Abstract: A structure of reaction chamber of semiconductor sputtering equipment is disclosed, including a chamber case, an elevation platform, a plurality of target fixing elements, a carrier ring and a covering protective ring, wherein the contact surface of the target fixing element, the ring-shaped protruding surface of the carrier ring and the attachment surface of the covering protective ring are all coarse surfaces with uneven patterns. As such, during sputtering, the contact surface, ring-shaped protruding surface and attachment surface can withstand the deposition thickening and extend the cycle of cleaning components and life span so as to improve utilization rate of the equipment and reduce the manufacturing cost.

Abstract: A structure of reaction chamber of semiconductor sputtering equipment is disclosed, including a chamber case, an elevation platform, a plurality of target fixing elements, a carrier ring and a covering protective ring, wherein the contact surface of the target fixing element, the ring-shaped protruding surface of the carrier ring and the attachment surface of the covering protective ring are all coarse surfaces with uneven patterns. As such, during sputtering, the contact surface, ring-shaped protruding surface and attachment surface can withstand the deposition thickening and extend the cycle of cleaning components and life span so as to improve utilization rate of the equipment and reduce the manufacturing cost.

Abstract: In a reaction chamber for manufacturing semiconductor devices, flat displays, solar panels, a thermal spray ceramic coating with special geometric patterns is provided on structural parts in the reaction chamber. The geometric patterns of the ceramic coating are designed according to operating conditions in the reaction chamber, such as the energy source and the plasma producing gases being used, the intended plasma distribution and subsequent reactions in the reaction chamber, and compositions of the ceramic coating. To form the ceramic coating with special geometric patterns, a special masking process is adopted, and, after the forming of the ceramic coating with desired geometric patterns, a post grit blasting treatment is conducted to obtain a desired surface coarseness for the ceramic coating.