Patents by Inventor Shuzhen Chen

Shuzhen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230108010
    Abstract: A preparation method for a spherical silica powder filler, comprises the following steps: S1, providing spherical polysiloxane comprising T units by means of a hydrolysis condensation reaction of R1SiX3, wherein R1 is hydrogen atom or an independently selectable organic group having 1 to 18 carbon atoms, X is a hydrolyzable group, and the T unit is R1SiO3—; and S2, calcining the spherical polysiloxane under the condition of a dry oxidizing gas atmosphere at a calcining temperature between 850° C. and 1200° C., so as to obtain a spherical silica powder filler having a low hydroxyl content. The spherical silica powder filler is composed of at least one selected from Q1 unit, Q2 unit, Q3 unit and Q4 unit, wherein Q1 unit is Si(OH)3O—, Q2 unit is Si(OH)2O2—,Q3 unit is SiOHO3—, Q4 unit is SiO4—, and the content of Q4 unit is greater than or equal to 95%.
    Type: Application
    Filed: April 26, 2020
    Publication date: April 6, 2023
    Inventors: Shuzhen CHEN, Rui LI, Ke WANG, Lieping DING, Haibin SHEN
  • Publication number: 20230081969
    Abstract: A preparation method for a spherical silica powder filler comprises the following steps: S1, providing spherical polysiloxane comprising a T unit by means of a hydrolysis condensation reaction of R1SiX3, wherein R1 is hydrogen atom or an organic group having independently selectable 1 to 18 carbon atoms, X is a hydrolyzable group, and T unit is R1SiO3—; and S2, calcining the spherical polysiloxane under the condition of a dry oxidizing gas atmosphere, the calcining temperature being between 850° C. and 1200° C., so as to obtain the spherical silica powder filler which does not contain silica particles of which the diameter is less than 50 nanometers. The spherical silica powder filler does not contain silica particles of which the diameter is less than 50 nanometers, has a low dielectric loss and a low thermal expansion coefficient, and is suitable for high-frequency high-speed circuit boards, prepregs or copper clad laminates, etc.
    Type: Application
    Filed: February 17, 2020
    Publication date: March 16, 2023
    Inventors: Shuzhen CHEN, Rui LI, Ke WANG, Lieping DING, Chen CHEN
  • Publication number: 20220153599
    Abstract: The present invention relates to a method for preparing a spherical silica powder filler, comprising the following steps: performing hydrolytic condensation on an organic silicon compound to obtain polysiloxane precipitate, wherein the organic silicon compound comprises silane having the chemical formula of (R1)a(R2)b(R3)cSi(X)d, wherein R1, R2, and R3 are independently selected C1-18 hydrocarbyl groups or hydrogen atoms; X is a hydrolysable functional group; a, b, and c are 0, 1, 2, or 3; d is 1, 2, 3, or 4; and a+b+c+d=4; smashing and drying the polysiloxane precipitate to obtain siloxane angular powder; and melting and spherifying the siloxane angular powder into the spherical silica powder filler. The present invention also provides a spherical silica powder filler obtained by the method and an application thereof.
    Type: Application
    Filed: March 12, 2019
    Publication date: May 19, 2022
    Inventors: Shuzhen Chen, Rui LI
  • Publication number: 20220153936
    Abstract: A preparation method for a spherical or angular powder filler, comprising: providing spherical or angular siloxane comprising a T unit, wherein the T unit is R1SiO3?, and R1 is a hydrogen atom or an organic group which can be independently selected from carbon atoms 1-18; and performing heat treatment on the spherical or angular siloxane under an inert gas atmosphere or atmospheric atmosphere, the heat treatment temperature being between 250 degrees and 650 degrees, so that silicon hydroxyl groups in the spherical or angular siloxane are condensed to obtain the spherical or angular powder filler. In the unit T of the spherical or angular powder filler, the content of the unit without containing a hydroxyl group in the total unit is greater than or equal to 95%, and the content of the unit containing one hydroxyl group in the total unit is less than or equal to 5%. Also disclosed are the spherical or angular powder filler obtained by the preparation method, and application thereof.
    Type: Application
    Filed: December 5, 2019
    Publication date: May 19, 2022
    Inventors: Shuzhen Chen, Rui LI, Cheng Tang, Lieping Ding, Chen Chen
  • Publication number: 20220135745
    Abstract: Disclosed is a preparation method for a polysiloxane powder filler. The method comprises: providing polysiloxane which contains at least 60 wt % of T unit, wherein T unit is equal to R1SiO3-, R1 is a hydrogen atom or an independently selected organic group comprising 1-18 carbon atoms; and performing heat treatment on the polysiloxane under inert gas atmosphere or vacuum conditions, wherein the heat treatment temperature is 250 to 750 degrees, such that silicon hydroxyl groups in the polysiloxane are condensed to obtain a polysiloxane powder filler having a true density greater than or equal to 1.33 g/cm3 and more preferably greater than or equal to 1.34 g/cm3. The polysiloxane powder filler obtained by the described preparation method has low inductivity, low inductivity loss and low radioactivity; and can be used for semiconductor packaging materials, circuit boards and intermediate semi-finished products thereof, and semi-cured sheets or copper clad laminates of high-frequency high-speed circuit boards.
    Type: Application
    Filed: September 29, 2019
    Publication date: May 5, 2022
    Inventors: Shuzhen Chen, Rui Li
  • Publication number: 20210309832
    Abstract: The present invention relates to a method for preparing a spherical or angular powder filler, comprising providing a spherical or angular siloxane comprising T units; performing a heat treatment on the spherical or angular siloxane, the heat treatment temperature between 250° C. and the temperature of oxidative decomposition of organic groups, so that silicon hydroxyl groups in the spherical or angular siloxane are condensed to obtain a condensed siloxane; and adding a treatment agent to treat the condensed siloxane to promote the condensation of silicon hydroxyl groups in the condensed siloxane to give a spherical or angular powder filler, the treatment agent comprising a silane coupling agent and/or disilazane, and the quotient of the molecular weight of at least a portion of the silane coupling agent and/or the disilazane divided by its specific gravity at 25° C. being less than or equal to 210. The present invention also provides a spherical or angular powder filler obtained therefrom.
    Type: Application
    Filed: July 27, 2018
    Publication date: October 7, 2021
    Inventors: Shuzhen Chen, Rui Li
  • Patent number: 8862769
    Abstract: Methods and apparatuses are provided that facilitate providing an object-based transport protocol that allows transmission of arbitrarily sized objects over a network protocol layer. The object-based transport protocol can also provide association of metadata with the objects to control communication thereof, and/or communication of response objects. Moreover, the object-based transport protocol can maintain sessions with remote network nodes that can include multiple channels, which can be updated over time to seamlessly provide mobility, increased data rates, and/or the like. In addition, properties can be modified remotely by network nodes receiving objects related to the properties.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: October 14, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Mark Watson, Lorenzo Vicisano, Bin Wang, Shuzhen Chen, Payam Pakzad, Saumitra Mohan Das, Rajarshi Gupta
  • Publication number: 20120131223
    Abstract: Methods and apparatuses are provided that facilitate providing an object-based transport protocol that allows transmission of arbitrarily sized objects over a network protocol layer. The object-based transport protocol can also provide association of metadata with the objects to control communication thereof, and/or communication of response objects. Moreover, the object-based transport protocol can maintain sessions with remote network nodes that can include multiple channels, which can be updated over time to seamlessly provide mobility, increased data rates, and/or the like. In addition, properties can be modified remotely by network nodes receiving objects related to the properties.
    Type: Application
    Filed: November 23, 2010
    Publication date: May 24, 2012
    Inventors: Mark Watson, Lorenzo Vicisano, Bin Wang, Shuzhen Chen, Payam Pakzad, Saumitra Mohan Das, Rajarshi Gupta
  • Publication number: 20080044412
    Abstract: The present invention relates to a novel antibody-based targeting drug—a single domain antibody energized fusion protein VH-LDP-AE with potent cancer cell killing activity, anti-angiogenic activity, and anti-cancer therapeutic efficacy, to a method for producing the same, and use thereof in manufacture of an anti-tumor medicament.
    Type: Application
    Filed: April 19, 2005
    Publication date: February 21, 2008
    Applicant: INSTITUTE OF MEDICINAL BIOTECHNOLOGY CHINESE ACADEMY OF MEDICAL SCIENCES
    Inventors: Qingfang Miao, Shuzhen Chen, Yongsu Zhen, Boyang Shang, Xiujun Liu, Xiaoyun Liu
  • Patent number: D974526
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: January 3, 2023
    Inventor: Shuzhen Chen