Abstract: A method of fabricating semiconductor devices using dual damascene processes to form plugs in the via holes composed of various high etch materials and bottom anti-reflection coating (BARC) materials. After via hole etch, a layer of high etch rate plug material is spin coated to fill the via holes. Next, a layer of photoresist is applied. The photoresist is then exposed through a mask and developed to form an etch opening. Using the remaining photoresist as an etch mask and with a bottom anti-reflection coating (BARC) as protection, the oxide or low k layer is etched to form subsequent wiring. The etch step is known as a damascene etch step. The remaining photoresist is removed and the trench/via openings are filled with metal forming inlaid metal interconnect wiring and contact vias.

Abstract: A new and improved method for measuring dimensions of a photoresist pattern profile on a wafer substrate during photolithography for the fabrication of integrated circuits on the substrate. According to one embodiment, the method includes fixing the photoresist pattern profile on the substrate using a spin-on glass (SOG) procedure. In another embodiment, the method includes fixing the photoresist pattern profile on the substrate using a sputter oxide (SO) procedure. The fixed photoresist pattern is then subjected to a microscopy procedure, typically transmission electron microscopy (TEM), to measure the exact linewidth and other dimensions of the profile. The method prevents distortion of the profile during fixation and facilitates an accurate determination of the profile dimensions.

Abstract: A method of fabricating semiconductor devices using dual damascene processes to form plugs in the via holes composed of various high etch materials and bottom anti-reflection coating (BARC) materials. After via hole etch, a layer of high etch rate plug material is spin coated to fill the via holes. Next, a layer of photoresist is applied. The photoresist is then exposed through a mask and developed to form an etch opening. Using the remaining photoresist as an etch mask and with a bottom anti-reflection coating (BARC) as protection, the oxide or low k layer is etched to form subsequent wiring. The etch step is known as a damascene etch step. The remaining photoresist is removed and the trench/via openings are filled with metal forming inlaid metal interconnect wiring and contact vias.

Abstract: A new and improved method for measuring dimensions of a photoresist pattern profile on a wafer substrate during photolithography for the fabrication of integrated circuits on the substrate. According to one embodiment, the method includes fixing the photoresist pattern profile on the substrate using a spin-on glass (SOG) procedure. In another embodiment, the method includes fixing the photoresist pattern profile on the substrate using a sputter oxide (SO) procedure. The fixed photoresist pattern is then subjected to a microscopy procedure, typically transmission electron microscopy (TEM), to measure the exact linewidth and other dimensions of the profile. The method prevents distortion of the profile during fixation and facilitates an accurate determination of the profile dimensions.

Abstract: A method for reducing light reflectance in photolithographic manufacturing process is disclosed including providing an inter-metal dielectric (IMD) layer including at least one via opening extending substantially perpendicular to a thickness therethrough, and, conformally forming an anti-reflectance coating (ARC) layer over said IMD layer such that the ARC layer is formed over sidewalls of the at least one via opening to reduce light reflectance.