Patents by Inventor Shuugo Yokota
Shuugo Yokota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10508222Abstract: A polishing composition used in an application to polish silicon nitride is characterized by containing colloidal silica in which an organic acid, such as a sulfonic acid or a carboxylic acid, is immobilized, and having a pH of 6 or less.Type: GrantFiled: April 30, 2018Date of Patent: December 17, 2019Assignee: FUJIMI INCORPORATEDInventors: Takahiro Mizuno, Shuugo Yokota, Yasuyuki Yamato, Tomohiko Akatsuka
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Patent number: 10144907Abstract: The purpose of the present invention is to provide a means to sufficiently remove impurities remaining on the surface of a polishing object after CMP. The polishing composition of the present invention is a polishing composition which is used after polishing has been performed by using a polishing composition (A) including abrasive grains or an organic compound (A), and is characterized by including an organic compound (B) which includes at least one atom selected from the group consisting of a fluorine atom, an oxygen atom, a nitrogen atom, and a chlorine atom and has a molecular weight of 100 or more, a pH adjusting agent, and 0 to 1% by mass of abrasive grains.Type: GrantFiled: January 30, 2015Date of Patent: December 4, 2018Assignee: FUJIMI INCORPORATEDInventors: Shuugo Yokota, Shota Suzuki, Tomohiko Akatsuka, Yasuyuki Yamato, Koichi Sakabe, Yoshihiro Izawa, Yukinobu Yoshizaki, Chiaki Saito
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Publication number: 20180244957Abstract: A polishing composition used in an application to polish silicon nitride is characterized by containing colloidal silica in which an organic acid, such as a sulfonic acid or a carboxylic acid, is immobilized, and having a pH of 6 or less.Type: ApplicationFiled: April 30, 2018Publication date: August 30, 2018Applicant: FUJIMI INCORPORATEDInventors: Takahiro MIZUNO, Shuugo YOKOTA, Yasuyuki YAMATO, Tomohiko AKATSUKA
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Patent number: 9837283Abstract: Provided is a polishing composition which exhibits favorable storage stability and polishes a polishing object poor in chemical reactivity at a high speed. The invention is a polishing composition which contains silica having an organic acid immobilized on a surface thereof, a dihydric alcohol having a molecular weight of less than 20,000 and a pH adjusting agent, the polishing composition having a pH of 6 or less.Type: GrantFiled: October 25, 2013Date of Patent: December 5, 2017Assignee: FUJIMI INCORPORATEDInventors: Shuugo Yokota, Koichi Sakabe
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Patent number: 9834703Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a group III-V compound material. The polishing composition contains abrasive grains, an oxidizing agent, and a water-soluble polymer. When the polishing composition is left to stand for one day in an environment with a temperature of 25° C., the water-soluble polymer may be adsorbed on the abrasive grains at 5,000 or more molecules per 1 ?m2 of the surface area of the abrasive grains. Alternatively, the water-soluble polymer may be a compound that reduces the water contact angle of the portion containing a group III-V compound material of the object after being polished with the polishing composition.Type: GrantFiled: November 21, 2012Date of Patent: December 5, 2017Assignee: FUJIMI INCORPORATEDInventors: Shuugo Yokota, Yasuyuki Yamato, Satoru Yarita, Tomohiko Akatsuka
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Patent number: 9816010Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises an oxidizing agent and abrasive grains having an average primary particle diameter of 40 nm or less. The polishing composition preferably further contains a hydrolysis-suppressing compound that bonds to a surface OH group of the portion containing a silicon material of the object to function to suppress hydrolysis of the portion containing a silicon material. Alternatively, a polishing composition of the present invention contains abrasive grains, an oxidizing agent, and a hydrolysis-suppressing compound. The polishing composition preferably has a neutral pH.Type: GrantFiled: June 11, 2015Date of Patent: November 14, 2017Assignee: FUJIMI INCORPORATEDInventors: Shuugo Yokota, Yasuyuki Yamato, Satoru Yarita, Tomohiko Akatsuka, Shuichi Tamada
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Patent number: 9688884Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises odd-shaped abrasive grains and an oxidizing agent having a standard electrode of 0.3 V or more, and preferably further contains a salt, such as an ammonium salt. The pH of the polishing composition is 1 or more and 6 or less, or 8 or more and 14 or less. The average degree of association of the abrasive grains, obtained by dividing the value of the average secondary particle diameter of the abrasive grains by the value of the average primary particle diameter of the abrasive grains, is preferably 1.6 or more.Type: GrantFiled: November 21, 2012Date of Patent: June 27, 2017Assignee: FUJIMI INCORPORATEDInventors: Shuugo Yokota, Yasuyuki Yamato, Satoru Yarita, Tomohiko Akatsuka, Shuichi Tamada
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Publication number: 20170175053Abstract: The purpose of the present invention is to provide a means to sufficiently remove impurities remaining on the surface of a polishing object after CMP. The polishing composition of the present invention is a polishing composition which is used after polishing has been performed by using a polishing composition (A) including abrasive grains or an organic compound (A), and is characterized by including an organic compound (B) which includes at least one atom selected from the group consisting of a fluorine atom, an oxygen atom, a nitrogen atom, and a chlorine atom and has a molecular weight of 100 or more, a pH adjusting agent, and 0 to 1% by mass of abrasive grains.Type: ApplicationFiled: January 30, 2015Publication date: June 22, 2017Applicant: FUJIMI INCORPORATEDInventors: SHUUGO YOKOTA, Shota SUZUKI, Tomohiko AKATSUKA, Yasuyuki YAMATO, Koichi SAKABE, Yoshihiro IZAWA, Yukinobu YOSHIZAKI, Chiaki SAITO
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Publication number: 20160293436Abstract: Provided is a polishing composition which exhibits favorable storage stability and polishes a polishing object poor in chemical reactivity at a high speed. The invention is a polishing composition which contains silica having an organic acid immobilized on a surface thereof, a dihydric alcohol having a molecular weight of less than 20,000 and a pH adjusting agent, the polishing composition having a pH of 6 or less.Type: ApplicationFiled: October 25, 2013Publication date: October 6, 2016Applicant: FUJIMI INCORPORATEDInventors: Shuugo YOKOTA, Koichi SAKABE
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Publication number: 20160203994Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a group III-V compound material. The polishing composition contains an oxidizing agent and an anticorrosive agent. The anticorrosive agent is preferably a nitrogen-containing organic compound, such as 1H-1,2,4-triazole and benzotriazole, or an organic compound having a carboxyl group, for example, dicarboxylic acid, such as malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, maleic acid, phthalic acid, malic acid, and tartaric acid, or tricarboxylic acid, such as citric acid.Type: ApplicationFiled: March 22, 2016Publication date: July 14, 2016Applicant: FUJIMI INCORPORATEDInventors: Shuugo YOKOTA, Yasuyuki YAMATO, Satoru YARITA, Tomohiko AKATSUKA
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Patent number: 9238755Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises an oxidizing agent and abrasive grains having an average primary particle diameter of 40 nm or less. The polishing composition preferably further contains a hydrolysis-suppressing compound that bonds to a surface OH group of the portion containing a silicon material of the object to function to suppress hydrolysis of the portion containing a silicon material. Alternatively, a polishing composition of the present invention contains abrasive grains, an oxidizing agent, and a hydrolysis-suppressing compound. The polishing composition preferably has a neutral pH.Type: GrantFiled: November 21, 2012Date of Patent: January 19, 2016Assignee: FUJIMA INCORPORATEDInventors: Shuugo Yokota, Yasuyuki Yamato, Satoru Yarita, Tomohiko Akatsuka, Shuichi Tamada
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Publication number: 20150287609Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises an oxidizing agent and abrasive grains having an average primary particle diameter of 40 nm or less. The polishing composition preferably further contains a hydrolysis-suppressing compound that bonds to a surface OH group of the portion containing a silicon material of the object to function to suppress hydrolysis of the portion containing a silicon material. Alternatively, a polishing composition of the present invention contains abrasive grains, an oxidizing agent, and a hydrolysis-suppressing compound. The polishing composition preferably has a neutral pH.Type: ApplicationFiled: June 11, 2015Publication date: October 8, 2015Applicant: FUJIMI INCORPORATEDInventors: Shuugo YOKOTA, Yasuyuki YAMATO, Satoru YARITA, Tomohiko AKATSUKA, Shuichi TAMADA
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Publication number: 20140349484Abstract: A polishing composition of the present invention is to be used for polishing an object including a metal portion or an interlayer insulation film. The polishing composition contains silica on which an organic acid, such as a sulfonic acid and a carboxylic acid, is immobilized and an oxidizing agent.Type: ApplicationFiled: December 25, 2012Publication date: November 27, 2014Inventors: Shuugo Yokota, Yoshihiro Kachi, Tomoiko Akatsuka
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Publication number: 20140342561Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a group III-V compound material. The polishing composition contains abrasive grains, an oxidizing agent, and a water-soluble polymer. When the polishing composition is left to stand for one day in an environment with a temperature of 25° C., the water-soluble polymer may be adsorbed on the abrasive grains at 5,000 or more molecules per 1 ?m2 of the surface area of the abrasive grains. Alternatively, the water-soluble polymer may be a compound that reduces the water contact angle of the portion containing a group III-V compound material of the object after being polished with the polishing composition.Type: ApplicationFiled: November 21, 2012Publication date: November 20, 2014Inventors: Shuugo Yokota, Yasuyuki Yamato, Satoru Yarita, Tomohiko Akatsuka
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Publication number: 20140342560Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a group III-V compound material. The polishing composition contains an oxidizing agent and an anticorrosive agent. The anticorrosive agent is preferably a nitrogen-containing organic compound, such as 1H-1,2,4-triazole and benzotriazole, or an organic compound having a carboxyl group, for example, dicarboxylic acid, such as malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, maleic acid, phthalic acid, malic acid, and tartaric acid, or tricarboxylic acid, such as citric acid.Type: ApplicationFiled: November 21, 2012Publication date: November 20, 2014Inventors: Shuugo Yokota, Yasuyuki Yamato, Satoru Yarita, Tomohiko Akatsuka
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Publication number: 20140342562Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises odd-shaped abrasive grains and an oxidizing agent having a standard electrode of 0.3 V or more, and preferably further contains a salt, such as an ammonium salt. The pH of the polishing composition is 1 or more and 6 or less, or 8 or more and 14 or less. The average degree of association of the abrasive grains, obtained by dividing the value of the average secondary particle diameter of the abrasive grains by the value of the average primary particle diameter of the abrasive grains, is preferably 1.6 or more.Type: ApplicationFiled: November 21, 2012Publication date: November 20, 2014Inventors: Shuugo Yokota, Yasuyuki Yamato, Satoru Yarita, Tomohiko Akatsuka, Shuichi Tamada
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Publication number: 20140322913Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises an oxidizing agent and abrasive grains having an average primary particle diameter of 40 nm or less. The polishing composition preferably further contains a hydrolysis-suppressing compound that bonds to a surface OH group of the portion containing a silicon material of the object to function to suppress hydrolysis of the portion containing a silicon material. Alternatively, a polishing composition of the present invention contains abrasive grains, an oxidizing agent, and a hydrolysis-suppressing compound. The polishing composition preferably has a neutral pH.Type: ApplicationFiled: November 21, 2012Publication date: October 30, 2014Inventors: Shuugo Yokota, Yasuyuki Yamato, Satoru Yarita, Tomohiko Akatsuka, Shuichi Tamada
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Publication number: 20130146804Abstract: A polishing composition used in an application to polish silicon nitride is characterized by containing colloidal silica in which an organic acid, such as a sulfonic acid or a carboxylic acid, is immobilized, and having a pH of 6 or less.Type: ApplicationFiled: August 10, 2011Publication date: June 13, 2013Inventors: Takahiro Mizuno, Shuugo Yokota, Yasuyuki Yamato, Tomohiko Akatsuka