Patents by Inventor Shuuji Ishiwata

Shuuji Ishiwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoplastic resin composition, method for producing thermoplastic resin composition, and molded body
    Patent number: 11279808
    Abstract: Provided is a thermoplastic resin composition which provides a molded body having excellent thermal conductivity and excellent mechanical characteristics. A thermoplastic resin composition which contains (A) a thermoplastic resin, (B) pitch carbon fibers and (C) graphite, and wherein: the content of the graphite (C) is from 1% by mass to 20% by mass (inclusive) relative to 100% by mass of the thermoplastic resin composition; and a molded body, which is obtained by molding this thermoplastic resin composition and has a thickness of 1 mm, has a thermal conductivity of 10 W/mK or more as determined by a hot wire method.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: March 22, 2022
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Osamu Okunaka, Hiroki Ishii, Kazuaki Itou, Shuuji Ishiwata
  • THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION, AND MOLDED BODY
    Publication number: 20180223054
    Abstract: Provided is a thermoplastic resin composition which provides a molded body having excellent thermal conductivity and excellent mechanical characteristics. A thermoplastic resin composition which contains (A) a thermoplastic resin, (B) pitch carbon fibers and (C) graphite, and wherein: the content of the graphite (C) is from 1% by mass to 20% by mass (inclusive) relative to 100% by mass of the thermoplastic resin composition; and a molded body, which is obtained by molding this thermoplastic resin composition and has a thickness of 1 mm, has a thermal conductivity of 10 W/mK or more as determined by a hot wire method.
    Type: Application
    Filed: April 2, 2018
    Publication date: August 9, 2018
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Osamu Okunaka, Hiroki Ishii, Kazuaki Itou, Shuuji Ishiwata