Patents by Inventor Shuzo Aoki

Shuzo Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10518548
    Abstract: A liquid ejection head has a plurality of ejection modules having a recording element substrate equipped with a plurality of ejection orifices for ejecting a liquid, a plurality of first flow path members that supports at least one of the ejection modules and a second flow path member provided in common with the first flow path members and supporting the first flow path members. The first flow path members and the second flow path member are equipped with a flow path for supplying a plurality of recording element substrates with a liquid. The first flow path members are joined with the second flow path member via an adhesive layer without being brought into direct contact with the second flow path member.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: December 31, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiro Yamada, Shuzo Iwanaga, Seiichiro Karita, Shingo Okushima, Zentaro Tamenaga, Noriyasu Nagai, Tatsurou Mori, Akio Saito, Akira Yamamoto, Asuka Horie, Masao Furukawa, Takatsuna Aoki
  • Patent number: 10471711
    Abstract: In a printing apparatus including a circulation system circulating a liquid, a volatile component included in the liquid evaporates from an ejection opening and thus characteristics of the liquid involving with concentration or viscosity change. The invention provides a printing apparatus that uses a liquid ejection head including an ejection opening ejecting a liquid, a print element generating energy for ejecting a liquid, and a pressure chamber having the print element provided therein, the printing apparatus including: a circulator configured to circulate the liquid so that the liquid passes through the pressure chamber; and a concentration adjustment unit configured to adjust a concentration of a liquid inside a liquid circulation system by discharging the liquid from the inside of the liquid circulation system and replenishing the liquid into the liquid circulation system from the outside of the liquid circulation system in response to the amount of the discharged liquid.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 12, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Seiichiro Karita, Shuzo Iwanaga, Kazuhiro Yamada, Takatsuna Aoki, Shingo Okushima, Zentaro Tamenaga, Yumi Komamiya, Noriyasu Nagai, Tatsurou Mori, Yoshiyuki Nakagawa, Akira Yamamoto
  • Patent number: 10361110
    Abstract: A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and the electrostatic chuck are directly bonded to each other.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: July 23, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Keiichi Takemoto, Yoichi Harayama, Yoji Asahi, Shuzo Aoki
  • Patent number: 10350885
    Abstract: A liquid discharge device performs recording by use of a liquid discharge head including discharge ports to discharge a liquid, pressure generation elements to generate energy to be used to discharge the liquid, and pressure chambers communicating with the discharge ports. The liquid discharge device includes a control unit to control a temperature of the liquid discharge head by applying heat with heating elements arranged in divided areas of a region of the liquid discharge head where the discharge ports are arranged. When there is recording data for the discharge port in a certain one of the divided areas, the control unit causes the heating element in the divided area to generate heat, and when there is no recording data for the discharge port in the certain divided area, the control unit keeps the heating element in the certain divided area from generating heat.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: July 16, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takatsuna Aoki, Shuzo Iwanaga, Seiichiro Karita, Kazuhiro Yamada, Shingo Okushima, Zentaro Tamenaga, Akira Yamamoto, Tatsurou Mori, Noriyasu Nagai, Akio Saito, Ryo Kasai
  • Patent number: 10293604
    Abstract: In order to keep possible local temperature differences in a liquid ejection head small to allow stable liquid ejection performance to be achieved, temperatures in a plurality of heating areas in a liquid ejection head are discretely controlled using heating elements and temperature detection elements.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: May 21, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takatsuna Aoki, Shuzo Iwanaga, Seiichiro Karita, Kazuhiro Yamada, Shingo Okushima, Zentaro Tamenaga, Akira Yamamoto, Tatsurou Mori, Noriyasu Nagai, Akio Saito, Masashi Hayashi, Takeshi Murase, Yuki Sawai
  • Publication number: 20180047604
    Abstract: A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and the electrostatic chuck are directly bonded to each other.
    Type: Application
    Filed: July 28, 2017
    Publication date: February 15, 2018
    Inventors: Keiichi TAKEMOTO, Yoichi HARAYAMA, Yoji ASAHI, Shuzo AOKI
  • Patent number: 7599187
    Abstract: A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devices, and heat radiating plates are mounted thereto by covering outer faces of the semiconductor devices over two pieces or more of the semiconductor devices, wherein the heat conducting sheet having a heat conductivity higher than a heat conductivity of the heat conducting sheet used for the semiconductor device having a heat generating amount smaller than a heat generating amount of the semiconductor device is used for the semiconductor device having a large heat generating amount in the semiconductor devices.
    Type: Grant
    Filed: July 10, 2007
    Date of Patent: October 6, 2009
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Shuzo Aoki, Hisateru Iijima, Katsuaki Sakai, Meisou Chin
  • Patent number: 7569930
    Abstract: A semiconductor module 10 in which respective upper surfaces of semiconductor elements 17, 17 on both sides of a rectangular circuit board 11 are covered with radiator plates 12a, 12b attached to both sides of the circuit board 11 so that their outer peripheral edges are not projected from the board surfaces of the circuit board 11. In this semiconductor module, by projections serving as a pair of attachments 42, 42 formed in the vicinity of the center area in a longitudinal direction of the circuit board 11, the radiator plates 12a, 12b are located at predetermined positions. The projections abuts on the corresponding board surface of the circuit board 11 so that a part of the load applied to the vicinity of the center area of each the radiator plates 12a, 12b can be supported by the circuit board 11.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: August 4, 2009
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Sumio Uehara, Shuzo Aoki
  • Publication number: 20080013286
    Abstract: A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devices, and heat radiating plates are mounted thereto by covering outer faces of the semiconductor devices over two pieces or more of the semiconductor devices, wherein the heat conducting sheet having a heat conductivity higher than a heat conductivity of the heat conducting sheet used for the semiconductor device having a heat generating amount smaller than a heat generating amount of the semiconductor device is used for the semiconductor device having a large heat generating amount in the semiconductor devices.
    Type: Application
    Filed: July 10, 2007
    Publication date: January 17, 2008
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Shuzo Aoki, Hisateru Iijima, Katsuaki Sakai, Meisou Chin
  • Publication number: 20070102808
    Abstract: A semiconductor module 10 in which respective upper surfaces of semiconductor elements 17, 17 on both sides of a rectangular circuit board 11 are covered with radiator plates 12a, 12b attached to both sides of the circuit board 11 so that their outer peripheral edges are not projected from the board surfaces of the circuit board 11. In this semiconductor module, by projections serving as a pair of attachments 42, 42 formed in the vicinity of the center area in a longitudinal direction of the circuit board 11, the radiator plates 12a, 12b are located at predetermined positions. The projections abuts on the corresponding board surface of the circuit board 11 so that a part of the load applied to the vicinity of the center area of each the radiator plates 12a, 12b can be supported by the circuit board 11.
    Type: Application
    Filed: November 2, 2006
    Publication date: May 10, 2007
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Sumio Uehara, Shuzo Aoki
  • Publication number: 20070102795
    Abstract: A radiator plate 20 is mounted on a back surface of a semiconductor element 11 on a substrate 10 so that heat is radiated from the semiconductor element 11. The radiator plate 20 includes first radiating fins 20b formed on the one side which is opposite to the surface facing the substrate 10 and second radiating fins 20c formed on the other side which faces the substrate 10. The second radiating fins 20c are arranged in the same direction as the first radiating fins 20b and at positions not interfering the semiconductor element 11.
    Type: Application
    Filed: November 9, 2006
    Publication date: May 10, 2007
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Shuzo Aoki, Sumio Uehara, Meisou Chin
  • Patent number: 4093776
    Abstract: Spontaneously cross-linked alkali metal acrylate polymers having a high water-absorbing property and which are safe for contact with the human skin are prepared by a water-in-oil suspension polymerization process, using a sorbitan fatty acid ester having an HLB value of 3 to 6 as a dispersing agent.
    Type: Grant
    Filed: September 23, 1977
    Date of Patent: June 6, 1978
    Assignee: Kao Soap Co., Ltd.
    Inventors: Shuzo Aoki, Harumasa Yamasaki