Patents by Inventor Shuto MORI

Shuto MORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220260908
    Abstract: A radiation-sensitive resin composition includes: a first polymer having a first structural unit which includes a phenolic hydroxyl group, and a second structural unit which includes an acid-labile group and a carboxy group which is protected by the acid-labile group; a second polymer having a third structural unit represented by the following formula (S-1), and a fourth structural unit which is a structural unit other than the third structural unit and is represented by the following formula (S-2); and a radiation-sensitive acid generator, wherein the acid-labile group includes a monocyclic or polycyclic ring structure having no fewer than 3 and no more than 20 ring atoms.
    Type: Application
    Filed: August 27, 2021
    Publication date: August 18, 2022
    Applicant: JSR CORPORATION
    Inventors: Tetsurou KANEKO, Hiromitsu NAKASHIMA, Yuushi MATSUMURA, Junya SUZUKI, Shuto MORI, Hiroyuki ISHII
  • Publication number: 20210389671
    Abstract: A radiation-sensitive resin composition includes: a first polymer having a first structural unit which includes a phenolic hydroxyl group, and a second structural unit which includes an acid-labile group and a carboxy group which is protected by the acid-labile group; a second polymer having a third structural unit represented by the following formula (S-1), and a fourth structural unit which is a structural unit other than the third structural unit and is represented by the following formula (S-2); and a radiation-sensitive acid generator, wherein the acid-labile group includes a monocyclic or polycyclic ring structure having no fewer than 3 and no more than 20 ring atoms.
    Type: Application
    Filed: August 27, 2021
    Publication date: December 16, 2021
    Applicant: JSR CORPORATION
    Inventors: Tetsurou KANEKO, Hiromitsu NAKASHIMA, Yuushi MATSUMURA, Junya SUZUKI, Shuto MORI, Hiroyuki ISHII
  • Publication number: 20210364918
    Abstract: A radiation-sensitive resin composition contains a resin including a structural unit having a phenolic hydroxyl group; and a compound represented by formula (1). In the formula (1), Ar is a substituted or unsubstituted aromatic ring having 6 to 20 carbon atoms; n is an integer of 2 to 4; Z+ is a monovalent onium cation; a plurality of Ys are each independently a polar group; and at least one of the plurality of Ys is an —OH group or an —SH group bonded to a carbon atom adjacent to a carbon atom to which a COO? group is bonded.
    Type: Application
    Filed: August 3, 2021
    Publication date: November 25, 2021
    Applicant: JSR CORPORATION
    Inventors: Katsuaki Nishikori, Shuto Mori, Junya Suzuki, Hiromitsu Nakashima
  • Publication number: 20190155162
    Abstract: A pattern-forming method comprises forming a prepattern that is insoluble or hardly soluble in an organic solvent. A first composition is applied on at least lateral faces of the prepattern to fort i a resin layer. Adjacent regions to the prepattern of the resin layer are insolubilized or desolubilized in the organic solvent without being accompanied by an increase in a molecular weight by heating the prepattern and the resin layer. Regions other than the adjacent regions insolubilized or desolubilized of the resin layer are removed with the organic solvent. The first composition comprises a first polymer having a solubility in the organic solvent to be decreased by an action of an acid. At least one selected from the following features (i) and (ii) is satisfied: (i) the first polymer comprises a basic group; and (ii) the first composition further comprises a basic compound.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Applicant: JSR CORPORATION
    Inventors: Kanako MEYA, Yusuke ANNO, Ken MARUYAMA, Shuto MORI
  • Patent number: 10216090
    Abstract: A pattern-forming method comprises forming a prepattern that is insoluble or hardly soluble in an organic solvent. A first composition is applied on at least lateral faces of the prepattern to form a resin layer. Adjacent regions to the prepattern of the resin layer are insolubilized or desolubilized in the organic solvent without being accompanied by an increase in a molecular weight by heating the prepattern and the resin layer. Regions other than the adjacent regions insolubilized or desolubilized of the resin layer are removed with the organic solvent. The first composition comprises a first polymer having a solubility in the organic solvent to be decreased by an action of an acid. At least one selected from the following features (i) and (ii) is satisfied: (i) the first polymer comprises a basic group; and (ii) the first composition further comprises a basic compound.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: February 26, 2019
    Assignee: JSR CORPORATION
    Inventors: Kanako Meya, Yusuke Anno, Ken Maruyama, Shuto Mori
  • Publication number: 20160291462
    Abstract: A pattern-forming method comprises forming a prepattern that is insoluble or hardly soluble in an organic solvent. A first composition is applied on at least lateral faces of the prepattern to form a resin layer. Adjacent regions to the prepattern of the resin layer are insolubilized or desolubilized in the organic solvent without being accompanied by an increase in a molecular weight by heating the prepattern and the resin layer. Regions other than the adjacent regions insolubilized or desolubilized of the resin layer are removed with the organic solvent. The first composition comprises a first polymer having a solubility in the organic solvent to be decreased by an action of an acid. At least one selected from the following features (i) and (ii) is satisfied: (i) the first polymer comprises a basic group; and (ii) the first composition further comprises a basic compound.
    Type: Application
    Filed: March 28, 2016
    Publication date: October 6, 2016
    Applicant: JSR CORPORATION
    Inventors: Kanako MEYA, Yusuke ANNO, Ken MARUYAMA, Shuto MORI