Abstract: A method includes etching a substrate to form an opening, depositing a first dielectric liner extending into the opening, and depositing a second dielectric liner over the first dielectric liner. The second dielectric liner extends into the opening. A conductive material is filled into the opening. The method further includes performing a first planarization process to planarize the conductive material so that a portion of the conductive material in the opening forms a through-via, performing a backside grinding process on the substrate until the through-via is revealed from a backside of the substrate, and forming a conductive feature on the backside of the substrate. The conductive feature is electrically connected to the through-via.

Abstract: A method includes etching a substrate to form an opening, depositing a first dielectric liner extending into the opening, and depositing a second dielectric liner over the first dielectric liner. The second dielectric liner extends into the opening. A conductive material is filled into the opening. The method further includes performing a first planarization process to planarize the conductive material so that a portion of the conductive material in the opening forms a through-via, performing a backside grinding process on the substrate until the through-via is revealed from a backside of the substrate, and forming a conductive feature on the backside of the substrate. The conductive feature is electrically connected to the through-via.

Abstract: A method includes etching a substrate to form an opening, depositing a first dielectric liner extending into the opening, and depositing a second dielectric liner over the first dielectric liner. The second dielectric liner extends into the opening. A conductive material is filled into the opening. The method further includes performing a first planarization process to planarize the conductive material so that a portion of the conductive material in the opening forms a through-via, performing a backside grinding process on the substrate until the through-via is revealed from a backside of the substrate, and forming a conductive feature on the backside of the substrate. The conductive feature is electrically connected to the through-via.

Abstract: A surface-emitting semiconductor laser diode has a vertical multilayer active region and a lateral buried heterojunction. Effective carrier confinement to the active region is achieved, thereby permitting laser action at room temperature under continuous-wave operation with a low threshold current of about 2 mA.

Abstract: Wave propagation in thin film optical waveguides using gyrotropic or anisotropic material in either the substrate or adjacent top layer with respect to the thin film waveguide is analyzed and a mode converter capable of converting TE to TM or TM to TE polarization is disclosed. Several mode converters constructed in accordance with the present invention are set forth. Also disclosed are other optical circuit elements constructed from such mode converters including a gyrator, isolator, an optical switch, and a non-destructive optical readout for magnetic memories.

Abstract: Wave propagation in thin film optical waveguides using gyrotropic or anisotropic material in either the substrate or adjacent top layer with respect to the thin film waveguide is analyzed and a mode converter capable of converting TE to TM or TM to TE polarization is disclosed. Several mode converters constructed in accordance with the present invention are set forth. Also disclosed are other optical circuit elements constructed from such mode converters including a gyrator, isolator, an optical switch, and a non-destructive optical readout for magnetic memories.

Abstract: An article and method for fabricating one and two dimensional arrays of superconducting and normal junctions by depositing metal films on photoresist gratings. In one mode superconducting Josephson junction arrays of the Dayem bridge type are fabricated by scratching a groove across the grating with a sharp diamond point.

Abstract: Optical devices and waveguides using a thin film optical waveguide having a two dimensional array of perturbations associated therewith or with adjacent optically coupled layers. The array is regular and forms periodic variations in two non-coincident directions which serve to reflect or scatter light waves into controllable transverse modes of propagation. Lasers as well as passive devices are disclosed.