Patents by Inventor Shyam Keshavmurthy

Shyam Keshavmurthy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7244323
    Abstract: Materials and methods inhibit the localized build-up of material with respect to certain additive manufacturing processes, including those based on ultrasonic consolidation. Where an object is fabricated by consolidating material increments from a feedstock in accordance with a description of the object, the invention prevents the consolidation in specified regions to provide for an intrinsic support or to otherwise build a part or component in accordance with the description. The object being fabricated, the feedstock, or both, may be treated so as to inhibit the consolidation of material increments in the localized area. That is, such treatment may affect the surface chemistry of the feedstock to prevent local bonding, or the treatment may be applied to a previously built surface of the object.
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: July 17, 2007
    Assignee: Solidica, Inc.
    Inventors: Dawn White, David Carmein, Shyam Keshavmurthy
  • Publication number: 20040107019
    Abstract: Additive and subtractive manufacturing processes are combined to produce objects having a desired geometry specified by a computerized description. According to the invention, a software system is provided which is capable of creating both additive and subtractive toolpaths, and automatically distinguishing between regions in which addition and subtraction must occur. The additive manufacturing aspect may include solid-state or fusion welding processes of all types (including but not limited to, arc welding, laser welding, resistance welding, friction welding, friction stir welding, ultrasonic welding, laser cladding, plasma welding), laser material deposition, metal spraying, adhesive bonding, vapor or electrochemical deposition and other processes not listed which may suggest themselves to those knowledgeable in the field.
    Type: Application
    Filed: July 18, 2003
    Publication date: June 3, 2004
    Inventors: Shyam Keshavmurthy, Judy Ann Carmein, Dawn White
  • Publication number: 20040071862
    Abstract: Materials and methods inhibit the localized build-up of material with respect to certain additive manufacturing processes, including those based on ultrasonic consolidation. Where an object is fabricated by consolidating material increments from a feedstock in accordance with a description of the object, the invention prevents the consolidation in specified regions to provide for an intrinsic support or to otherwise build a part or component in accordance with the description. The object being fabricated, the feedstock, or both, may be treated so as to inhibit the consolidation of material increments in the localized area. That is, such treatment may affect the surface chemistry of the feedstock to prevent local bonding, or the treatment may be applied to a previously built surface of the object.
    Type: Application
    Filed: August 21, 2003
    Publication date: April 15, 2004
    Inventors: Dawn White, David Carmein, Shyam Keshavmurthy