Patents by Inventor Shuzo Saeki

Shuzo Saeki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5130784
    Abstract: A semiconductor device includes a metallic electrode formed on a semiconductor substrate, and a metallic terminal formed on a metal base through an insulating material, in parallel to the metal electrode. A metallic wire electrically connects the metallic electrode to the metallic terminal. In a metallic conductor having a current capacity larger than that of the metallic wire, one end is in contact with the metallic terminal, and the other end is in contact with the metallic electrode.
    Type: Grant
    Filed: November 23, 1990
    Date of Patent: July 14, 1992
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shuzo Saeki, Makoto Hideshima
  • Patent number: 4035831
    Abstract: The pressure contact type semiconductor device comprises a transistor including a semiconductor substrate, an emitter region having portions protruding from the surface of the substrate and extending in the radial direction from a circle spaced a definite distance from the center of the substrate, a base region surrounding the protruding portions of the emitter region, emitter electrodes provided on respective protruding portions of the emitter region, a collector electrode mounted on the other surface of the substrate, and an electroconductive plate commonly urged against the emitter electrodes.
    Type: Grant
    Filed: January 2, 1976
    Date of Patent: July 12, 1977
    Assignee: Agency of Industrial Science & Technology
    Inventor: Shuzo Saeki