Patents by Inventor Shuzo Akiyama
Shuzo Akiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8363420Abstract: The apparatus includes a housing, a heat sink arranged in the housing, semiconductor switching elements mounted on the heat sink and having terminals, a circuit board arranged in opposition to the heat sink and having an electronic circuit formed thereon including a control circuit for controlling the semiconductor switching elements, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other. The individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, so that they are bonded to the individual terminals.Type: GrantFiled: May 30, 2007Date of Patent: January 29, 2013Assignee: Mitsubishi Electric CorporationInventors: Tsutomu Tominaga, Masahiro Kimata, Takayuki Kifuku, Shuzo Akiyama, Tadayuki Fujimoto
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Patent number: 7791888Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink attached to one end of the housing, semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements. The heat sink is composed of a heat sink main body, and an anodized aluminum film formed at least on a surface of the heat sink main body at a side at which the power device is mounted thereon, and the heat sink main body has outer peripheral end faces arranged in opposition to inner wall surfaces of an opening portion of the housing.Type: GrantFiled: June 19, 2007Date of Patent: September 7, 2010Assignee: Mitsubishi Electric CorporationInventors: Tsutomu Tominaga, Masahiro Kimata, Takayuki Kifuku, Shuzo Akiyama, Tadayuki Fujimoto
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Patent number: 7751193Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circuit board arranged in opposition to the heat sink, conductive plates connecting between the circuit board and the semiconductor switching elements, and a cover receiving the semiconductor switching elements and the circuit board in cooperation with the heat sink. The conductive plates have the press-fit terminal portions press-fitted into the through holes in the circuit board, and the individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, and are bonded to the individual terminals.Type: GrantFiled: June 18, 2007Date of Patent: July 6, 2010Assignee: Mitsubishi CorporationInventors: Tsutomu Tominaga, Masahiro Kimata, Takayuki Kifuku, Shuzo Akiyama, Tadayuki Fujimoto
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Patent number: 7667971Abstract: Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power device (2) provided to the heat sink (5); a circuit board (4) which is provided so as to be opposed to the heat sink (5) and formed with an electronic circuit including a control circuit for controlling the power device (2); and a plurality of first conductive plates (6) held in the housing (3), for electrically connecting the circuit board (4) with the power device (2), in which each of the plurality of first conductive plates (6) includes a press fit terminal (6bp) press-fitted into a through hole (4a) formed in the circuit board (4) to be bonded to the circuit board (4) on a surface opposed to the circuit board (4) and to be bonded to respective terminals of the power device (2) on a surface opposed to the heat sink (5).Type: GrantFiled: May 14, 2008Date of Patent: February 23, 2010Assignee: Mitsubishi Electric CorporationInventors: Tsutomu Tominaga, Takayuki Kifuku, Shuzo Akiyama, Masaaki Tanigawa
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Patent number: 7643297Abstract: An electronic control apparatus can be reduced in size and cost by removing a metal substrate part. The apparatus includes a housing having a pair of opening portions at its opposite sides, a heat sink attached to one of the opening portions of the housing, a pair of semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other, and a plate spring urging the semiconductor switching elements against the heat sink. The plate spring has engagement portions press-fitted to and engaged with inner sides of holding portions which are formed on the housing, and the housing has engagement portions engaged with protruded portions of the heat sink.Type: GrantFiled: November 2, 2007Date of Patent: January 5, 2010Assignee: Mitsubishi Electric CorporationInventors: Tsutomu Tominaga, Takayuki Kifuku, Shuzo Akiyama, Tadayuki Fujimoto
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Publication number: 20090122489Abstract: Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power device (2) provided to the heat sink (5); a circuit board (4) which is provided so as to be opposed to the heat sink (5) and formed with an electronic circuit including a control circuit for controlling the power device (2); and a plurality of first conductive plates (6) held in the housing (3), for electrically connecting the circuit board (4) with the power device (2), in which each of the plurality of first conductive plates (6) includes a press fit terminal (6bp) press-fitted into a through hole (4a) formed in the circuit board (4) to be bonded to the circuit board (4) on a surface opposed to the circuit board (4) and to be bonded to respective terminals of the power device (2) on a surface opposed to the heat sink (5).Type: ApplicationFiled: May 14, 2008Publication date: May 14, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tsutomu Tominaga, Takayuki Kifuku, Shuzo Akiyama, Masaaki Tanigawa
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Publication number: 20080278918Abstract: An electronic control apparatus can be reduced in size and cost by removing a metal substrate part. The apparatus includes a housing having a pair of opening portions at its opposite sides, a heat sink attached to one of the opening portions of the housing, a pair of semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other, and a plate spring urging the semiconductor switching elements against the heat sink. The plate spring has engagement portions press-fitted to and engaged with inner sides of holding portions which are formed on the housing, and the housing has engagement portions engaged with protruded portions of the heat sink.Type: ApplicationFiled: November 2, 2007Publication date: November 13, 2008Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tsutomu Tominaga, Takayuki Kifuku, Shuzo Akiyama, Tadayuki Fujimoto
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Publication number: 20080158823Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink attached to one end of the housing, semiconductor switching elements 2 mounted on the heat sink, a circuit board arranged in opposition to the heat sink, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements. The heat sink is composed of a heat sink main body, and an anodized aluminum film formed at least on a surface of the heat sink main body at a side at which the power device is mounted thereon, and the heat sink main body has outer peripheral end faces arranged in opposition to inner wall surfaces of an opening portion of the housing.Type: ApplicationFiled: June 19, 2007Publication date: July 3, 2008Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tsutomu Tominaga, Masahiro Kimata, Takayuki Kifuku, Shuzo Akiyama, Tadayuki Fujimoto
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Publication number: 20080157680Abstract: An electronic control apparatus can be reduced in size and cost, and also improved in the reliability of electrical connection by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink arranged in the housing, semiconductor switching elements mounted on the heat sink and having terminals, a circuit board arranged in opposition to the heat sink and having an electronic circuit formed thereon including a control circuit for controlling the semiconductor switching elements, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other. The individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, so that they are bonded to the individual terminals.Type: ApplicationFiled: May 30, 2007Publication date: July 3, 2008Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tsutomu Tominaga, Masahiro Kimata, Takayuki Kifuku, Shuzo Akiyama, Tadayuki Fujimoto
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Publication number: 20080158830Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circuit board arranged in opposition to the heat sink, conductive plates connecting between the circuit board and the semiconductor switching elements, and a cover receiving the semiconductor switching elements and the circuit board in cooperation with the heat sink. The conductive plates have the press-fit terminal portions press-fitted into the through holes in the circuit board, and the individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, and are bonded to the individual terminals.Type: ApplicationFiled: June 18, 2007Publication date: July 3, 2008Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tsutomu TOMINAGA, Masahiro Kimata, Takayuki Kifuku, Shuzo Akiyama, Tadayuki Fujimoto
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Patent number: 5744307Abstract: A method for the measurement of adenyl group-containing substances which comprises deriving a chemiluminescent substance by allowing a compound to react with adenyl group in a substance to be measured, and qualitatively or quantitatively measuring the substance to be measured using a luminescent intensity obtained from the chemiluminescent substance as a marker.Type: GrantFiled: September 12, 1995Date of Patent: April 28, 1998Assignee: Mochida Pharmaceutical Co., Ltd.Inventors: Naotaka Kuroda, Kenichiro Nakashima, Shuzo Akiyama, Kamon Shirakawa, Naofumi Sato, Toshinori Kanamori
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Patent number: 5346772Abstract: An organic electroluminescent device comprises an anode, a positive-hole transport layer of organic compound, an emitting layer of organic compound, and a cathode which are laminated in sequence, wherein the emitting layer comprises a pyrimidopyrimidine derivative. This device emits with a high luminance and high emission efficiency.Type: GrantFiled: April 27, 1993Date of Patent: September 13, 1994Assignee: Pioneer Electronic CorporationInventors: Shuzo Akiyama, Kenichiro Nakashima, Kunio Imai, Ryuji Murayama, Jun Funaki
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Patent number: 5103000Abstract: A packing for use in chromatography which comprises a cyclic amino-substituted silane compound having the formula (I): ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 are the same or different and are each an alkyl having 1 to 5 carbon atoms, an alkoxy having 1 to 3 carbon atoms, hydroxy or a halogen atom in which at least one of R.sup.1, R.sup.2 and R.sup.3 are an alkoxy group or a halogen atom; R.sup.4 is .omega.-piperidino, .omega.-piperazino or .omega.-morpholino group which is optionally substituted by a straight chain or branched chain lower alkyl group; n is an integer of from 2 to 10, said compound being grafted onto an inorganic carrier having hydroxyl group on its surface, and a method for separating water soluble organic compounds by chromatography using said packing.Type: GrantFiled: September 10, 1990Date of Patent: April 7, 1992Assignee: Daiso Co., Ltd.Inventors: Shuzo Akiyama, Kenichiro Nakashima, Yasumi Shimizu, Yutaka Kamada, Junichi Kadoya