Abstract: A method for programming a non-volatile memory structure, wherein the method comprises initiating a two-dimensional fractional number of bits-per-cell programming scheme with respect to at least a first memory cell and a second memory cell of a plurality of memory cells of the memory structure, wherein the memory structure comprises: (1) a first memory array that comprises a first population of the plurality of memory cells and associated peripheral circuitry disposed below the first population of the plurality of memory cells, (2) a second memory array that is positioned above the first memory array and comprises a second population of the plurality of memory cells and the associated peripheral circuitry that is disposed above the second population of the plurality of memory cells, and (3) a data bus tap electrically coupling the first memory array and the second memory array.

Abstract: A method for programming a non-volatile memory structure, comprises initiating a two-dimensional fractional number of bits-per-cell programming scheme of a plurality of memory cells, wherein the memory structure comprises: (1) a first memory array comprising a first population of memory cells and the associated peripheral circuitry disposed below the first population of cells, (2) a second memory array positioned above the first memory array and comprising a second population of memory cells and associated peripheral circuitry disposed above the second population of cells, and (3) a data bus tap electrically coupling the first and second memory arrays. Further, the method comprises: (1) storing input data in data latches associated with the first array and with the second array. Additionally, the method comprises converting the stored data using data conversion logic implemented by a data path circuit of the first and second arrays and rewriting the converted data to the latches.

Abstract: A method for programming a non-volatile memory structure, comprises initiating a two-dimensional fractional number of bits-per-cell programming scheme of a plurality of memory cells, wherein the memory structure comprises: (1) a first memory array comprising a first population of memory cells and the associated peripheral circuitry disposed below the first population of cells, (2) a second memory array positioned above the first memory array and comprising a second population of memory cells and associated peripheral circuitry disposed above the second population of cells, and (3) a data bus tap electrically coupling the first and second memory arrays. Further, the method comprises: (1) storing input data in data latches associated with the first array and with the second array. Additionally, the method comprises converting the stored data using data conversion logic implemented by a data path circuit of the first and second arrays and rewriting the converted data to the latches.

Abstract: A method for programming a non-volatile memory structure, wherein the method comprises initiating a two-dimensional fractional number of bits-per-cell programming scheme with respect to at least a first memory cell and a second memory cell of a plurality of memory cells of the memory structure, wherein the memory structure comprises: (1) a first memory array that comprises a first population of the plurality of memory cells and associated peripheral circuitry disposed below the first population of the plurality of memory cells, (2) a second memory array that is positioned above the first memory array and comprises a second population of the plurality of memory cells and the associated peripheral circuitry that is disposed above the second population of the plurality of memory cells, and (3) a data bus tap electrically coupling the first memory array and the second memory array.

Abstract: In a semiconductor memory device having an error-correction function: one or both of a portion of a set of data bits and a set of parity bits based on the set of data bits are held, where the set of data bits and the set of parity bits constitute a code for error correction and are written in memory cells in the leading write cycle in a burst write operation. The set of parity bits written in memory cells in the leading write cycle is updated in the final write cycle on the basis of the portion of the set of data bits and/or the set of parity bits, and another set of data bits required to be written in the final write cycle in the memory cells at the address at which the above portion is written in the leading write cycle.

Abstract: A bit line resetting signal is supplied to the gate of an nMOS transistor (or a precharge circuit) which connects a bit line with a precharge voltage line. The high-level voltage of the bit line resetting signal is retained at a first voltage during the precharge operation after a refresh operation, and is retained at a second voltage higher than the first voltage during the precharge operation after an access operation. In the precharge operation after the refresh operation, therefore, the second voltage is not used so that the current consumption of the generating circuit of the second voltage is reduced. Thus, it is possible to reduce the current consumption (or the standby current) during the standby period for which the internal refresh requests continuously occur.

Abstract: Out of memory blocks arranged in one direction, the memory blocks arranged at both ends are included in a partial area. Since part of control circuits operating the memory blocks arranged at the both ends are not shared by the other memory blocks, switching circuits connecting these control circuits to the memory blocks are constantly settable to an ON state. Since ON/OFF control of the switching circuits is not necessary, power consumption required for accessing the memory blocks arranged at the both ends is smaller than that required for accessing the other memory blocks. Therefore, including the memory blocks arranged at the both ends in a partial area makes it possible to reduce power consumption during a partial refresh mode (standby current).

Abstract: A bit line resetting signal is supplied to the gate of an nMOS transistor (or a precharge circuit) which connects a bit line with a precharge voltage line. The high-level voltage of the bit line resetting signal is retained at a first voltage during the precharge operation after a refresh operation, and is retained at a second voltage higher than the first voltage during the precharge operation after an access operation. In the precharge operation after the refresh operation, therefore, the second voltage is not used so that the current consumption of the generating circuit of the second voltage is reduced. Thus, it is possible to reduce the current consumption (or the standby current) during the standby period for which the internal refresh requests continuously occur.

Abstract: Out of memory blocks arranged in one direction, the memory blocks arranged at both ends are included in a partial area. Since part of control circuits operating the memory blocks arranged at the both ends are not shared by the other memory blocks, switching circuits connecting these control circuits to the memory blocks are constantly settable to an ON state. Since ON/OFF control of the switching circuits is not necessary, power consumption required for accessing the memory blocks arranged at the both ends is smaller than that required for accessing the other memory blocks. Therefore, including the memory blocks arranged at the both ends in a partial area makes it possible to reduce power consumption during a partial refresh mode (standby current).

Abstract: In a semiconductor memory device having an error-correction function: one or both of a portion of a set of data bits and a set of parity bits based on the set of data bits are held, where the set of data bits and the set of parity bits constitute a code for error correction and are written in memory cells in the leading write cycle in a burst write operation. The set of parity bits written in memory cells in the leading write cycle is updated in the final write cycle on the basis of the portion of the set of data bits and/or the set of parity bits, and another set of data bits required to be written in the final write cycle in the memory cells at the address at which the above portion is written in the leading write cycle.

Abstract: A semiconductor device which is driven by a first potential, a second potential lower than the first potential, and a third potential lower than the second potential includes a first Pch transistor and a first Nch transistor connected in series between the first potential and the third potential, a second Pch transistor having a drain node thereof connected to a gate node of the first Nch transistor, and a second Nch transistor having a source node thereof connected to a source node of the second Pch transistor, wherein the drain node and gate node of the second Nch transistor are fixed to the second potential and the first potential, respectively.

Abstract: A semiconductor device which is driven by a first potential, a second potential lower than the first potential, and a third potential lower than the second potential includes a first Pch transistor and a first Nch transistor connected in series between the first potential and the third potential, a second Pch transistor having a drain node thereof connected to a gate node of the first Nch transistor, and a second Nch transistor having a source node thereof connected to a source node of the second Pch transistor, wherein the drain node and gate node of the second Nch transistor are fixed to the second potential and the first potential, respectively.