Abstract: In a terminal including a display unit, a central processing unit, and an input unit, when a phasic operation command having a specific phase is input onto the display unit, the input unit outputs the phasic operation command and the central processing unit recognizes the phase of the phasic operation command and outputs information corresponding to the recognized phase to the display unit. Without giving a screen switching command plural times, information correlated with information currently displayed on the screen can be effectively displayed on the display screen.

Abstract: Stacked panel housings are stretched to join displays to each other to form a single screen, the stacked panel housings are stretched and two displays are jointed to each other to form a single screen. Horizontal sliding means and vertical moving means can be provided so as to displace the stacked displays to be flush with each other. A portable display device is provided which has at least two panel housings vertically stacked and displays mounted on the panel housings, respectively, in which the displays horizontally slide and then vertically move so as for the displays of the panel housings to be contiguous to each other. When the displays are contiguous to each other, the distance between the displays is in the range of 0.1 mm to 5 mm and a joint between the displays is provided with a lid.

Abstract: A portable display device is provided in which two display panels are joined to each other to form a single screen when two panel housings are unfolded from a folded state. The portable display device includes at least two panel housings and display panels that are mounted on the panel housings, respectively. When the panel housings are unfolded, the display panels are joined to each other to form a single screen. The distance between the display panels when the display panels are contiguous to each other is less than 3 mm and the distance between input units or between input sensors is less than 3 mm.

Abstract: A receiver for a wireless charging system, capable of receiving power energy using non-contact type magnetic induction, includes a coil capable of receiving the power energy and a part for generating a predetermined output power from the power energy received by the coil, a portable terminal, an NFC coil further provided outside of the coil, and a ferrite sheet further provided at the coil and the NFC coil.

Abstract: An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.

Abstract: Stacked panel housings are stretched to join displays to each other to form a single screen, the stacked panel housings are stretched and two displays are jointed to each other to form a single screen. Horizontal sliding means and vertical moving means can be provided so as to displace the stacked displays to be flush with each other. A portable display device is provided which has at least two panel housings vertically stacked and displays mounted on the panel housings, respectively, in which the displays horizontally slide and then vertically move so as for the displays of the panel housings to be contiguous to each other. When the displays are contiguous to each other, the distance between the displays is in the range of 0.1 mm to 5 mm and a joint between the displays is provided with a lid.

Abstract: Embedded packages are provided. The embedded package includes a chip attached to a first surface of a core layer, a plurality of bumps on a surface of the chip opposite to the core layer, and a first insulation layer surrounding the core layer, the chip and the plurality of bumps. The first insulation layer has a trench disposed in a portion of the first insulation layer to expose the plurality of bumps.

Abstract: An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.

Abstract: Provided is a wireless charging system having different wireless modes, the system comprising: a method of providing a coil having different charging modes in one set, which is performed by providing separate coils or providing a lead wire in the middle of one coil, when the coil having at least two different charging modes is provided in the one set in a receiver for the wireless charging system using non-contact magnetic induction, wherein when one charging mode is selected for one coil set, a status value of the coil for transmitting and receiving wireless power energy is detected, thereby enabling the one charging mode to be selected, and different charging modes is mounted in one wireless charging system so that a charging mode appropriate for optimum conditions can be selected according to states and charging conditions wireless power transmitting and receiving devices.

Abstract: A separable portable multi-display device is provided. A portable multi-display device includes a main body panel housing having a first display, a sub-panel housing having a second display, and a coupling device for coupling the main body panel housing to the sub-panel housing such that at least one sides of the first display and the second display can contact each other. The panel housings are separable from and connectable to each other, a range of a border between the displays when the panel housings are interconnected being minimized so that the displays can be shown as if it is driven as a single screen.

Abstract: An embedded package in which active elements, such as semiconductor chips, are embedded within a package substrate. The semiconductor chips, embedded within a dielectric layer, are coupled with circuit wires to ensure electrical and signal continuity. When connections between the semiconductor chip and the package substrate are performed in different directions, there is a reduction in overall interconnection area, connection reliability is improved, leakage currents are reduced, and higher device yields can be realized.

Abstract: A semiconductor package includes a substrate having a connection terminal with a groove on its surface. Nanopowder may be disposed on a bottom of the groove. A semiconductor chip may be flip-chip bonded to the substrate by the nanopowder. A filler member may be interposed between the substrate and the semiconductor chip.

Abstract: A stack package includes a first semiconductor chip first pads and second pads disposed thereon and a second semiconductor chip having third pads and fourth pads electrically connected with the second pads disposed thereon. Capacitors are interposed between the first semiconductor chip and the second semiconductor chip, and include first electrodes electrically connected with the first pads of the first semiconductor chip, second electrodes electrically connected with the third pads of the second semiconductor chip, and dielectrics interposed between the first electrodes and the second electrodes.

Abstract: An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.

Abstract: An embedded package that may be realized by surrounding a semiconductor chip (or a semiconductor die) in a package substrate. A semiconductor chip of an embedded package may be electrically connected to external connection terminals through interconnection wires instead of bumps, and the interconnection wires may be formed using a wire bonding process. A high reliability embedded package results.

Abstract: A semiconductor package includes a first semiconductor chip having first bumps which are projectedly formed thereon; a first copper foil attachment resin covered on the first semiconductor chip to embed the first semiconductor chip, and formed such that a first copper foil layer attached on an upper surface of the first copper foil attachment resin is electrically connected with the first bumps; a second copper foil attachment resin including a second copper foil layer which is electrically connected with the first copper foil layer, and disposed on the first copper foil attachment resin; and a second semiconductor chip embedded in the second copper foil attachment resin in such a way as to face the first semiconductor chip, and having second bumps formed thereon which are electrically connected with the second copper foil layer.

Abstract: A portable display device is provided in which two display panels are joined to each other to form a single screen when two panel housings are unfolded from a folded state. The portable display device includes at least two panel housings and display panels that are mounted on the panel housings, respectively. When the panel housings are unfolded, the display panels are joined to each other to form a single screen. The distance between the display panels when the display panels are contiguous to each other is less than 3 mm and the distance between input units or between input sensors is less than 3 mm.

Abstract: A semiconductor package includes a first semiconductor chip having first bumps which are projectedly formed thereon; a first copper foil attachment resin covered on the first semiconductor chip to embed the first semiconductor chip, and formed such that a first copper foil layer attached on an upper surface of the first copper foil attachment resin is electrically connected with the first bumps; a second copper foil attachment resin including a second copper foil layer which is electrically connected with the first copper foil layer, and disposed on the first copper foil attachment resin; and a second semiconductor chip embedded in the second copper foil attachment resin in such a way as to face the first semiconductor chip, and having second bumps formed thereon which are electrically connected with the second copper foil layer.

Abstract: A semiconductor package includes a substrate having a connection terminal with a groove on its surface. Nanopowder may be disposed on a bottom of the groove. A semiconductor chip may be flip-chip bonded to the substrate by the nanopowder. A filler member may be interposed between the substrate and the semiconductor chip.

Abstract: The present invention is directed to a portable display device having at lease two display elements, at least two foldable panel housings for receiving and supporting the display elements circuit boards and other parts, respectively, and optical elements provided on the top surface of the one of the sidewalls of the panel housings and mounted in a joint portion of the display elements, wherein one of the sidewalls of the panel housings are cut to form openings or a connecting joint portion, and the sidewalls of the optical elements is adjacently disposed each other when the panel housings are unfolded. The portable display device allows a single large sized screen, and whereby a joint portion between the two display panels as non-display area may be minimized.