Abstract: A gaseous polishing apparatus and a nozzle device designed for gaseous polishing perform precision polishing on a surface of an object to be polished. The nozzle device includes a nozzle body having a nozzle opening provided at a downstream end thereof for ejecting polishing gas. A shutter device is disposed in proximity to the nozzle opening so as to control ejecting and stopping of the polishing gas towards the object surface. A control mechanism controls opening and closing action of the shutter device.

Abstract: A polishing apparatus can replace or be used in association with a conventional chemical mechanical polishing method to produce a high quality flat surface in a more efficient manner. The polishing apparatus utilizes a nozzle device, disposed to face a work surface of a workpiece, for performing gas polishing by ejecting a reactive polishing gas to the work surface. The nozzle device comprises a nozzle assembly having nozzles that has a plurality of differing diameters. A nozzle selection device is provided for selecting an operative nozzle having a desired diameter from the nozzle assembly and ejecting the polishing gas through a selected nozzle.