Abstract: The present prevention relates to methods for treating TNF?-related diseases by subcutaneously administering an antibody binding to TNF? (anti-TNF? antibody) or an antigen-binding fragment thereof. The treatment method, composition, kit or use according to the present invention provide an advantage of improving patient satisfaction, by improving convenience and quality of life, that is, by reducing the time required for administration and decreasing the length of stay of patients in a hospital compared to intravenous injection.

Abstract: Provided is a pharmaceutical composition for preventing, improving, or treating postmenopausal osteoporosis in women, the composition including, as an active ingredient, scopolin, a derivative thereof, or a pharmaceutically acceptable salt thereof, wherein scopolin has good efficacy in stimulating osteoblast differentiation, and is also effective in inhibiting a reduction in bone density after menopause, low density in a bone microstructure, a reduction in a bone formation marker in the blood, and an increase in a bone resorption marker. Therefore, scopolin and the composition including the same as an active ingredient are expected to be useful as pharmaceutical preparations for the prevention, improvement, or treatment of postmenopausal osteoporosis in women.

Abstract: Provided is a pharmaceutical composition for preventing, improving, or treating postmenopausal osteoporosis in women, the composition including, as an active ingredient, scopolin, a derivative thereof, or a pharmaceutically acceptable salt thereof, wherein scopolin has good efficacy in stimulating osteoblast differentiation, and is also effective in inhibiting a reduction in bone density after menopause, low density in a bone microstructure, a reduction in a bone formation marker in the blood, and an increase in a bone resorption marker. Therefore, scopolin and the composition including the same as an active ingredient are expected to be useful as pharmaceutical preparations for the prevention, improvement, or treatment of postmenopausal osteoporosis in women.

Abstract: Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 ?m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

Abstract: The present invention relates to a pharmaceutical composition for preventing or treating arthritis, including, as an active ingredient, a material which inhibits the expression of the hypoxia-inducible factor-2? (HIF-2?) gene or the activity of the HIF-2? protein. According to the present invention, the HIF-2? of the present invention increases the expression thereof in chondrocytes or tissue in which osteoarthritis is induced, and triggers the expression of various cartilage degeneration factors and the activation of mitogen-activated protein (MAP) kinase. In addition, when HIF-2? is inhibited, the expression level of cartilage degeneration factors and the phosphorylation of MAP kinase are significantly reduced by the inhibited degree of HIF-2?. Thus, the composition of the present invention may be applied to the prevention or treatment of arthritis, and may be used for the development of therapeutics for arthritis.

Abstract: The present invention relates to a pharmaceutical composition for preventing or treating arthritis, including, as an active ingredient, a material which inhibits the expression of the hypoxia-inducible factor-2? (HIF-2?) gene or the activity of the HIF-2? protein. According to the present invention, the HIF-2? of the present invention increases the expression thereof in chondrocytes or tissue in which osteoarthritis is induced, and triggers the expression of various cartilage degeneration factors and the activation of mitogen-activated protein (MAP) kinase. In addition, when HIF-2? is inhibited, the expression level of cartilage degeneration factors and the phosphorylation of MAP kinase are significantly reduced by the inhibited degree of HIF-2?. Thus, the composition of the present invention may be applied to the prevention or treatment of arthritis, and may be used for the development of therapeutics for arthritis.

Abstract: The present invention relates to a transgenic fertilized egg in which expression constructs, excluding human expression constructs, are introduced, including: (a) a nucleotide sequence encoding hypoxia-inducible factor 2? (HIF-2?); and (b) a transcription-regulating sequence which is operatively linked to the nucleotide sequence, as well as to a transgenic animal model for arthritis obtained therefrom. A transgenic mouse transformed with a recombinant expression vector of the present invention may be very useful as a therapeutic model for arthritis, which may be used in studies on the cartilage degeneration process. In addition, the transgenic mouse of the present invention may be applied to a method for screening arthritis therapeutics.

Abstract: Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 ?m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

Abstract: The present invention relates to acid tolerant Leuconostoc mesenteroides with excellent mannitol productivity and the use thereof. The inventive lactic acid bacteria is useful as a food additive composition and a Kimchi starter. Kimchi prepared with the addition of the inventive lactic acid bacteria is maintained at a suitable ripening degree over an extended period of time than to the prior Kimchis, and has excellent sensory properties, including excellent refreshing taste, weak sour odor and a very soft quality of sour taste.

Abstract: Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 ?m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

Abstract: Disclosed herein is a fanless high-efficiency cooling device that is applicable to electronic products having heat sources, such as plasma display panel (PDP) televisions, liquid crystal display (LCD) televisions, and liquid crystal display (LCD) monitors. The fanless high-efficiency cooling device using ion wind comprises a heat sink having a fixing part fixedly attached to a heat-generating part of an electronic product and a plurality of protrusions extending a predetermined height from a bottom surface of the fixing part, a cover that covers the upper part of the heat sink, at least one electric wire for generating ion wind between the corresponding protrusions when high voltage is applied to the electric wire, an electric wire-supporting member that supports both ends of the electric wire, and a power supply that connects a high-voltage terminal to the electric wire and connects a ground terminal to the heat sink to supply high voltage to the electric wire.

Abstract: Disclosed is a method of preparing a silver nanoparticle-containing functional microcapsule harboring the intrinsic antimicrobial and therapeutic functions of silver, as well as characteristic functions supplied by a functional substance contained in its inner core, which comprises mixing a functional substance such as a perfume with a surfactant in water, and emulsifying the mixture; adding an outer shell-forming substance such as a melanin precondensate to the resulting emulsion to form a microcapsule containing the functional substance in a spherical inner core and having an outer shell; and treating the microcapsule before hardening of the outer shell with silver nanoparticles dispersed in a water-soluble styrene maleic anhydride polymer solution to adhere the silver nanoparticles to the outer shell of the microcapsule.

Abstract: Disclosed is a submount integrated photodiode package with an improved metal layer configuration and laser diode package using the same. In particular, a unitary laser diode of the invention provides a light receiving area overlying a semiconductor substrate to correspond to a radiation area of light emitted from a laser diode so as to reduce chip size in respect to a conventional one while maintaining a monitoring current identical to the conventional one as well as improve heat-radiating features. The invention provides a unitary laser diode package which comprises a light receiving area overlying a semiconductor substrate and having the same configuration as a radiation area of emission light from the laser diode and a metal layer adjacent to the light receiving area.

Abstract: Disclosed is a submount integrated photodiode package with an improved metal layer configuration and laser diode package using the same. In particular, a unitary laser diode of the invention provides a light receiving area overlying a semiconductor substrate to correspond to a radiation area of light emitted from a laser diode so as to reduce chip size in respect to a conventional one while maintaining a monitoring current identical to the conventional one as well as improve heat-radiating features. The invention provides a unitary laser diode package which comprises a light receiving area overlying a semiconductor substrate and having the same configuration as a radiation area of emission light from the laser diode and a metal layer adjacent to the light receiving area.

Abstract: Disclosed herewith is a micro-fan. The micro-fan includes a hub attached to a rotating shaft and a plurality of blades extended from the side surface of the hub. In the micro-fan, if a leading edge is defined as the foremost edge of each of the blades consisting of a straight line portion and one or more arc portions, a trailing edge is defined as the rearmost edge of each of the blades, a chord line is defined as a line connecting two opposite points respectively situated in the leading and trailing edges and a blade angle is defined as an angle formed by the chord line and the horizontal line passing through the same point of the leading edge as that through which the chord line passes and lying in the same vertical plane as that in which the leading edge lies, the straight line portions of the leading and trailing edges are perpendicular to the hub and form a predetermined inside angle.

Abstract: Disclosed is a heat sink for discharging an electronic chip, including a body contacting the surface of the electronic chip at one major surface thereof and received heat emitted from the surface of the electronic chip, the one major surface of the body being flat; a plurality of heat discharge fins formed integrally with the body and adapted to discharge the heat, transferred to the body, to the atmosphere, the heat discharge fins being protruded from the other major surface of the body while being uniformed spaced from one another; and a plurality of corrugated louver fin members each interposed between adjacent ones of the heat discharge fins and formed by repeatedly bending a thin plate member to have a wave shape, each of the corrugated louver fin members having a plurality of louvers adapted to create a turbulent flow of air while varying the direction of the air flow.