Abstract: A backlight unit includes: a light guide plate through which light is provided to a display panel which displays an image with the light; a light source which emits the light to the light guide plate, the light source disposed facing a light incident side surface of the light guide plate; and a wavelength-converting film through which emitted light from the light source is wavelength-converted and provided to the light incident side surface of the light guide plate. The wavelength-converting film includes: a first end portion thereof connected to the light guide plate, a central portion thereof disposed between the light source and the light incident side surface of the light guide plate, and glass in which wavelength-converting particles are dispersed.

Abstract: A light source unit includes: a light source circuit board; light sources disposed on the light source circuit board and which emit light; a wavelength converter disposed on the light sources to be spaced apart from the light sources and to partially overlap with the light sources; a first glass disposed between the light sources and the wavelength converter; and a second glass disposed on the wavelength converter and at least partially in direct contact with, and coupled to, the first glass.

Abstract: A wavelength conversion member includes: a first wavelength converter containing a first wavelength converting material; a second wavelength converter containing a second wavelength converting material different from the first wavelength converting material; a first container member providing a space for accommodating the first wavelength converter; and a second container member facing the first container member and providing a space for accommodating the second wavelength converter. The first container member and the second container member may be at least partially fusion-bonded with each other.

Abstract: A display device includes: a first substrate in which a display area and a non-display area disposed outside the display area are defined; a second substrate facing the first substrate; and a cell seal disposed on the non-display area, where the cell seal includes a bonding filament connecting the first substrate and the second substrate to each other.

Abstract: A backlight unit includes: a light guide plate through which light is provided to a display panel which displays an image with the light; a light source which emits the light to the light guide plate, the light source disposed facing a light incident side surface of the light guide plate; and a wavelength-converting film through which emitted light from the light source is wavelength-converted and provided to the light incident side surface of the light guide plate. The wavelength-converting film includes: a first end portion thereof connected to the light guide plate, a central portion thereof disposed between the light source and the light incident side surface of the light guide plate, and glass in which wavelength-converting particles are dispersed.

Abstract: A display device includes a backlight unit and a display panel disposed above the backlight unit, where the backlight unit includes a light guide plate, a housing which is disposed at one side of the light guide plate and accommodates a wavelength converting member, and a flexible glass film which covers one side of the housing, and a first laser welding part is disposed between the flexible glass film and the housing.

Abstract: A multi-stack joined body includes a first transparent member, a second transparent member disposed on the first transparent member, and an intermediate layer interposed between the first transparent member and the second transparent member, where a joining region in which a physical boundary is not provided between the first transparent member and the intermediate layer and between the second transparent member and the intermediate layer is provided across the first transparent member, the intermediate layer, and the second transparent member.

Abstract: A manufacturing method of a backlight unit includes providing a solder paste on a printed circuit board and forming a solder part in a first area of the printed circuit board, aligning a bank mask on the printed circuit board to align a first opening defined through the bank mask with a second area of the printed circuit board not overlapped with the first area, providing a bank material in the first opening and forming a bank on the printed circuit board in an area corresponding to the second area, separating the bank mask from the printed circuit board including the bank thereon, and connecting the solder part of the printed circuit board and a light emitting unit to each other.

Abstract: A wavelength conversion member includes: a first wavelength converter containing a first wavelength converting material; a second wavelength converter containing a second wavelength converting material different from the first wavelength converting material; a first container member providing a space for accommodating the first wavelength converter; and a second container member facing the first container member and providing a space for accommodating the second wavelength converter. The first container member and the second container member may be at least partially fusion-bonded with each other.

Abstract: A light source unit includes: a light source circuit board; light sources disposed on the light source circuit board and which emit light; a wavelength converter disposed on the light sources to be spaced apart from the light sources and to partially overlap with the light sources; a first glass disposed between the light sources and the wavelength converter; and a second glass disposed on the wavelength converter and at least partially in direct contact with, and coupled to, the first glass.

Abstract: A backlight unit includes a light guide plate; a wavelength conversion member disposed on a surface of the light guide plate; and a housing which houses the wavelength conversion member and is fused to the light guide plate.

Abstract: A light source module includes a printed circuit board including a wiring layer, an insulating coating layer disposed on the wiring layer, and a reflection adjustment pattern disposed on the insulating coating layer and having reflection characteristics which are different from reflection characteristics of the insulating coating layer, a light emitting chip mounted on the printed circuit board, and an optical lens arranged on an upper portion of the light emitting chip and fixed to the printed circuit board.

Abstract: Provided are a backlight assembly and a display device including the same. The backlight assembly comprises: a housing; a plurality of light sources disposed on the housing; a plurality of optical lenses disposed on the light sources, respectively; a main reflective sheet covering an upper surface of the housing and comprising a reflective portion and a main opening which exposes each of the optical lenses; and a sub reflective sheet disposed under each of the optical lenses, wherein the sub reflective sheet comprises a body portion and a fitting portion partially separated from the body portion and is fitted to the main reflective sheet in the reflective portion.

Abstract: A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED package is mounted on a printed circuit board is provided. The method comprises a step of not including an ESD and EMI suppressing Zener diode within the combination of the printed circuit board and the LED package and of providing within the combination of the printed circuit board and the LED package a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip and which have defined between them at least one insulative ESD and/or EMI suppressing region which breaks down in its insulative properties when subjected to voltages of absolute magnitudes greater than a predetermined threshold voltage.

Abstract: A backlight assembly includes a light emitting part, a light guide plate and a lower receiving container. The light guide plate includes a side surface and a light exiting surface. The lower receiving container includes a heat sinking part and a rigid part having a strength greater than the heat sinking part.

Abstract: A manufacturing method of a backlight unit includes providing a solder paste on a printed circuit board and forming a solder part in a first area of the printed circuit board, aligning a bank mask on the printed circuit board to align a first opening defined through the bank mask with a second area of the printed circuit board not overlapped with the first area, providing a bank material in the first opening and forming a bank on the printed circuit board in an area corresponding to the second area, separating the bank mask from the printed circuit board including the bank thereon, and connecting the solder part of the printed circuit board and a light emitting unit to each other.

Abstract: A light source module includes a printed circuit board including a wiring layer, an insulating coating layer disposed on the wiring layer, and a reflection adjustment pattern disposed on the insulating coating layer and having reflection characteristics which are different from reflection characteristics of the insulating coating layer, a light emitting chip mounted on the printed circuit board, and an optical lens arranged on an upper portion of the light emitting chip and fixed to the printed circuit board.

Abstract: Provided are a backlight assembly and a display device including the same. The backlight assembly comprises: a housing; a plurality of light sources disposed on the housing; a plurality of optical lenses disposed on the light sources, respectively; a main reflective sheet covering an upper surface of the housing and comprising a reflective portion and a main opening which exposes each of the optical lenses; and a sub reflective sheet disposed under each of the optical lenses, wherein the sub reflective sheet comprises a body portion and a fitting portion partially separated from the body portion and is fitted to the main reflective sheet in the reflective portion.

Abstract: A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED package is mounted on a printed circuit board is provided. The method comprises a step of not including an ESD and EMI suppressing Zener diode within the combination of the printed circuit board and the LED package and of providing within the combination of the printed circuit board and the LED package a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip and which have defined between them at least one insulative ESD and/or EMI suppressing region which breaks down in its insulative properties when subjected to voltages of absolute magnitudes greater than a predetermined threshold voltage.

Abstract: A display device comprises a optical member, a plurality of light sources to illuminate the optical member, a representative determining part to determine representative values of image blocks based on image signals applied to the image blocks, wherein the image blocks are arranged in a matrix and correspond to portions of a display panel, a representative integration part to integrate the representative values of the image blocks in one of a row and a column direction of the matrix and determine integrated representative values, and a light control part to control the plurality of light sources based on the integrated representative values.