Abstract: A filter includes a first printed circuit board (PCB), poles mounted on the first PCB, a second PCB located at a top of the first PCB, and caps mounted on the second PCB and covering the poles. Each the cap surrounds the corresponding pole. The cap and the pole cooperatively form a resonator. Each the first PCB and the second PCB is made of light, dielectric material with metallic layers.

Abstract: A filter includes a first printed circuit board (PCB), poles mounted on the first PCB, a second PCB located at a top of the first PCB, and caps mounted on the second PCB and covering the poles. Each the cap surrounds the corresponding pole. The cap and the pole cooperatively form a resonator. Each the first PCB and the second PCB is made of light, dielectric material with metallic layers.

Abstract: A harmonic suppression device includes a multilayer printed circuit board (PCB). The multilayer PCB includes a first layer, a second layer, and a third layer. The third layer is connected to the ground. The first layer is configured with a power amplifier, an input microstrip, a voltage divider microstrip, and an output microstrip. The power amplifier is operable to amplify radio frequency (RF) signals input using the input microstrip and to output the amplified RF signals using the output microstrip. The second layer is configured with a first microstrip and a second microstrip. One end of each of the first and second microstrips is connected to an alternative one of the first layer and the third layer by vias, and the other ends of the first and second microstrips are unattached so as to suppress harmonics on the power amplifier.

Abstract: A RF circuit includes a master PCB, a plurality of slave PCBs and a plurality of antennas. The master PCB includes at least two RF ICs and at least two transceiving diplexer groups for tranceiving different frequency bands. Each transceiving diplexer group includes a plurality of transceiving diplexers transceiving a same frequency band and electrically connected to the RF ICs via PCB tracks without intersection. Each slave PCB includes a frequency division diplexer electrically connected to at least two transceiving diplexers respectively belonging to different tranceiving diplexer groups for respectively transmitting different frequency bands. Each antenna electrically connects to one of the division diplexers.

Abstract: A harmonic suppression device includes a multilayer printed circuit board (PCB). The multilayer PCB includes a first layer, a second layer, and a third layer. The third layer is connected to the ground. The first layer is configured with a power amplifier, an input microstrip, a voltage divider microstrip, and an output microstrip. The power amplifier is operable to amplify radio frequency (RF) signals input using the input microstrip and to output the amplified RF signals using the output microstrip. The second layer is configured with a first microstrip and a second microstrip. One end of each of the first and second microstrips is connected to an alternative one of the first layer and the third layer by vias, and the other ends of the first and second microstrips are unattached so as to suppress harmonics on the power amplifier.

Abstract: A RF circuit includes a master PCB, a plurality of slave PCBs and a plurality of antennas. The master PCB includes at least two RF ICs and at least two transceiving diplexer groups for tranceiving different frequency bands. Each transceiving diplexer group includes a plurality of transceiving diplexers transceiving a same frequency band and electrically connected to the RF ICs via PCB tracks without intersection. Each slave PCB includes a frequency division diplexer electrically connected to at least two transceiving diplexers respectively belonging to different tranceiving diplexer groups for respectively transmitting different frequency bands. Each antenna electrically connects to one of the division diplexers.