Abstract: A method of fabricating a semiconductor device is disclosed. The method includes separating an interlayer dielectric (ILD) into a plurality of portions. The plurality of portions of ILD, separated from each other along a first lateral direction and a second lateral direction, overlay a plurality of groups of epitaxial regions, respectively. The method includes performing an etching process to expose the plurality of groups of epitaxial regions, wherein the etching process comprises a plurality of stages, each of the stages comprising a respective etchant. The method includes forming a plurality of conductive contacts electrically coupled to the plurality of epitaxial regions, respectively.

Abstract: A method of fabricating a semiconductor device is disclosed. The method includes separating an interlayer dielectric (ILD) into a plurality of portions. The plurality of portions of ILD, separated from each other along a first lateral direction and a second lateral direction, overlay a plurality of groups of epitaxial regions, respectively. The method includes performing an etching process to expose the plurality of groups of epitaxial regions, wherein the etching process comprises a plurality of stages, each of the stages comprising a respective etchant. The method includes forming a plurality of conductive contacts electrically coupled to the plurality of epitaxial regions, respectively.

Abstract: A method of fabricating a semiconductor device is disclosed. The method includes separating an interlayer dielectric (ILD) into a plurality of portions. The plurality of portions of ILD, separated from each other along a first lateral direction and a second lateral direction, overlay a plurality of groups of epitaxial regions, respectively. The method includes performing an etching process to expose the plurality of groups of epitaxial regions, wherein the etching process comprises a plurality of stages, each of the stages comprising a respective etchant. The method includes forming a plurality of conductive contacts electrically coupled to the plurality of epitaxial regions, respectively.

Abstract: The present invention provides a lubricating composition comprising an alginic acid or a salt or ester thereof, which is effective in reducing frictions in artificial joints and wear of artificial joint implants. Also provided is a method for lubricating artificial joints comprising administering said composition to a synovial cavity of a subject. In another aspect, the present invention provides use of an alginic acid or a salt or ester thereof in manufacturing a lubricating composition.

Abstract: The present invention provides a lubricating composition comprising an alginic acid or a salt or ester thereof, which is effective in reducing frictions in artificial joints and wear of artificial joint implants. Also provided is a method for lubricating artificial joints comprising administering said composition to a synovial cavity of a subject. In another aspect, the present invention provides use of an alginic acid or a salt or ester thereof in manufacturing a lubricating composition.

Abstract: A device for cutting a row of interconnected rectangular plate-shaped workpieces into a plurality of individual rectangular units, includes a machine bed, and a sliding member disposed slidably on the machine bed and movable along a straight path. A rectangular work seat is disposed rotatably on the sliding member, and is rotatable about a vertical axis on the sliding member. The work seat has four sides, a length and a width. A mounting frame is disposed around the work seat, and defines a rectangular hole therein, which has four sides that are respectively parallel to the four sides of the work seat, and a length and a width that are respectively and slightly larger than those of the work seat. An adhesive sheet has an adhesive top surface with an outer peripheral portion that is adhered to a bottom surface of the mounting frame. The interconnected workpieces are adhered to the top surface of the adhesive sheet so as to be cut while disposed inside the mounting frame.