Patents by Inventor Si Hyeong Kim

Si Hyeong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • X-ray imaging apparatus and method for controlling the same
    Patent number: 11957495
    Abstract: An X-ray imaging apparatus includes an imaging device configured to capture a camera image of a target; a controller configured to stitch a plurality of X-ray images of respective divided regions of the target to generate one X-ray image of the target; and a display configured to display a settings window that provides a GUI for receiving a setting of an X-ray irradiation condition for the respective divided regions, and display the camera image in which positions of the respective divided regions are displayed.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho Jun Lee, Ju Hwan Kim, Se Hui Kim, Seung-Hoon Kim, Si Won Park, Phill Gu Jung, Duhgoon Lee, Myung Jin Chung, Do Hyeong Hwang, Sung Jin Park
  • Recycled polishing pad
    Patent number: 11541504
    Abstract: A recycled polishing pad includes an upper layer pad and a supplementary pad. The upper layer pad includes a first surface and a second surface opposite to the first surface. The first surface has a plurality of first grooves and the second surface has a plurality of second grooves. The upper layer pad further includes a connecting body connecting the first grooves and the second grooves. The supplementary pad is in contact with the second surface of the upper layer pad. A depth of each of the first grooves is less than a depth of each of the second grooves.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: January 3, 2023
    Inventors: Bong Su Ahn, Pal Kon Kim, Young Jun Yoo, Si Hyeong Kim, Yoon Ho Kim, Jin Ok Moon, Seung Taek Oh
  • RECYCLED POLISHING PAD
    Publication number: 20200238472
    Abstract: A recycled polishing pad includes an upper layer pad and a supplementary pad. The upper layer pad includes a first surface and a second surface opposite to the first surface. The first surface has a plurality of first grooves and the second surface has a plurality of second grooves. The upper layer pad further includes a connecting body connecting the first grooves and the second grooves. The supplementary pad is in contact with the second surface of the upper layer pad. A depth of each of the first grooves is less than a depth of each of the second grooves.
    Type: Application
    Filed: June 28, 2019
    Publication date: July 30, 2020
    Inventors: Bong Su Ahn, Pal Kon Kim, Young Jun Yoo, Si Hyeong Kim, Yoon Ho Kim, Jin Ok Moon, Seung Taek Oh