Abstract: A thermal siphon structure includes a main body, a chamber disposed therein, an evaporation section, a condensation section and a connection section positioned between the evaporation section and condensation section. The evaporation section and condensation section are respectively arranged in the chamber on two sides thereof. The connection section has a set of first communication holes and a set of second communication holes in communication with the evaporation section and condensation section. The evaporation section and condensation section respectively have multiple first and second flow guide bodies, which are arranged at intervals to define therebetween first and second flow ways. Each of the first and second flow ways has a narrower end and a wider end. The first flow ways communicate with a free area. The condensation section is designed with a low-pressure end to create a pressure gradient for driving a working fluid to circulate without any capillary structure.

Abstract: A pressure difference driven heat spreader includes a chamber defined in a main body; a vaporizing section arranged in the chamber and including a plurality of first flow-guiding members spaced from one another to define first flow passages therebetween, the first flow passages each having at least one free end communicating with a free zone; a condensing section arranged in the chamber opposite to the vaporizing section and including a plurality of second flow-guiding members spaced from one another to define second flow passages therebetween; and an interconnecting section arranged between the vaporizing and condensing sections and having first and second communicating holes for communicating the vaporizing section with the condensing section. The condensing section functions as a low-pressure end, so that a pressure gradient is produced in the pressure difference driven heat spreader to drive steam-water circulation therein, and no wick structure is needed for driving the working fluid.

Abstract: A spiral heat exchanger includes two assembled covers defining a chamber therebetween for receiving a spiral unit therein. The spiral unit includes a first and a second spiral member separately spirally extending from a central outlet to a peripheral outlet on the two covers to respectively form a first and a second flow passage. A driving unit is assembled to and drives the assembled covers to rotate at the same time, so that cold and hot airflows respectively enter and flow through the first and second spiral members from the central outlet to the peripheral outlet under a centrifugal force to exchange heat at the spiral unit. The spiral unit provides extended flow passages and increased heat exchange area, giving the spiral heat exchanger increased heat transfer capacity and heat exchange efficiency and allowing omission of fans and radiating fin assembly to eliminate operating noise and accumulated dust.

Abstract: A heat exchanger includes a body having a center and a spiral guiding trough extending spirally and outwardly from the center toward an outside of the center. The radius of the spiral guiding trough increases gradually from the center toward the outside of the center. A first port and a second port are in communication with the spiral guiding trough respectively. With the combination of the spiral guiding trough and the body, the fluid can be sufficiently mixed in the spiral guiding trough, thereby achieving an excellent thermal-conducting effect.

Abstract: A heat pipe structure includes a pipe body and a convection device. The pipe body defines a chamber enclosed in an inner wall of the pipe body. The convection device includes a rotary unit and a driving unit for creating a fluid pressure gradient in the chamber of the pipe body. The rotary unit and the driving unit are respectively located at an interior and an exterior of the pipe body. When the driving unit is excited, the rotary unit is driven to rotate under magnetic induction. With the fluid pressure gradient created in the chamber of the pipe body, the circulation of the working fluid in the chamber can be improved, and a forced convection flow of the working fluid in the pipe body is enabled to largely increase the heat transfer efficiency and heat transfer effect of the heat pipe.

Abstract: An inclined waved board and a heat exchanger thereof. The inclined waved board includes a board body composed of continuous waved sections. The waved sections are respectively inclined from a first side to a second side, inclined from the first side to a third side and inclined from a fourth side to the second side of the board body by an inclination. The waved sections define multiple raised sections and recessed sections on two faces of the board body. The heat exchanger is composed of multiple board bodies arranged adjacent to and in parallel to each other. Each two adjacent board bodies define therebetween a flow way. When fluids flow through the flow ways, the inclined waved sections enhance turbulence intensity and guide the fluids to produce secondary flows along the cross-sections of the flow ways so as to form dynamic three-dimensional swirling flow structure in the waved flow ways.

Abstract: A refrigeration system and refrigeration method thereof utilizing the principle of thermodynamics comprises a compressor, an air cooler connected to the compressor, an expander having a first end connected to the air cooler, a second end connected to the compressor, and a third end as an outlet wherein air pressure and air temperature are increased by the compressor, the pressurized high temperature air is fed to the air cooler, the pressurized low temperature air is fed to the expander for converting enthalpy of air into work to activate the compressor, energy contained in the air at the outlet of the expander is decreased, and temperature at the outlet of the expander is decreased. According to the present invention power is recycled in the process of conversion.

Abstract: Disclosed is heat dissipation device with circulating liquid coolant. The device comprises a liquid pump; a cooling unit mounted on a heat source of a high power electronic chipset, the cooling unit comprising passages for permitting coolant to pass through, each passage comprising a plurality of recessed and raised portions; a heat sink; and a pipe containing pressurized coolant, the pipe being passed through the liquid pump, the passages of the cooling unit, and the heat sink for forming a closed cooling loop. The recessed and the raised portions in the passage are capable of increasing fluid mixing or turbulence and vortex of coolant, generating a secondary swirling flow by different attack angles of coolant, and generating a chaotic advection at each of a plurality of flow passage when the liquid pump generates the adequate pulsating pressure waves, thereby carrying away heat generated by the high power electronic chipset and circulating coolant through the passages and dissipated at the heat sink.

Abstract: Disclosed is an electronic chipset or CPU cooler. The cooler comprises a rectangular heat sink including four side legs securely snapped together with the chipset or CPU for forming a space between an underside of the heat sink and a top of the chipset or CPU and a plurality of apertures arranged in a form of rows and columns. A path of jets set up by the activated fan is from the fan to the top of the chipset or CPU via the apertures and the space. The invention has several configurations.

Abstract: Disclosed is heat dissipation device with circulating liquid coolant. The device comprises a liquid pump; a cooling unit mounted on a heat source of a high power electronic chipset, the cooling unit comprising passages for permitting coolant to pass through, each passage comprising a plurality of recessed and raised portions; a heat sink; and a pipe containing pressurized coolant, the pipe being passed through the liquid pump, the passages of the cooling unit, and the heat sink for forming a closed cooling loop. The recessed and the raised portions in the passage are capable of increasing fluid mixing or turbulence and vortex of coolant, generating a secondary swirling flow by different attack angles of coolant, and generating a chaotic advection at each of a plurality of flow passage when the liquid pump generates the adequate pulsating pressure waves, thereby carrying away heat generated by the high power electronic chipset and circulating coolant through the passages and dissipated at the heat sink.

Abstract: Disclosed is an electronic chipset or CPU cooler. The cooler comprises a rectangular heat sink including four side legs securely snapped together with the chipset or CPU for forming a space between an underside of the heat sink and a top of the chipset or CPU and a plurality of apertures arranged in a form of rows and columns. A path of jets set up by the activated fan is from the fan to the top of the chipset or CPU via the apertures and the space. The invention has several configurations.

Abstract: A CPU cooler based on a flow field of impinging jet array includes a cooling base having an array of recesses on a top surface. The cooling base is disposed on a CPU. An orifice plate of a size substantially similar to the cooling base has an array of orifices with each orifice corresponding to a recess of the array of recesses. The orifice plate is spaced above the cooling base by a separation distance. A fan is secured to the CPU, with the cooling base and orifice plate being secured between the fan and the CPU. The fan when activated provides a coolant flow that produces vortical flow structures with enhanced turbulence on each recess by impinging air jets onto the recesses through the orifices corresponding to the recesses, thereby dissipating heat generated fly the running CPU.

Abstract: A flow field of impinging jet array based CPU cooler is provided. The cooler comprises a cooling base having an array of recess on a top surface, the cooling base being rested on CPU; a substantially similar sized orifice plate having an array of orifice each corresponding to recess, orifice plate being above cooling base by a separation distance; and a fan with cooling base and orifice plate enclosed therein and secured on the CPU. An activated fan provides coolant flow that produces the vortical flow structures with enhanced turbulence on each recess by impinging air jets onto the recesses through the orifices, thereby convecting the heat flux generated from the running CPU. Also, the orifices may be oblique other than vertical.