Patents by Inventor Shuta KITADE

Shuta KITADE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12660505
    Abstract: [Object] To provide a technology such as a piezoelectric coil having higher energy conversion efficiency. [Solving Means] A piezoelectric coil according to the present technology includes a coil-like core material and a plurality of band-like piezoelectric materials. The plurality of piezoelectric materials is helically wound around the core material so as to be alternately arranged along the core material.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: June 16, 2026
    Assignee: SONY GROUP CORPORATION
    Inventors: Shuta Kitade, Toru Udaka, Yuichi Ishida, Nobuyuki Nagai, Miki Endo
  • Publication number: 20240288284
    Abstract: [Object] To provide a technology relating to a piezoelectric coil or the like capable of performing displacement sensing. [Solving Means] A piezoelectric coil with a sensor according to the present technology includes: a piezoelectric coil; and a sensor. The piezoelectric coil includes a coil-shaped core and one or more first piezoelectric members that are helical relative to the core, and is expandable and contractable in an expanding/contracting direction. The sensor detects a displacement due to expansion and contraction of the piezoelectric coil.
    Type: Application
    Filed: March 24, 2022
    Publication date: August 29, 2024
    Inventors: Nobuyuki NAGAI, Shuta KITADE, Toru UDAKA, Miki ENDO, Yuichi ISHIDA
  • Publication number: 20230225214
    Abstract: [Object] To provide a technology such as a piezoelectric coil having higher energy conversion efficiency. [Solving Means] A piezoelectric coil according to the present technology includes a coil-like core material and a plurality of band-like piezoelectric materials. The plurality of piezoelectric materials is helically wound around the core material so as to be alternately arranged along the core material.
    Type: Application
    Filed: April 8, 2021
    Publication date: July 13, 2023
    Inventors: Shuta KITADE, Toru UDAKA, Yuichi ISHIDA, Nobuyuki NAGAI, Miki ENDO