Abstract: Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.

Abstract: A partially crosslinked adhesive-supported porous film for battery separator, which in producing a battery, can effectively produce a battery as an electrode/separator laminate in which an electrode and a separator are temporarily bonded to each other without causing mutual slip movement between the electrode and the separator and which after producing a battery, functions itself as a separator having a small heat shrinkage factor even at high temperatures, and a process of producing a battery using such a partially crosslinked adhesive-supported porous film.

Abstract: A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH2?CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), acrylic ester B represented by CH2?CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond where the ratios of components are 40-10 mol % of the acrylic ester B with respect to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer with respect to 100 mol % of the total of the acrylic ester A and the acrylic ester B, and 70-90 mol % isocyanate compound with respect to 100 mol % of the monomer containing a hydroxl group.

Abstract: A partially crosslinked adhesive-supported porous film for battery separator, which in producing a battery, can effectively produce a battery as an electrode/separator laminate in which an electrode and a separator are temporarily bonded to each other without causing mutual slip movement between the electrode and the separator and which after producing a battery, functions itself as a separator having a small heat shrinkage factor even at high temperatures, and a process of producing a battery using such a partially crosslinked adhesive-supported porous film.

Abstract: Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.

Abstract: The present invention provides an adhesive film with a dicing sheet having a pressure-sensitive adhesive layer on a base material and also having a peelable adhesive film on the pressure-sensitive adhesive layer, that has an excellent peeling property when peeling a semiconductor chip obtained by dicing and an adhesive film attached thereto together without impairing the holding power even during dicing a thin semiconductor wafer, and a method of manufacturing the same. The adhesive film with a dicing sheet of the present invention is formed by sequentially laminating a pressure-sensitive adhesive layer and an adhesive layer on a base material, in which the intensity of an Si—K? ray on at least one region on a surface of the pressure-sensitive adhesive layer to be pasted onto the adhesive layer is 0.01 to 100 kcps.

Abstract: A dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the dicing film, wherein the pressure-sensitive adhesive layer contains a polymer obtained by the addition reaction of an acrylic polymer containing 10 to 40 mol % of a hydroxyl group-containing monomer with 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and 2 to 20 parts by weight of a crosslinking agent including in the molecule two or more functional groups having reactivity with a hydroxyl group based on 100 parts by weight of the polymer, and the pressure-sensitive adhesive layer is also cured by irradiation with ultraviolet rays under predetermined conditions, and wherein the die-bonding film comprises an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.

Abstract: The present invention provides a dicing die-bonding film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the pressure-sensitive adhesive layer. A dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the dicing film, wherein the pressure-sensitive adhesive layer contains a polymer that is obtained by the addition-reaction of an acrylic polymer containing 10 to 30 mol % of a hydroxyl group-containing monomer with 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and also contains 2 to 20 parts by weight of a crosslinking agent containing two or more functional groups having reactivity with a hydroxyl group in the molecule based on 100 parts by weight of the polymer, and the die-bonding film comprises an epoxy resin.

Abstract: A dicing die-bonding film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film on the pressure-sensitive adhesive layer, which, even if the semiconductor wafer is thin, is excellent in balance between holding strength of the semiconductor wafer during dicing and peeling property of its semiconductor chip obtained by dicing upon being peeled together with the die-bonding film. A dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer comprising an acrylic acid ester as a main monomer, 10 to 30 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and the die-bonding film comprises an epoxy resin.

Abstract: The present invention relates to a dicing die-bonding film comprising: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is an active energy ray-curable heat-expandable pressure-sensitive adhesive layer containing a foaming agent, and in which the die-bonding film is constituted by a resin composition containing an epoxy resin. Moreover, the present invention provides a process for producing a semiconductor device which includes using the above-described dicing die-bonding film.

Abstract: The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film has a laminated structure of a heat-expandable pressure-sensitive adhesive layer containing a foaming agent and an active energy ray-curable antifouling pressure-sensitive adhesive layer, which are laminated on the base material in this order, and in which the die-bonding film is constituted by a resin composition containing an epoxy resin. Moreover, the present invention provides a process for producing a semiconductor device which includes using the above-described dicing die-bonding film.

Abstract: The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer of the dicing film is a heat-expandable pressure-sensitive adhesive layer formed of a heat-expandable pressure-sensitive adhesive containing an acrylic polymer A and a foaming agent. The acrylic polymer A is an acrylic polymer composed of a monomer composition containing 50% by weight or more of an acrylic acid ester represented by CH2?CHCOOR (wherein R is an alkyl group having 6 to 10 carbon atoms) and 1% by weight to 30% by weight of a hydroxyl group-containing monomer and containing no carboxyl group-containing monomer. The heat-expandable pressure-sensitive adhesive layer has a surface free energy of 30 mJ/m2 or less. The die-bonding film is constituted by a resin composition containing an epoxy resin.

Abstract: A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH2?CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), acrylic ester B represented by CH2?CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond, where the ratios of components are 40-10 mol % of the acrylic ester B with respect to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer with respect to 100 mol % of the total of the acrylic ester A and the acrylic ester B, and 70-90 mol % isocyanate compound with respect to 100 mol % of the monomer containing a hydroxl group.

Abstract: A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising an acrylic ester A represented by CH2?CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), an acrylic ester B represented by CH2?CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond, where the ratios of components are 40-10 mol % of the acrylic ester B to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer to 100 mol % of the total of the acrylic ester A and the acrylic ester B, 70-90 mol % isocyanate compound to 100 mol % of the hydroxyl group-containing monomer, and the die-bonding film is formed from an epoxy resin.

Abstract: The present invention is a dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on an ultraviolet-ray transmitting base and a die-bonding film provided on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is formed by laminating the die-bonding film onto a pressure-sensitive adhesive layer precursor formed from an acrylic polymer comprising an acrylic ester as a main monomer, a hydroxyl group-containing monomer at a ratio in the range of 10 to 40 mol % with respect to 100 mol % of the acrylic ester, and an isocyanate compound having a radical reactive carbon-carbon double bond within a molecular at a ratio in the range of 70 to 90 mol % with respect to 100 mol % of the hydroxyl group-containing monomer, and then curing by irradiating with an ultraviolet ray from the base side, and the die-bonding film is formed from an epoxy resin.

Abstract: A dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic pressure-sensitive adhesive comprising an acrylic polymer which comprises an acrylic ester, a hydroxyl group-containing monomer where a ratio is in a range of 10-40 mol % to 100 mol % of the acrylic ester, an isocyanate compound having a radical reactive carbon-carbon double bond where a ratio is in a range of 70-90 mol % to 100 mol % of the hydroxyl group-containing monomer, and a compound having two or more radical reactive carbon-carbon double bonds where a ratio is in a range of 10-60 parts by weight to 100 parts by weight of the acrylic polymer, and the die-bonding film is formed from an epoxy resin and is laminated on the pressure-sensitive adhesive layer.

Abstract: The present invention provides a dicing die-bonding film including a dicing film having a pressure sensitive adhesive layer provided on a base material and a die-bonding film provided on the pressure sensitive adhesive layer, and having excellent storage stability of a product even at room temperature. The dicing die-bonding film in the present invention is a dicing die-bonding film having a dicing film including a radiation curable pressure sensitive adhesive layer provided onto a base material and a die-bonding film provided on the pressure sensitive adhesive layer, in which a pressure sensitive adhesive in the pressure sensitive adhesive layer is constituted by containing an acryl polymer, and in which the acid value of the acryl polymer is in a range of 0.01 to 1 and the iodine value is in a range of 5 to 10.

Abstract: A uniform gel electrolyte having high durability and use thereof, in particular, batteries or capacitors using such a gel electrolyte. The gel electrolyte includes a gel composition containing an electrolyte salt, a solvent for the electrolyte salt, and a polymer matrix, wherein the polymer matrix comprises a crosslinked polymer prepared by polymerizing a bifunctional (meth)acrylate represented by the following formula (I): wherein R represents a divalent organic group, and R1 represents a hydrogen atom or a methyl group.

Abstract: An adhesive composition-supporting separator for a battery includes a porous substrate supporting thereon a thermally cross-linkable adhesive composition comprising a multi-functional isocyanate and a reactive polymer having a functional group capable of reacting with an isocyanato group of the multi-functional isocyanate; an electrode/separator laminate is obtained by contact pressing the adhesive composition-supporting separator for a battery against electrodes; and an electrode/separator bonded material having a cross-linked adhesive composition is obtained by heating the electrode/separator laminate to thereby react the multifunctional isocyanate with the reactive polymer for causing cross-linking.

Abstract: A uniform gel electrolyte having high durability and use thereof, in particular, batteries or capacitors using such a gel electrolyte. The gel electrolyte includes a gel composition containing an electrolyte salt, a solvent for the electrolyte salt, and a polymer matrix, wherein the polymer matrix comprises a crosslinked polymer prepared by polymerizing a bifunctional (meth)acrylate represented by the following formula (I): wherein R represents a divalent organic group, and R1 represents a hydrogen atom or a methyl group.