Patents by Inventor Shu Yi Li

Shu Yi Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948837
    Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ching-Fu Yeh, Chin-Lung Chung, Shu-Wei Li, Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee
  • Publication number: 20240088042
    Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 14, 2024
    Inventors: SHU-WEI LI, HAN-TANG HUNG, YU-CHEN CHAN, CHIEN-HSIN HO, SHIN-YI YANG, MING-HAN LEE, SHAU-LIN SHUE
  • Publication number: 20240071822
    Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Lung CHUNG, Shin-Yi YANG, Yu-Chen CHAN, Han-Tang HUNG, Shu-Wei LI, Ming-Han LEE
  • Publication number: 20190104857
    Abstract: A bedside lamp structure contains: a bed frame and two rotary arms. The bed frame includes a support rack, and the support rack has two threaded posts erected on two sides thereof individually. The two rotary arms are connected with the support rack, and each of the two rotary arms has a threaded orifice defined on a first end thereof so as to screw with each of the two threaded posts, and each rotary arm has a light emitting element mounted on a second end thereof. In use, each rotary arm is adjustably rotated to a desired angle. Each rotary arm is rotatably retracted back to an original position of the support rack, as not using the light emitting element. Thereby, the bedside lamp structure is simplified, operated easily, and used conveniently.
    Type: Application
    Filed: October 6, 2017
    Publication date: April 11, 2019
    Inventors: Sheng-Chi Chung, Shu-Yi Li
  • Publication number: 20120055897
    Abstract: A rack assembly includes a framework, and a foldable shelf mounted on the framework. The foldable shelf includes a support plate attached to the framework, an adjustable panel pivotally connected with the support plate, and a plurality of support legs pivotally mounted on the adjustable panel. Thus, the foldable shelf is expanded outward for use with a user and is folded when not in use. In addition, the foldable shelf can be folded when not in use so as to reduce the whole volume of the rack assembly, thereby decreasing the cost in packaging, transportation and storage of the rack assembly.
    Type: Application
    Filed: September 7, 2010
    Publication date: March 8, 2012
    Inventor: Shu-Yi Li
  • Publication number: 20120055889
    Abstract: A rack assembly includes a framework, and a foldable shelf mounted on the framework. The foldable shelf includes a main body provided with two support posts, an adjustable panel having two opposite ends each pivotally connected with a respective one of the support posts by one of two first pivot members, and two connecting plates each having an upper end pivotally connected with a respective one of the opposite ends of the adjustable panel by one of two second pivot members and having a mediate portion a lower end formed with a sliding slot pivotally connected with a respective one of the support posts by one of two third pivot members. Thus, the foldable shelf is expanded outward for use with a user and is folded when not in use.
    Type: Application
    Filed: September 7, 2010
    Publication date: March 8, 2012
    Inventor: Shu-Yi Li
  • Publication number: 20030115828
    Abstract: Method for manufacturing construction material and structure thereof. The method includes steps of: selecting at least three raw wooden materials; cutting the raw wooden materials along fiber direction thereof to form cutting faces with predetermined length and shape; and arranging the raw wooden materials side by side and connecting the corresponding cutting faces of the raw wooden materials with each other to sandwich a middle raw wooden material between a left and a right wooden raw materials. The middle and left and right raw wooden materials are respectively taken from different trees or the tree from which the middle wooden material is taken is different from the tree from which the left and right raw wooden materials are taken. Alternatively, the middle and left and right raw wooden materials are respectively taken from the same tree, while the growth layer of the middle wooden material does not correspond to the growth layers of the left and right raw wooden materials in the same position.
    Type: Application
    Filed: December 17, 2002
    Publication date: June 26, 2003
    Inventor: Shu Yi Li