Abstract: A semiconductor package includes a bump interconnection structure. The semiconductor package includes a first lead and a second lead spaced apart from each other on a first substrate, a bump disposed to face the first lead in a second substrate, and a solder layer configured to connect the bump and the first lead. The first lead has a stair shape that ascends toward the second lead.

Abstract: A tray module is applicable to a chassis. The chassis includes at least two side plates. Each side plate has a guiding portion. The guiding portion includes a first horizontal section and an ascending section, and the ascending section is connected to the first horizontal section. The tray module includes a carrier body, at least two first connecting rods, and at least two second connecting rods. Each first connecting rod has a movable end and a driven end. The movable end is pivotally connected to the carrier body and slidably disposed in the guiding portions. Each second connecting rod has a pivotal end, a pivotal connection portion, and an operating end. The pivotal connection portion is located between the pivotal end and the operating end. Each pivotal end is pivotally connected to the each side plate. Each driven end is pivotally connected to each pivotal connection portion.

Abstract: A method, system, and computer program product for script generation and recommendation from behavior trees are provided. The method receives a set of input commands within a programming interface. The set of input commands is parsed into a set of command parts. The set of input commands is normalized based on the set of command parts to generate a set of normalized commands. A set of behavior trees are generated based on the set of normalized commands and the set of parts. The method generates a set of command scripts based on the set of behavior trees.

Abstract: A wafer metrology system having a continuous dynamic sampling scheme configured to optimize a sampling rate for AVI of process wafers in an IC fabrication flow based on acceptable quality levels. For a stable process, the process wafers may be sampled at a lower rate without negatively affecting quality control.

Abstract: A semiconductor device includes a chip body; a circuit layer over the chip body; an upper insulating layer over the circuit layer; a chip metal layer over the upper insulating layer, the chip metal layer including a pad portion; a passivation layer over the chip metal layer; a lower redistribution insulating layer over the passivation layer, the pad portion of the chip metal layer left exposed by the passivation layer and the lower redistribution insulating layer; a redistribution bonding interconnection over the lower redistribution insulating layer; and an upper redistribution insulating layer over the lower redistribution insulating layer.

Abstract: A semiconductor package includes a package substrate, a connection pad including a recessed portion disposed on one surface of the package substrate, and an insulating pattern disposed on the one surface of the package substrate to be spaced apart from the connection pad. The connection pad includes an outer sidewall, an inner sidewall in the recessed portion inclining in an inward direction from an upper portion, and a groove pattern formed on the inner sidewall.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, input and output (I/O) pads disposed at an upper portion of the semiconductor substrate, and first bump pillars disposed over the I/O pads. The first bump pillars are selectively arranged over some of the I/O pads in a first horizontal direction.

Abstract: A semiconductor package may be presented. The semiconductor package includes a first dielectric layer including a first surface and a second surface. First and second conductive lands are disposed on the first surface of the first dielectric layer. A first column formed by the first conductive lands and a second column formed by the second conductive lands are spaced apart from each other. Outer traces extend from the second conductive lands, and inner traces are disposed on the second surface of the first dielectric layer. Vias penetrate the first dielectric layer and respectively connect the first conductive lands to the inner traces. A semiconductor die is disposed on the first surface of the first dielectric layer.

Abstract: A semiconductor device includes a chip body; a passivation layer on the chip body; a lower dielectric layer on the passivation layer; a first re-distribution pad on the lower dielectric layer; an upper dielectric layer on the lower dielectric layer, the upper dielectric layer having a groove that exposes an upper surface of the first re-distribution pad; and a second re-distribution pad on the upper dielectric layer. An upper surface of the second re-distribution pad is positioned at a higher level than the upper surface of the first re-distribution pad.

Abstract: A tray module is applicable to a chassis. The chassis includes at least two side plates. Each side plate has a guiding portion. The guiding portion includes a first horizontal section and an ascending section, and the ascending section is connected to the first horizontal section. The tray module includes a carrier body, at least two first connecting rods, and at least two second connecting rods. Each first connecting rod has a movable end and a driven end. The movable end is pivotally connected to the carrier body and slidably disposed in the guiding portions. Each second connecting rod has a pivotal end, a pivotal connection portion, and an operating end. The pivotal connection portion is located between the pivotal end and the operating end. Each pivotal end is pivotally connected to the each side plate. Each driven end is pivotally connected to each pivotal connection portion.

Abstract: Provided is a method of manufacturing a semiconductor device including a bump interconnect structure. In the method of manufacturing the semiconductor device, a first substrate including a connection pad is formed, and a bump including a solder layer and a metal post protruding from the solder layer are formed on the connection pad. A second substrate including a bump land may be formed. The first substrate may be disposed on the second substrate so that a protruding end of the metal post contacts the bump land, and the solder layer may be reflowed. Accordingly, it possible to interconnect the metal post to the bump land.

Abstract: A door curtain mounting structure for a vehicle includes a door panel having a door inner panel disposed and a door outer panel disposed inside and outside thereof, respectively, in a width direction of the vehicle, and a receiving space formed between the door inner panel and the door outer panel; a door frame coupled to the door panel in order to form a door window opened and closed by a window glass; a door trim disposed inside the door inner panel in the width direction of a vehicle; and a door curtain housing in which a door curtain blocking the window glass inside in the width direction of a vehicle is received, the door curtain coupled to the door trim and disposed between the door inner panel and the door outer panel, so that the door curtain is coupled to the door frame to increase a door stiffness.

Abstract: A door curtain mounting structure for a vehicle includes a door panel having a door inner panel disposed and a door outer panel disposed inside and outside thereof, respectively, in a width direction of the vehicle, and a receiving space formed between the door inner panel and the door outer panel; a door frame coupled to the door panel in order to form a door window opened and closed by a window glass; a door trim disposed inside the door inner panel in the width direction of a vehicle; and a door curtain housing in which a door curtain blocking the window glass inside in the width direction of a vehicle is received, the door curtain coupled to the door trim and disposed between the door inner panel and the door outer panel, so that the door curtain is coupled to the door frame to increase a door stiffness.

Abstract: A door beam for a vehicle may include a beam portion having a rod shape which extends along a longitudinal direction of a vehicle body, a front mounting portion disposed at a front end portion of the beam portion to mount the front end portion of the beam portion to the door, and a rear mounting portion disposed at a rear end portion of the beam portion to mount the rear end portion of the beam portion to the door.

Abstract: A door beam for a vehicle may include a beam portion having a rod shape which extends along a longitudinal direction of a vehicle body, a front mounting portion disposed at a front end portion of the beam portion to mount the front end portion of the beam portion to the door, and a rear mounting portion disposed at a rear end portion of the beam portion to mount the rear end portion of the beam portion to the door.

Abstract: The present invention relates to an earthquake-resistant light tower with a tuned mass damper, in which a tuned mass damper is installed in a head part of a light apparatus installed on the top of a tower to absorb an earthquake or other vibration, thereby protecting a tower from vibration.

Abstract: The present invention relates to an earthquake-resistant light tower with a tuned mass damper, in which a tuned mass damper is installed in a head part of a light apparatus installed on the top of a tower to absorb an earthquake or other vibration, thereby protecting a tower from vibration.

Abstract: A hooking structure disposed on a door of a vehicle ensures safety of a passenger by preventing the door from being pushed inside in a side collision of the vehicle, by fastening a hooking structure integrally formed with the lower end of the door. The hooking structure may include: a welding flange that is fastened in parallel to an inner panel of a vehicle door; a hooking flange formed perpendicularly to an outer panel of the vehicle door; a connecting portion integrally connecting the welding flange with the hooking flange; a first closed-section flange disposed in an inverted wall shape between the welding flange and the connecting portion; and a second closed-section flange disposed in an inverted wall shape between the hooking flange and the connecting portion.

Abstract: An ice maker of a refrigerator includes: an ice making vessel having a plurality of cavities; an ejector for separating ice formed in the cavity from the ice making vessel and discharging the ice to a storage container; a driving unit for driving the ejector; a heater disposed at a lower side of the ice making vessel and heating the ice making vessel; a temperature sensor disposed at one side of the ice making vessel and sensing a temperature of the ice making vessel; a full ice detecting unit for generating an electric signal when the storage container is full of ice; and a control unit for receiving the electric signal outputted from the full ice detecting unit and the temperature sensor so as to control an operation of the driving unit and the heater, and turning on/off an input power supply according to the electric signal outputted from the full ice detecting unit.

Abstract: An ice maker of a refrigerator includes: an ice making vessel having a plurality of cavities; an ejector for separating ice formed in the cavity from the ice making vessel and discharging the ice to a storage container; a driving unit for driving the ejector; a heater disposed at a lower side of the ice making vessel and heating the ice making vessel; a temperature sensor disposed at one side of the ice making vessel and sensing a temperature of the ice making vessel; a full ice detecting unit for generating an electric signal when the storage container is full of ice; and a control unit for receiving the electric signal outputted from the full ice detecting unit and the temperature sensor so as to control an operation of the driving unit and the heater, and turning on/off an input power supply according to the electric signal outputted from the full ice detecting unit.