Abstract: A tape automated bonding (TAB) process in which a tape-carrier through its finger leads is bonded to composite bumps on an IC chip wherein the composite bumps are constructed by a polymeric material layer and at least one metal layer. The polymeric material layer has a lower rigidity (or a lower Young's modules) than those of the metal layers. Structural damages during the bonding process that is frequently caused by a rigid metal bump is eliminated. The TAB bonding process can be carried out by using either an all-metal lead frame, a plated metal lead frame, or a polymer reinforced metal lead frame. The polymer/metal composite bumps constructed on the IC chip require a smaller bonding force when bonded in a thermal bonder.

Abstract: There is shown an apparatus for bonding outer leads of a display panel to metal leads of a bonding tape that includes a movable stage for supporting the display panel. A light source is provided on the stage that is positioned beneath the outer leads of the panel, when mounted on the stage. A means is provided to support the bonding tape so that the metal leads are held in overlapping position over the outer leads. A means to observe the resultant overlapped leads is located over the light source. A heat source for applying heat to the aligned leads to form bonds therebetween is provided.