Patents by Inventor Si Taek PARK

Si Taek PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240355545
    Abstract: A multilayer electronic component includes a body including a dielectric layer including Ba and Ti and an internal electrode disposed alternately with the dielectric layer; and an external electrode disposed on the body, wherein the dielectric layer further includes Li and F, and wherein a content of Li included in the dielectric layer is 0.02 mole or more and 0.36 mole or less based on 100 moles of Ba included in the dielectric layer.
    Type: Application
    Filed: April 1, 2024
    Publication date: October 24, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Ho Shin, Ji Yeon Kim, Si Taek Park, Sang Kyu Lee
  • Publication number: 20240242884
    Abstract: A multilayer electronic component includes a dielectric layer and internal electrodes; wherein the dielectric layer includes a rare earth element, Mn, and Ti. The rare earth element includes a first rare earth element including Dy and Tb, and a second rare earth element including a rare earth element different from the first rare earth element. The number of moles of the rare earth element is defined as RE, the number of moles of Dy is defined as A1, the number of moles of Tb is defined as A2 based on 100 moles of Ti included in the dielectric layer, and 0.5 mol?RE?0.9 mol and 1<A2/A1 are satisfied. The number of moles of the second subcomponent element based on 100 moles of Ti included in the dielectric layer is 0.2 mole or more and 0.5 mole or less.
    Type: Application
    Filed: September 11, 2023
    Publication date: July 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Soon KWON, Hyoung Uk KIM, Kyung Sik KIM, Ji Su HONG, Seung In BAIK, Min Young CHOI, Si Taek PARK, Jong Hwan LEE, Jae Sung PARK
  • Publication number: 20230207202
    Abstract: A multilayer electronic component includes: a body including dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed; and external electrodes disposed on the body, wherein the body includes a capacitance formation portion forming capacitance by including the first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and margin portions formed on opposite side surfaces of the capacitance formation portion, respectively, the dielectric layer and the margin portion include a BaTiO3-based main component, and the margin portion includes an oxide including Zn as a first accessory component and includes Zn in an amount of 0.5 mol% or more and less than 1.5 mol% based on 100 mol% of Ti included in the margin portion.
    Type: Application
    Filed: November 28, 2022
    Publication date: June 29, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Sik KIM, Si Taek PARK, Min Young CHOI, Jae Sung PARK