Abstract: A method of depositing a copper interconnection layer on a substrate for use in a flat panel display interconnection system, comprising the steps of: a) coating said substrate with a photoresist layer; b) patterning said photoresist layer to obtain a patterned photoresist substrate comprising at least one trench patterned into said photoresist layer; c) providing a first catalyzation layer onto the patterned photoresist substrate; d) providing an electroless plated layer of an insulation layer deposited onto said first catalyzation layer; e) removing the successively superimposed photoresist layer, catalyzation layer and insulation layer except in the at least one trench, to obtain a pattern of the first catalyzation layer with an insulation layer deposited thereon.

Abstract: The invention is directed to a solar cell. The solar cell comprises a silicon layer, a front side electrode and a back side electrode. The silicon layer has a first surface and a second surface. The front side electrode is located on the first surface of the silicon layer. The back side electrode is located on the second surface of the silicon layer. Further, the back side electrode comprises a passivation layer, a first conductive layer and a second conductive layer. The passivation layer is located on the second surface of the silicon layer and has a plurality of holes penetrating through the passivation layer. The first conductive layer is located on the passivation layer and is electrically connected to the silicon layer through the holes. The second conductive layer is located on the first conductive layer.

Abstract: Methods and apparatus for producing a copper layer on substrate in a flat panel display manufacturing process, where the copper is electrodelessly deposited on a substrate to form a copper interconnection layer. A copper solution containing: CuSO4 5H2O as a copper source, potassium sodium tartrate or trisodium citrate as a complexing agent, glyoxylate, glyoxilic acid or sodium phosphate as a reducing agent, a sulfur organic compound as a stabilizing agent, and a pH adjusting agent, is used to form the copper interconnection layer on the substrate.

Abstract: A metal bumping structure on the input/output connector of a substrate or wafer, which is a metal conductor composed of multiple metal layers overlap the connector pad, characterized in that the overlapped outer or upper metal layer is thinner than the inner or lower metal layer, and the outer or upper metal layer that form the pillar style whose conductivity, connectivity and corrosion resist are better than the inner or lower metal layer, such that the bumping connector has better conductivity, connectivity and not easy to be corroded. It combines the photoresist, exposure, development with the electroless plating method to form the patterns and shapes of the expected object; wherein, the photoresist is to limit the deposition direction of the electroless, plating. If no limit on the electroless plating, it will cause isotropic deposition, as to simultaneously strive upward and around increasing; thus the photoresist is to assist with the electroless plating to form expected patterns and shapes.