Abstract: A chip sorting apparatus and a method for fabricating the same are applicable to the chip pick-up sorting process after chip formation. By using the chip sorting apparatus and the method for fabricating the same in the chip pick-up process, it can directly inspect the chip without multiple chip movements for implementing the chip inspection. The chip sorting apparatus and the method for fabricating the same use a positioning axis to directly process inspection on the chip before picking up the chip. This, therefore, can avoid the complicated process causing from multiple chip pick-up positions. Further, it can enhance the chip pick-up efficiency.

Abstract: A coding method with dynamic positioning is used in a die pick-up process. The steps include picking up one of the dies and examining the dies for classifying the grade of the dies for deposit in their exclusive bin. In the meantime, the method classifies the excusive bin for each grade of die during the process, and continues to perform the die pick-up process until all the dies are picked-up.