Abstract: A server auxiliary operating system is disclosed, which includes a case, a plurality of swappable GPUs and a printed circuit back plane. The case includes a bottom board and a first mounting bay located at the front portion of the case. The swappable GPUs are disposed in the first mounting bay. The printed circuit back plane is disposed on the bottom board and has a plurality of first interfaces and a plurality of second interfaces electrically corresponding to the first interfaces, wherein the swappable GPUs are respectively coupled to the first interfaces, and the servers are respectively electrically connected to the corresponding swappable GPUs through the second interfaces respectively connected to the servers so as to expand the server operation capability.

Abstract: A server auxiliary operating system is disclosed, which includes a case, a plurality of swappable GPUs and a printed circuit back plane. The case includes a bottom board and a first mounting bay located at the front portion of the case. The swappable GPUs are disposed in the first mounting bay. The printed circuit back plane is disposed on the bottom board and has a plurality of first interfaces and a plurality of second interfaces electrically corresponding to the first interfaces, wherein the swappable GPUs are respectively coupled to the first interfaces, and the servers are respectively electrically connected to the corresponding swappable GPUs through the second interfaces respectively connected to the servers so as to expand the server operation capability.

Abstract: A server device with a storage array module is provided. The server device includes a chassis, a motherboard module, and a storage array module. The motherboard module and the storage array module are disposed in the chassis. The storage array module includes a first tray removably disposed in the chassis, a hard disk back panel fixed to a bottom of the first tray, and several hard disks hot-pluggably disposed in the first tray. The hard disk back panel is electrically connected to the motherboard module, and the hard disks are electrically connected to the hard disk back panel and driven to move into/out the chassis with the first tray.

Abstract: A server device with a storage array module is provided. The server device includes a chassis, a motherboard module, and a storage array module. The motherboard module and the storage array module are disposed in the chassis. The storage array module includes a first tray removably disposed in the chassis, a hard disk back panel fixed to a bottom of the first tray, and several hard disks hot-pluggably disposed in the first tray. The hard disk back panel is electrically connected to the motherboard module, and the hard disks are electrically connected to the hard disk back panel and driven to move into/out the chassis with the first tray.

Abstract: A sever including a chassis, at least one first tray, at least one second tray, a power supply module, multiple input/output interface circuit boards, and multiple mother boards is provided. The first and second trays are slidably disposed in the chassis, and the first and second trays can be drawn out of the chassis in opposite directions. The power supply module is disposed on a bottom plate of the chassis. The input/output interface circuit boards are disposed on the first tray, respectively. The power supply module is located between two input/output interface circuit boards. Each input/output interface circuit board has multiple input/output interfaces. The mother boards are disposed on the second trays, respectively. The input/output interface circuit boards and the power supply module are correspondingly electrically connected to the mother boards.

Abstract: A sever including a chassis, at least one first tray, at least one second tray, a power supply module, multiple input/output interface circuit boards, and multiple mother boards is provided. The first and second trays are slidably disposed in the chassis, and the first and second trays can be drawn out of the chassis in opposite directions. The power supply module is disposed on a bottom plate of the chassis. The input/output interface circuit boards are disposed on the first tray, respectively. The power supply module is located between two input/output interface circuit boards. Each input/output interface circuit board has multiple input/output interfaces. The mother boards are disposed on the second trays, respectively. The input/output interface circuit boards and the power supply module are correspondingly electrically connected to the mother boards.

Abstract: A structure of a bond pad to prevent probe pin contamination is disclosed herein a first conductor layer is formed on the substrate. A passivation layer including a titanium nitride layer, a silicon nitride layer, and a silicon oxide layer is formed on the first conductor layer. A photoresist layer is patterned on the passivation layer to define a contact hole, and then etching the passivation layer using the photoresist layer as a mask to form the contact hole. A second conductor layer serving as a top metal of bond pad harder than the first conductor layer is selectively deposited on the first conductor layer, and filled in the contact hole. The present invention can reduce a probe pin contamination so that extend the probe pin lifetime using this selective deposition technique to form the pond pad structure. Additionally, the structure can prevent the contact resistance between the probe pin head and the bond pad increasing, and reduce the probe pin overkill ratio.