Abstract: The invention provides a metal substrate and a light source device ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, such that heat generated in the mounted semiconductor chip can be efficiently dissipated through a metal plate. The metal substrate includes a heat dissipating metal plate made of a metal except for Au, an insulating resin-made white film stacked on a part of the heat dissipating metal plate, and a light source mounting surface-forming layer stacked on another part of the heat dissipating metal plate. The metal substrate is such that the light source mounting surface-forming layer is a metal layer directly contacting the heat dissipating metal plate, and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.

Abstract: The invention provides a metal substrate and a light source device ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, such that heat generated in the mounted semiconductor chip can be efficiently dissipated through a metal plate. The metal substrate includes a heat dissipating metal plate made of a metal except for Au, an insulating resin-made white film stacked on a part of the heat dissipating metal plate, and a light source mounting surface-forming layer stacked on another part of the heat dissipating metal plate. The metal substrate is such that the light source mounting surface-forming layer is a metal layer directly contacting the heat dissipating metal plate, and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.

Abstract: The present invention provides a white film comprising a thermoplastic resin composition containing 25-100 parts by mass of an inorganic filler based on 100 parts by mass of a thermoplastic resin, wherein the average reflectance at a wavelength of 400-800 nm is 70% or more, the average linear expansion coefficient in the machine direction and the transverse direction is 35×10?6/° C. or less, and the decreasing rate in reflectance at a wavelength of 470 nm after thermal treatment at 200° C. for 4 hours is 10% or less; and the invention provides a metal laminated body. These exhibit high thermal resistance, high reflectance within visual light range, and small decrease in reflectance under a high heat load environment, but also be applicable for a large sized printed circuit boards for mounting LEDs.

Abstract: A communication system capable of employing polarization-dependent phase modulators with a reversing configuration that preserves security against disturbance of a polarization state at a transmission path but without using Faraday mirrors and a communication method using the same are provided. A quantum cryptography system of the present invention includes a first station 1, a transmission path 2, and a second station 3. The first station 1 has means for emitting time-divided optical pulses into the transmission path 2 and measuring a phase difference between the optical pulses returning from the transmission path 2. The transmission path 2 is a medium of light.

Abstract: The present invention provides a white film comprising a thermoplastic resin composition containing 25-100 parts by mass of an inorganic filler based on 100 parts by mass of a thermoplastic resin, wherein the average reflectance at a wavelength of 400-800 nm is 70% or more, the average linear expansion coefficient in the machine direction and the transverse direction is 35×10?6/° C. or less, and the decreasing rate in reflectance at a wavelength of 470 nm after thermal treatment at 200° C. for 4 hours is 10% or less; and the invention provides a metal laminated body. These exhibit high thermal resistance, high reflectance within visual light range, and small decrease in reflectance under a high heat load environment, but also be applicable for a large sized printed circuit boards for mounting LEDs.

Abstract: There is provided a visible light control apparatus including: a modulation unit (corresponding to a PPM signal generation circuit, a subcarrier generation circuit, and a first AND circuit) that modulates a subcarrier and thereby generates a modulated signal; a visible light control unit (corresponding to a driving circuit) that controls blinking of visible light which contains information based on the modulated signal modulated by the modulation unit and allows the visible light to be emitted at a predetermined emission time ratio; and an emission time ratio control unit (corresponding to a dimming signal generation circuit, an inverting circuit, a second AND circuit, and an OR circuit) that changes the predetermined emission time ratio and allows the visible light to be emitted at the changed emission time ratio.

Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring. can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.

Abstract: A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.

Abstract: A communication system capable of employing polarization-dependent phase modulators with a reversing configuration that preserves security against disturbance of a polarization state at a transmission path but without using Faraday mirrors and a communication method using the same are provided. A quantum cryptography system of the present invention includes a first station 1, a transmission path 2, and a second station 3. The first station 1 has means for emitting time-divided optical pulses into the transmission path 2 and measuring a phase difference between the optical pulses returning from the transmission path 2. The transmission path 2 is a medium of light.

Abstract: There is provided a visible light control apparatus including: a modulation unit (corresponding to a PPM signal generation circuit, a subcarrier generation circuit, and a first AND circuit) that modulates a subcarrier and thereby generates a modulated signal; a visible light control unit (corresponding to a driving circuit) that controls blinking of visible light which contains information based on the modulated signal modulated by the modulation unit and allows the visible light to be emitted at a predetermined emission time ratio; and an emission time ratio control unit (corresponding to a dimming signal generation circuit, an inverting circuit, a second AND circuit, and an OR circuit) that changes the predetermined emission time ratio and allows the visible light to be emitted at the changed emission time ratio.

Abstract: The present invention provides a semiconductor device integrated multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, thereby enabling the production of high density, ultra small three dimensional mounting modules and the like, can also be ideally applied to low volume high mix manufacturing configurations, and has little impact on the environment, and also provides a method of manufacturing such a semiconductor device integrated multilayer wiring board. In the semiconductor device integrated multilayer wiring board, a wiring substrate is formed by embedding conductive wiring within an insulating substrate, formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.

Abstract: A visible light information providing device, a visible light information reader, a visible light information providing system, a visible light information providing method, a program thereof, and a computer-readable information storage medium for storing the program, enabling a user to recognize the area to which information is provided in a contactless manner. A visible light information providing device comprises a memory, an LED (Light Emitting Diode) for emitting visible light, a modulator circuit for modulating visible light emitted from the LED to transmit information stored in the memory, and a CPU (Central Processing Unit) for controlling the modulator circuit according to the type of information stored in the memory so that the LED emits a prescribed visible light pattern.

Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.

Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.

Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.

Abstract: The present invention provides a semiconductor device integrated multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, thereby enabling the production of high density, ultra small three dimensional mounting modules and the like, can also be ideally applied to low volume high mix manufacturing configurations, and has little impact on the environment, and also provides a method of manufacturing such a semiconductor device integrated multilayer wiring board. In the semiconductor device integrated multilayer wiring board, a wiring substrate is formed by embedding conductive wiring within an insulating substrate, formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.

Abstract: In method and apparatus for restarting, after occurrence of a fault, an online processing system based on a computer employing a virtual storage system comprised of a main storage and a first auxiliary storage, a second auxiliary storage is additionally provided, occupied/unoccupied status of slots on the first auxiliary storage is managed by an auxiliary storage management table of the main storage, data present in the main storage immediately after IPL is saved in a first area of the second auxiliary storage, data present in the main storage at the time of the occurrence of the fault is saved in a second area, and data occuring in the auxiliary storage management table at the time of the occurrence of the fault is saved in a third area.