Patents by Inventor Siang Kuan Chua

Siang Kuan Chua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Clips for semiconductor packages
    Patent number: 11211353
    Abstract: A clip for a semiconductor package and a semiconductor having a clip is disclosed. In one example, the clip includes a first planar portion, a plurality of first pillars, and a plurality of first solder balls. Each first pillar of the plurality of first pillars is coupled to the first planar portion. Each first solder ball of the plurality of first solder balls is coupled to a corresponding first pillar of the plurality of first pillars.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: December 28, 2021
    Assignee: Infineon Technologies AG
    Inventors: Mohd Kahar Bajuri, Abdul Rahman Mohamed, Siang Kuan Chua, Ke Yan Tean
  • CLIPS FOR SEMICONDUCTOR PACKAGES
    Publication number: 20210013171
    Abstract: A clip for a semiconductor package and a semiconductor having a clip is disclosed. In one example, the clip includes a first planar portion, a plurality of first pillars, and a plurality of first solder balls. Each first pillar of the plurality of first pillars is coupled to the first planar portion. Each first solder ball of the plurality of first solder balls is coupled to a corresponding first pillar of the plurality of first pillars.
    Type: Application
    Filed: July 9, 2019
    Publication date: January 14, 2021
    Applicant: Infineon Technologies AG
    Inventors: Mohd Kahar Bajuri, Abdul Rahman Mohamed, Siang Kuan Chua, Ke Yan Tean