventors: Shusuke YOSHIHARA, Keika HATTORI
  • Patent number: 10253178
    Abstract: A method of improving flowability of polycarbonate or polyarylate includes mixing the polycarbonate or the polyarylate with a flowability improver including a polyester. The polyester is a polycondensate of monomers including a bisphenol component (B) and a dicarboxylic acid component (C) at a molar ratio satisfying (B):(C)=45:55-55:45. The polyester includes a portion derived from the bisphenol component (B) and the dicarboxylic acid component (C) in an amount of 50 mol % or more.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: April 9, 2019
    Assignee: KANEKA CORPORATION
    Inventors: Shusuke Yoshihara, Hidekazu Kawakubo, Keika Hattori, Kazuaki Matsumoto, Kazunori Saegusa
  • Publication number: 20180298186
    Abstract: A resin composition includes: a curable compound (?); a curing agent (?); a liquid crystal polymer (?) that forms a liquid crystal phase at 190° C. or lower; and a filler (?). A liquid crystal polymer composition includes: (I) a compound having two or more epoxy groups in the molecule; (II) a curing agent; (III) a liquid crystal polymer that forms a liquid crystal phase at 190° C. or lower; (IV) a thermal conductive filler; and (V) a solvent. A curable resin composition includes: (A) a thermoplastic resin; (B) a curable resin; (C) a curing agent; (D) an elastomer; and (E) an inorganic filler.
    Type: Application
    Filed: June 22, 2018
    Publication date: October 18, 2018
    Applicant: Kaneka Corporation
    Inventors: Shusuke Yoshihara, Takashi Ando
  • Patent number: 9809735
    Abstract: The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: November 7, 2017
    Assignee: Kaneka Corporation
    Inventors: Shusuke Yoshihara, Syoji Ubukata, Kazuaki Matsumoto
  • Publication number: 20170204262
    Abstract: A method of improving flowability of polycarbonate or polyarylate includes mixing the polycarbonate or the polyarylate with a flowability improver including a polyester. The polyester is a polycondensate of monomers including a bisphenol component (B) and a dicarboxylic acid component (C) at a molar ratio satisfying (B):(C)=45:55?55:45. The polyester includes a portion derived from the bisphenol component (B) and the dicarboxylic acid component (C) in an amount of 50 mol % or more.
    Type: Application
    Filed: April 3, 2017
    Publication date: July 20, 2017
    Applicant: KANEKA CORPORATION
    Inventors: Shusuke YOSHIHARA, Hidekazu KAWAKUBO, Keika HATTORI, Kazuaki MATSUMOTO, Kazunori SAEGUSA
  • Publication number: 20160304762
    Abstract: The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.
    Type: Application
    Filed: November 13, 2014
    Publication date: October 20, 2016
    Applicant: Kaneka Corporation
    Inventors: Shusuke Yoshihara, Syoji Ubukata, Kazuaki Matsumoto
  • Patent number: 9234095
    Abstract: A resin composition includes (A) a thermally-conductive organic additive including a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1): -M-Sp-??(1) where M represents a mesogenic group and Sp represents a spacer, (B) a thermosetting resin; and (C) an inorganic filler.
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: January 12, 2016
    Assignee: KANEKA CORPORATION
    Inventors: Shusuke Yoshihara, Kazuaki Matsumoto
  • Patent number: 9200111
    Abstract: The thermoplastic resin in accordance with the present invention includes a unit (A) by 25 mol % to 60 mol %, the unit (A) having a biphenyl group, a linear unit (e.g., a linear aliphatic hydrocarbon chain) (B) by 25 mol % to 60 mol %, and a unit (C) by 1 mol % to 25 mol %, the unit (C) having a substituent selected from the group consisting of non-fused aromatic groups, fused aromatic groups, heterocyclic groups, alicyclic groups, and alicyclic heterocyclic groups, each of which has an effect of folding a main chain.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: December 1, 2015
    Assignee: KANEKA CORPORATION
    Inventors: Mitsuru Nakamura, Shusuke Yoshihara
  • Patent number: 8946335
    Abstract: A thermoplastic resin composition according to the present invention contains an inorganic filler and a thermoplastic resin whose main chain contains a repeating unit represented by the general formula (1): -M-Sp- . . . ??(1) wherein M represents a mesogenic group; and Sp represents a spacer.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: February 3, 2015
    Assignee: Kaneka Corporation
    Inventors: Shusuke Yoshihara, Kazuaki Matsumoto
  • Publication number: 20150025188
    Abstract: A resin composition includes (A) a thermally-conductive organic additive including a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1): -M-Sp-??(1) where M represents a mesogenic group and Sp represents a spacer, (B) a thermosetting resin; and (C) an inorganic filler.
    Type: Application
    Filed: October 6, 2014
    Publication date: January 22, 2015
    Applicant: KANEKA CORPORATION
    Inventors: Shusuke Yoshihara, Kazuaki Matsumoto
  • Publication number: 20150014603
    Abstract: A resin molded article of the present invention includes at least a resin and an inorganic filler that is in a plate form, a spheroidal form, or a fiber form, in a region of 50% or more of a volume of the resin molded article, the resin having resin molecular chains oriented in a thickness direction of the resin molded article and the inorganic filler having a long axis oriented in an in-plane direction of the resin molded article, the resin molecular chains having an orientation degree ? in a range of 0.6 or more and less than 1.0, the orientation degree being calculated by the following Formula (1), from a half-value width W obtained by wide-angle X-ray scattering measurement: orientation degree ?=(360°??W)/360°??(1), wherein W is a half-value width of a scattering peak between the resin molecular chains, in an intensity distribution in directions of azimuth angles in a range of 0° to 360° in the wide-angle X-ray scattering measurement.
    Type: Application
    Filed: March 1, 2013
    Publication date: January 15, 2015
    Inventors: Shusuke Yoshihara, Toshiaki Ezaki, Mitsuru Nakamura
  • Patent number: 8921507
    Abstract: Provided is a thermoplastic resin which (A) remarkably improves thermal conductivity of a resin composition when a thermally conductive filler is added and (B) can be injection-molded even by use of a general injection-molding die. The thermoplastic resin is a resin wherein: a main chain which mainly has a specific repeating unit; and 60 mol % or more ends of molecular chains are carboxyl groups.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: December 30, 2014
    Assignee: Kaneka Corporation
    Inventors: Shusuke Yoshihara, Toshiaki Ezaki, Kazuaki Matsumoto