Abstract: A cryoablation catheter for treatment of hypertrophic cardiomyopathy is disclosed. The cryoablation catheter includes: a vacuum zone provided therein with an inlet into which liquid coolant is injected and an outlet from which the liquid coolant discharged, wherein rest parts other than the inlet and the outlet therein are maintained in a vacuum state; a body part separated from the vacuum zone and provided at the front end thereof, wherein an end of the inlet and an end of the outlet communicate with each other, and wherein the body part includes a freeze zone for cooling surroundings by expanding of the liquid coolant exiting through a tip provided at the end of the inlet; and a tapered tip provided at an end of the body part, wherein a guidewire lumen for insertion of a guidewire thereinto is provided, and wherein the tapered tip is tapered toward an end thereof.

Abstract: A semiconductor package includes: a substrate having conductive lead patterns formed on a bottom surface of the substrate; a semiconductor chip electrically connected to the substrate by bonding wires or bumps and flip-chip bonding; and an encapsulating body that encapsulates the semiconductor chip. The semiconductor package can further include a deformation preventing pattern that is under the semiconductor chip to reduce warpage of the package. In accordance with another embodiment of the invention, a method for forming the semiconductor package includes: preparing the substrate; electrically connecting the chip to the conductive pattern; and encapsulating semiconductor chip. The packages and manufacturing methods in accordance with the present invention employ common packaging components and processes to avoid the extra cost and difficulties associated with conventional fine-pitch plastic packages.

Abstract: A lead frame for manufacturing semiconductor device packages has inner leads, tie bars and a die pad that are formed with irregular dimples on their respective upper and lower surfaces. This improves the bonding strength between the lead frame and the molding compound as well as between the die pad and a semiconductor device. The dimples are formed during the manufacture of the lead frame which allows the lead frame to be economically and easily manufactured.

Abstract: Semiconductor devices having bonding wires are encapsulated in a fluid molding resin, and the flow front of the molding resin can displace the bonding wires and create a short of the device. A semiconductor IC device is provided with dummy bonding wires to prevent or reduce the wire displacement by blocking the remaining bonding wires from direct exposure to the molding resin flow front in the mold cavity. Wire displacement or sweep of the dummy bonding wires causes the dummy bonding wires to contact their adjacent remaining bonding wires, but this contact does not cause a short in the device. The size of the semiconductor IC device is thereby reduced by increasing the allowable length of the bonding wires in the device, resulting in improved yields and lower production costs.