Abstract: An array test apparatus includes a signal transmission unit which transmits a data signal to each of a plurality of data lines of a low-temperature polysilicon (“LTPS”) substrate, a signal measurement unit which measures the data signal of each of the data lines of the LTPS substrate, a timer which generates a horizontal period for setting a section in which the data signal is transmitted from the signal transmission unit to each of the data lines and a section in which the data signal output from each of the data lines is measured by the signal measurement unit, and a determination unit which determines whether each of the data lines of the LTPS substrate is normal based on the data signal measured by the signal measurement unit.

Abstract: An array test apparatus includes a signal transmission unit which transmits a data signal to each of a plurality of data lines of a low-temperature polysilicon (“LTPS”) substrate, a signal measurement unit which measures the data signal of each of the data lines of the LTPS substrate, a timer which generates a horizontal period for setting a section in which the data signal is transmitted from the signal transmission unit to each of the data lines and a section in which the data signal output from each of the data lines is measured by the signal measurement unit, and a determination unit which determines whether each of the data lines of the LTPS substrate is normal based on the data signal measured by the signal measurement unit.

Abstract: An array test apparatus includes a signal transmission unit which transmits a data signal to each of a plurality of data lines of a low-temperature polysilicon (“LTPS”) substrate, a signal measurement unit which measures the data signal of each of the data lines of the LTPS substrate, a timer which generates a horizontal period for setting a section in which the data signal is transmitted from the signal transmission unit to each of the data lines and a section in which the data signal output from each of the data lines is measured by the signal measurement unit, and a determination unit which determines whether each of the data lines of the LTPS substrate is normal based on the data signal measured by the signal measurement unit.

Abstract: Disclosed is a method for repairing an oxide thin film, including repairing the oxide thin film by forming a repairing material that contains an oxide at a defect of the oxide thin film.

Abstract: An array test device for a display panel includes a stage on which the display panel including a plurality of pixel circuits is disposed, a contact unit including a plurality of probe pins, an adjustment unit which adjusts the contact unit such that the probe pins contact a plurality of pads of the display panel, and a testing unit which applies an array test signal to the pixel circuits of the display panel through the probe pins and the pads, receives a test result signal from the pixel circuits through the pads and the probe pins, generates waveform information representing a waveform of the test result signal, and determines whether the pixel circuits are defective based on the waveform information.

Abstract: An array test apparatus includes a signal transmission unit which transmits a data signal to each of a plurality of data lines of a low-temperature polysilicon (“LTPS”) substrate, a signal measurement unit which measures the data signal of each of the data lines of the LTPS substrate, a timer which generates a horizontal period for setting a section in which the data signal is transmitted from the signal transmission unit to each of the data lines and a section in which the data signal output from each of the data lines is measured by the signal measurement unit, and a determination unit which determines whether each of the data lines of the LTPS substrate is normal based on the data signal measured by the signal measurement unit.

Abstract: Disclosed is a method for repairing an oxide thin film, including repairing the oxide thin film by forming a repairing material that contains an oxide at a defect of the oxide thin film.

Abstract: Provided is a composition for forming tin oxide semiconductor including a tin precursor compound, an antimony precursor compound, and a solvent, according to an aspect of the present disclosure. Also provided is a method of forming a tin oxide semiconductor thin film. The method includes preparing a composition including a tin precursor compound and an antimony precursor compound dissolved in a solvent; disposing the composition on a substrate; and performing a heat treatment on the substrate coated with the composition.

Abstract: The present invention disclosed herein relates to a method for forming an oxide film and a method for fabricating an oxide thin film transistor, and more particularly, to a method for forming an oxide film and a method for fabricating an oxide thin film transistor which employ a germanium doping. A method for forming an oxide thin film according to an embodiment of the present invention, the method includes: applying a metal compound on a substrate; and heat-treating the substrate, wherein the metal compound solution is prepared by dissolving an indium compound, a zinc compound and a germanium compound in a solvent.

Abstract: A method of forming a tin oxide semiconductor thin film includes preparing a precursor solution including a tin oxide semiconductor, coating the precursor solution on a substrate; and performing a heat treatment on the substrate coated with the precursor solution. A tin compound having a different tin valence according to a semiconductor type of the tin oxide semiconductor may be used in the precursor solution.

Abstract: Provided is a composition for forming tin oxide semiconductor including a tin precursor compound, an antimony precursor compound, and a solvent, according to an aspect of the present disclosure. Also provided is a method of forming a tin oxide semiconductor thin film. The method includes preparing a composition including a tin precursor compound and an antimony precursor compound dissolved in a solvent; disposing the composition on a substrate; and performing a heat treatment on the substrate coated with the composition.