Patents by Inventor Shuuhei Fujita

Shuuhei Fujita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9480191
    Abstract: An electronic apparatus includes: a casing; a conductive film disposed on an inner surface of the casing, the conductive film having a recess in a surface thereof; a circuit board accommodated in the casing; a semiconductor device disposed on the circuit board; and a conductive frame fixed around the semiconductor device on the circuit board, the conductive frame being fitted in the recess.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: October 25, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Yasushi Yui, Shuuhei Fujita, Shinichirou Okamoto, Shinichirou Kouno, Masaru Sugie
  • Publication number: 20140078698
    Abstract: An electronic apparatus includes: a casing; a conductive film disposed on an inner surface of the casing, the conductive film having a recess in a surface thereof; a circuit board accommodated in the casing; a semiconductor device disposed on the circuit board; and a conductive frame fixed around the semiconductor device on the circuit board, the conductive frame being fitted in the recess.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 20, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Yasushi YUI, Shuuhei FUJITA, Shinichirou OKAMOTO, Shinichirou KOUNO, Masaru SUGIE
  • Patent number: 6572409
    Abstract: A connector element has a plurality of contacts (23) arranged in first and second directions (A1, A2) perpendicular to each other on a predetermined plane to form a matrix. A plurality of ground members (25) extend substantially in parallel to one another in an oblique direction inclined with respect to the first and the second direction on the predetermined plane. At least one of the contacts is positioned between adjacent ones of the ground members.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: June 3, 2003
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Kunihiro Nitta, Shuuhei Fujita, Hidenao Nakajima
  • Publication number: 20020086582
    Abstract: A connector element has a plurality of contacts (23) arranged in first and second directions (A1, A2) perpendicular to each other on a predetermined plane to form a matrix. A plurality of ground members (25) extend substantially in parallel to one another in an oblique direction inclined with respect to the first and the second direction on the predetermined plane. At least one of the contacts is positioned between adjacent ones of the ground members.
    Type: Application
    Filed: December 20, 2001
    Publication date: July 4, 2002
    Inventors: Kunihiro Nitta, Shuuhei Fujita, Hidenao Nakajima
  • Patent number: 6388879
    Abstract: A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: May 14, 2002
    Assignee: Fujitsu Limited
    Inventors: Hiroyuki Otaguro, Takayuki Ashida, Hitoshi Yokemura, Hidenao Nakajima, Yoshimi Watanabe, Shuuhei Fujita