Patents by Inventor Shyamala Shanmugam
Shyamala Shanmugam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11148225Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.Type: GrantFiled: November 7, 2018Date of Patent: October 19, 2021Assignee: Corning IncorporatedInventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
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Patent number: 10293436Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.Type: GrantFiled: November 7, 2014Date of Patent: May 21, 2019Assignee: Corning IncorporatedInventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Sergio Tsuda, Robert Stephen Wagner
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Publication number: 20190084090Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.Type: ApplicationFiled: November 7, 2018Publication date: March 21, 2019Inventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
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Patent number: 10144093Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.Type: GrantFiled: August 30, 2016Date of Patent: December 4, 2018Assignee: Corning IncorporatedInventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
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Publication number: 20160368100Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.Type: ApplicationFiled: August 30, 2016Publication date: December 22, 2016Inventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
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Patent number: 9517963Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.Type: GrantFiled: November 7, 2014Date of Patent: December 13, 2016Assignee: Corning IncorporatedInventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
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Patent number: 9488857Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.Type: GrantFiled: January 7, 2015Date of Patent: November 8, 2016Assignee: CORNING INCORPORATEDInventors: Kody Luce Bornstein, Donald Arthur Clark, Gregory Scott Glaesemann, Gregory William Keyes, Jennifer Lynn Lyon, Richard Curwood Peterson, Shyamala Shanmugam, Christopher Clark Thompson, Krishna Hemanth Vepakomma, Kathleen Ann Wexell
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Patent number: 9290410Abstract: The disclosure is directed to a method for controlling the sludge that is generated during the wet acid etching of glass articles. The four Factors that need to be controlled are (i) the dissolved glass level A; (ii) the HF concentration B; (iii) the second acid concentration C, the second acid being a strong acid, and (iv) the solubility constant D of the precipitate, Ksp, which is controlled by changing temperature or ionic strength. The disclosed method utilized HF as the etchant and a strong acid selected from the group consisting of HCI, H2SO4.HNO3 and HCIO4.Type: GrantFiled: May 28, 2013Date of Patent: March 22, 2016Assignee: CORNING INCORPORATEDInventors: Yuhui Jin, Jun Hou, Mehmet Derya Tetiker, Shyamala Shanmugam
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Publication number: 20150198838Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.Type: ApplicationFiled: January 7, 2015Publication date: July 16, 2015Inventors: Kody Luce Bornstein, Donald Arthur Clark, Gregory Scott Glaesemann, Gregory William Keyes, Jennifer Lynn Lyon, Richard Curwood Peterson, Shyamala Shanmugam, Christopher Clark Thompson, Krishna Hemanth Vepakomma, Kathleen Ann Wexell
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Publication number: 20150166395Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.Type: ApplicationFiled: November 7, 2014Publication date: June 18, 2015Inventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
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Publication number: 20150166396Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.Type: ApplicationFiled: November 7, 2014Publication date: June 18, 2015Inventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Sergio Tsuda, Robert Stephen Wagner
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Publication number: 20150136736Abstract: The disclosure is directed to a method for controlling the sludge that is generated during the wet acid etching of glass articles. The four Factors that need to be controlled are (i) the dissolved glass level A; (ii) the HF concentration B; (iii) the second acid concentration C, the second acid being a strong acid, and (iv) the solubility constant D of the precipitate, Ksp, which is controlled by changing temperature or ionic strength. The disclosed method utilized HF as the etchant and a strong acid selected from the group consisting of HCI, H2SO4.HNO3 and HCIO4.Type: ApplicationFiled: May 28, 2013Publication date: May 21, 2015Inventors: Yuhui Jin, Jun Hou, Mehmet Derya Tetiker, Shyamala Shanmugam
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Patent number: 8951434Abstract: A glass etching medium and a method for etching the surface of a glass sheet to modify surface flaw characteristics without degrading the optical quality of the sheet surface, wherein the etching medium is a thickened aqueous acidic fluoride-containing paste comprising at least one dissolved, water-soluble, high-molecular-weight poly (ethylene oxide) polymer thickener.Type: GrantFiled: May 8, 2013Date of Patent: February 10, 2015Assignee: Corning IncorporatedInventors: Timothy Edward Myers, Shyamala Shanmugam, Alan Thomas Stephens, II, Matthew John Towner, Kevin William Uhlig, Lu Zhang
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Publication number: 20130299452Abstract: A glass etching medium and a method for etching the surface of a glass sheet to modify surface flaw characteristics without degrading the optical quality of the sheet surface, wherein the etching medium is a thickened aqueous acidic fluoride-containing paste comprising at least one dissolved, water-soluble, high-molecular-weight poly (ethylene oxide) polymer thickener.Type: ApplicationFiled: May 8, 2013Publication date: November 14, 2013Applicant: Corning IncorporatedInventors: Timothy Edward Myers, Shyamala Shanmugam, Alan Thomas Stephens, II, Matthew John Towner, Kevin William Uhlig, Lu Zhang
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Publication number: 20100095705Abstract: A dry glass-based fit, and methods of making a dry glass fit are disclosed. In one embodiment a dry glass frit comprises vanadium, phosphorous and a metal halide. The halide may be, for example, fluorine or chlorine. In another embodiment, a method of producing a dry glass frit comprises calcining a batch material for the frit, then melting the batch material in an inert atmosphere, such as a nitrogen atmosphere.Type: ApplicationFiled: July 16, 2009Publication date: April 22, 2010Inventors: Robert S. Burkhalter, Lisa A. Lamberson, Robert M. Morena, Shyamala Shanmugam, Charlene M. Smith