Patents by Inventor Shuta ISEKI

Shuta ISEKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154318
    Abstract: A structure contains a first member formed from a thermoplastic resin composition A and a second member formed from a thermoplastic resin composition B, the first member and the second member being joined at least partially, wherein the thermoplastic resin composition A molded into a molding with a thickness of 2 mm has a transmittance of 70.0% or more at a frequency of 76.5 GHz; the thermoplastic resin composition B molded into a molding with a thickness of 2 mm has a transmittance of less than 50.0% at a frequency of 76.5 GHz; and the thermoplastic resin composition B molded into a molding with a thickness of 2 mm has an absorbance of 40.0% or more at a frequency of 76.
    Type: Application
    Filed: December 14, 2023
    Publication date: May 9, 2024
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Shuta ISEKI, Hidekazu SHOJI
  • Publication number: 20240026073
    Abstract: To provide a resin composition and a molded article. The resin composition contains a thermoplastic resin and an electrically conductive substance, wherein the resin composition formed into a molded article with a size of 100 mm×100 mm×t mm thick, provided that t is a value in a case where Concentration C (mass %) of an electrically conductive substance in the resin composition×Thickness t (mm) gives a value of 1.2 or more, has a ? absorptance of 20.0% or less, which is a difference between a maximum value and a minimum value of the absorptance in the frequency range of 28.0 GHz to 40.0 GHz; and has the absorptance of 35.0% or more at a frequency of 28.
    Type: Application
    Filed: September 28, 2023
    Publication date: January 25, 2024
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Shuta ISEKI, Hidekazu SHOJI
  • Publication number: 20230340252
    Abstract: A resin composition for electromagnetic wave absorber may have large absorbance of electromagnetic wave, small transmittance and reflectance of electromagnetic wave, and small variation of reflectance depending on frequency of electromagnetic wave. An electromagnetic wave absorber may use such a composition. The resin composition may contain 0.1 to 10.0 parts by mass of an electromagnetic wave absorbing material, per 100 parts by mass of a thermoplastic resin, demonstrating an absorbance at 76.5 GHz frequency of 40.0 to 100%, when formed to a size of 150 mm×150 mm×2 mm thick and determined by Equation (A); demonstrating a difference between the maximum and minimum value of reflectance in the range from 70 GHz to 80 GHz frequency of 20.0% or smaller, when formed to a size of 150 mm×150 mm×2 mm thick and determined by Equation (B); and being suited for use as an electromagnetic wave absorber.
    Type: Application
    Filed: June 16, 2021
    Publication date: October 26, 2023
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Shuta ISEKI, Hidekazui SHOJI
  • Publication number: 20230323111
    Abstract: A resin composition, a formed article, and, an electromagnetic wave absorber, may each have large electromagnetic wave absorbance. The resin composition may contain: a thermoplastic resin; and an electro-conductive substance, the resin composition, when formed to a 2 mm thick test specimen and a cross section thereof is observed under a digital microscope, giving an aggregate attributable to the electro-conductive substance, with an area percentage of the aggregate, having an equivalent circle diameter of 30 µm or larger, of 0.80% or smaller.
    Type: Application
    Filed: February 24, 2022
    Publication date: October 12, 2023
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Shuta ISEKI, Hidekazu SHOJI, Satomi KITAGAWA
  • Publication number: 20230250276
    Abstract: A resin composition including a thermoplastic resin and a carbon nanotube. The resin composition has a dielectric constant at 76.5 GHz frequency of 4.50 or larger. A method for producing the resin composition, the method including, melt-kneading the thermoplastic resin, and a masterbatch of the carbon nanotube in the thermoplastic resin.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 10, 2023
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Shuta ISEKI, Hidekazu SHOJI
  • Publication number: 20230242747
    Abstract: A resin composition containing, per 100 parts by mass of a thermoplastic resin, 0.1 to 10.0 parts by mass of a carbon nanotube, and 10 to 100 parts by mass of a glass fiber, with a mass proportion of the carbon nanotube and the glass fiber (carbon nanotube/glass fiber) being 0.01 to 0.30.
    Type: Application
    Filed: June 16, 2021
    Publication date: August 3, 2023
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Shuta ISEKI, Hidekazu SHOJI