Patents by Inventor Shyam S. Venkataraman

Shyam S. Venkataraman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing (CMP) polishing solution with enhanced performance
    Patent number: 8597539
    Abstract: This invention relates to a chemical composition for chemical mechanical polishing (CMP) of substrates that are widely used in the semiconductor industry. The inventive chemical composition contains additives that are capable of improving consistency of the polishing performance and extending the lifetime of a polishing pad.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: December 3, 2013
    Assignee: BASF SE
    Inventors: Yuzhuo Li, Harvey Wayne Pinder, Shyam S. Venkataraman
  • CHEMICAL MECHANICAL POLISHING (CMP) POLISHING SOLUTION WITH ENHANCED PERFORMANCE
    Publication number: 20110269312
    Abstract: This invention relates to a chemical composition for chemical mechanical polishing (CMP) of substrates that are widely used in the semiconductor industry. The inventive chemical composition contains additives that are capable of improving consistency of the polishing performance and extending the lifetime of a polishing pad.
    Type: Application
    Filed: September 29, 2009
    Publication date: November 3, 2011
    Applicant: BASF SE
    Inventors: Yuzhuo Li, Harvey Wayne Pinder, Shyam S. Venkataraman