Patents by Inventor Shuto Iwata

Shuto Iwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11019732
    Abstract: A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer and including first and second pads, a solder resist layer formed on the insulating layer, covering the conductor layer and exposing the first and second pads to form the second pad having diameter smaller than diameter of the first pad, a first bump formed on the first pad and including first base and top plating layers such that the first base layer has embedded portion in the resist layer and exposed portion and having diameter substantially equal to or smaller than diameter of the embedded portion, and a second bump formed on the second pad and including second base and top plating layers such that the second base layer has embedded portion in the resist layer and exposed portion and having diameter substantially equal to or smaller than diameter of the embedded portion.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: May 25, 2021
    Assignee: IBIDEN CO., LTD.
    Inventors: Yoji Sawada, Shuto Iwata
  • Publication number: 20210068265
    Abstract: A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer and including first and second pads, a solder resist layer formed on the insulating layer, covering the conductor layer and exposing the first and second pads to form the second pad having diameter smaller than diameter of the first pad, a first bump formed on the first pad and including first base and top plating layers such that the first base layer has embedded portion in the resist layer and exposed portion and having diameter substantially equal to or smaller than diameter of the embedded portion, and a second bump formed on the second pad and including second base and top plating layers such that the second base layer has embedded portion in the resist layer and exposed portion and having diameter substantially equal to or smaller than diameter of the embedded portion.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 4, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Yoji SAWADA, Shuto Iwata
  • Publication number: 20210068264
    Abstract: A method for manufacturing a printed wiring board includes forming a conductor layer including first and second pads on an insulating layer, forming a dry film resist layer on the insulating and conductor layers, forming first and second openings exposing the first and second pads, applying first metal plating to form first and second base plating layers on the first and second pads, applying second metal plating to form a first top plating layer of a first post and portion of a second top plating layer of a second bump post, applying the second metal plating further to form second portion of the second top layer of the second post, removing the dry film resist layer, forming a solder resist layer to cover the first and second posts, and thinning the solder resist layer over entire surface to position the first and second top layers outside the solder resist layer.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 4, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Yoji Sawada, Shuto Iwata