Abstract: A computer-implemented method of determining parasitic capacitance for transistors within an integrated circuit can include determining a first set of coefficients for a first expression that calculates parasitic capacitance for a transistor structure according to a first plurality of parasitic capacitances derived from a plurality of two-dimensional transistor structures (320). The first set of coefficients can be inserted into the first expression (325). The method further can include determining a second set of coefficients for a second expression that calculates parasitic capacitance for a transistor structure according to a second plurality of parasitic capacitances derived from a plurality of three-dimensional transistor structures (345). The second expression can include the first expression (350). The method can include inserting the second set of coefficients into the second expression and outputting the second expression (355).

Abstract: A circuit for protecting a transistor during the manufacture of an integrated circuit device is disclosed. The circuit comprises a transistor having a gate formed over an active region formed in a die of the integrated circuit device; a protection element formed in the die of the integrated circuit device; and a programmable interconnect coupled between the gate of the transistor and the protection element, the programmable interconnect enabling the protection element to be decoupled from the transistor.

Abstract: An integrated circuit has a transistor with an active gate structure overlying an active diffusion area formed in a semiconductor substrate. A dummy gate structure is formed over a diffusion area and separated from the active gate structure by a selected distance (d2). A stress layer overlying the transistor array produces stress in a channel region of the transistor.

Abstract: A method of protecting a transistor formed on a die of an integrated circuit is disclosed. The method comprises forming an active region of the transistor on the die; forming a gate of the transistor over the active region; coupling a primary contact to the gate of the transistor; coupling a programmable element between the gate of the transistor and a protection element; and decoupling the protection element from the gate of the transistor by way of the programmable element. Circuits for protecting a transistor formed on a die of an integrated circuit are also disclosed.

Abstract: An integrated circuit (100) has a transistor with an active gate structure 108 overlying an active diffusion area 112 formed in a semiconductor substrate 126. A dummy gate structure 110 is formed over a diffusion area and separated from the active gate structure by a selected distance (d2). A stress layer (130) overlying the transistor array produces stress in a channel region (107) of the transistor.

Abstract: A method of protecting a transistor formed on a die of an integrated circuit is disclosed. The method comprises forming an active region of the transistor on the die; forming a gate of the transistor over the active region; coupling a primary contact to the gate of the transistor; coupling a programmable element between the gate of the transistor and a protection element; and decoupling the protection element from the gate of the transistor by way of the programmable element. Circuits for protecting a transistor formed on a die of an integrated circuit are also disclosed.