Patents by Inventor Siang Miang Yeo
Siang Miang Yeo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230411257Abstract: A method for forming packaged electronic devices includes providing a substrate having pads connected by conductive pad linking portions and semiconductor devices attached to the pads in different orientations. A second substrate is provided having conductive connectors each with a plate portion, a conductive member extending from a side segment of the plate portion, a connective portion extending from the conductive member distal to the plate portion, and conductive linking portions physically connecting adjoining plate portions together. Each plate portion is attached to one of the semiconductor devices to provide a subassembly. A package body is provided to encapsulate at least portions of the subassembly. The method includes separating the encapsulated subassembly to provide the packaged electronic devices such that the separating step severs the conductive linking portions.Type: ApplicationFiled: August 30, 2023Publication date: December 21, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Siang Miang YEO, Mohd Hasrul Bin ZULKIFLI
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Patent number: 11764135Abstract: A method for forming packaged electronic devices includes providing a substrate having pads connected by conductive pad linking portions and semiconductor devices attached to the pads in different orientations. A second substrate is provided having conductive connectors each with a plate portion, a conductive member extending from a side segment of the plate portion, a connective portion extending from the conductive member distal to the plate portion, and conductive linking portions physically connecting adjoining plate portions together. Each plate portion is attached to one of the semiconductor devices to provide a subassembly. A package body is provided to encapsulate at least portions of the subassembly. The method includes separating the encapsulated subassembly to provide the packaged electronic devices such that the separating step severs the conductive linking portions.Type: GrantFiled: November 23, 2020Date of Patent: September 19, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Siang Miang Yeo, Mohd Hasrul Bin Zulkifli
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Publication number: 20210074616Abstract: A method for forming packaged electronic devices includes providing a substrate having pads connected by conductive pad linking portions and semiconductor devices attached to the pads in different orientations. A second substrate is provided having conductive connectors each with a plate portion, a conductive member extending from a side segment of the plate portion, and a connective portion extending from the conductive member distal to the plate portion. The second substrate further has conductive linking portions physically connecting adjoining plate portions together. Each plate portion is attached to one of the semiconductor devices to provide a subassembly. The conductive linking portions are configured to maintain the adjoining plate portions in substantial alignment with the semiconductor devices and to maintain the connective portions is a desired alignment during the plate portion attachment step.Type: ApplicationFiled: November 23, 2020Publication date: March 11, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Siang Miang YEO, Mohd Hasrul Bin ZULKIFLI
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Patent number: 10896869Abstract: A method for forming packaged electronic devices includes providing a substrate having pads connected by conductive pad linking portions and semiconductor devices attached to the pads in different orientations. A second substrate is provided having conductive connectors each with a plate portion, a conductive member extending from a side segment of the plate portion, and a connective portion extending from the conductive member distal to the plate portion. The second substrate further has conductive linking portions physically connecting adjoining plate portions together. Each plate portion is attached to one of the semiconductor devices to provide a subassembly. The conductive linking portions are configured to maintain the adjoining plate portions in substantial alignment with the semiconductor devices and to maintain the connective portions is a desired alignment during the plate portion attachment step.Type: GrantFiled: January 12, 2018Date of Patent: January 19, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Siang Miang Yeo, Mohd Hasrul Bin Zulkifli
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Publication number: 20210013142Abstract: A packaged semiconductor device has a die attach pad and leads disposed proximate to the die attach pad. Each lead has a lead bottom surface and a lead end surface. A semiconductor device attached adjacent to a top surface of the die attach pad, and a conductive clip is attached to the semiconductor device and at least one of the leads. The conductive clip comprises a first tie bar extending from a first side surface of the conductive clip. A package body encapsulates the semiconductor device, the conductive clip, portions of the leads, at least a portion of the first tie bar, and at least a portion of the die attach pad. Each lead end surface is exposed in a side surface of the package body, and an end surface of the first tie bar is exposed in a first side surface of the package body. A conductive layer is disposed on each lead end surface but is not disposed on the end surface of the first tie bar.Type: ApplicationFiled: September 29, 2020Publication date: January 14, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Siang Miang YEO, Mohd Hasrul Bin ZULKIFLI
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Patent number: 10833008Abstract: A packaged semiconductor device has a die attach pad and leads disposed proximate to the die attach pad. Each lead has a lead bottom surface and a lead end surface. A semiconductor device attached adjacent to a top surface of the die attach pad, and a conductive clip is attached to the semiconductor device and at least one of the leads. The conductive clip comprises a first tie bar extending from a first side surface of the conductive clip. A package body encapsulates the semiconductor device, the conductive clip, portions of the leads, at least a portion of the first tie bar, and at least a portion of the die attach pad. Each lead end surface is exposed in a side surface of the package body, and an end surface of the first tie bar is exposed in a first side surface of the package body. A conductive layer is disposed on each lead end surface but is not disposed on the end surface of the first tie bar.Type: GrantFiled: July 30, 2018Date of Patent: November 10, 2020Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Siang Miang Yeo, Mohd Hasrul Bin Zulkifli
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Publication number: 20190221506Abstract: A method for forming packaged electronic devices includes providing a substrate having pads connected by conductive pad linking portions and semiconductor devices attached to the pads in different orientations. A second substrate is provided having conductive connectors each with a plate portion, a conductive member extending from a side segment of the plate portion, and a connective portion extending from the conductive member distal to the plate portion. The second substrate further has conductive linking portions physically connecting adjoining plate portions together. Each plate portion is attached to one of the semiconductor devices to provide a subassembly The conductive linking portions are configured to maintain the adjoining plate portions in substantial alignment with the semiconductor devices and to maintain the connective portions is a desired alignment during the plate portion attachment step.Type: ApplicationFiled: January 12, 2018Publication date: July 18, 2019Applicant: AMKOR TECHNOLOGY, INC.Inventors: Siang Miang YEO, Mohd Hasrul Bin ZULKIFLI
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Publication number: 20180350735Abstract: A packaged semiconductor device has a die attach pad and leads disposed proximate to the die attach pad. Each lead has a lead bottom surface and a lead end surface. A semiconductor device attached adjacent to a top surface of the die attach pad, and a conductive clip is attached to the semiconductor device and at least one of the leads. The conductive clip comprises a first tie bar extending from a first side surface of the conductive clip. A package body encapsulates the semiconductor device, the conductive clip, portions of the leads, at least a portion of the first tie bar, and at least a portion of the die attach pad. Each lead end surface is exposed in a side surface of the package body, and an end surface of the first tie bar is exposed in a first side surface of the package body. A conductive layer is disposed on each lead end surface but is not disposed on the end surface of the first tie bar.Type: ApplicationFiled: July 30, 2018Publication date: December 6, 2018Applicant: AMKOR TECHNOLOGY, INC.Inventors: Siang Miang YEO, Mohd Hasrul Bin ZULKIFLI
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Patent number: 10121742Abstract: A method for forming packaged semiconductor devices comprises providing a first conductive frame structure. The method includes coupling a second conductive frame structure to the first conductive frame structure to provide a first sub-assembly, wherein the second conductive frame structure comprises a plurality of interconnected conductive connective structures. The method includes encapsulating the first sub-assembly with an encapsulating layer to provide an encapsulated sub-assembly. The method includes removing joined conductive portions of the first conductive frame structure to form a plurality of conductive flank surfaces disposed on side surfaces of the encapsulated sub-assembly. The method includes forming a conductive layer on the conductive flank surfaces. The method includes separating the encapsulated sub-assembly to provide the packaged semiconductor devices each having portions of the conductive flank surfaces covered by the conductive layer.Type: GrantFiled: March 15, 2017Date of Patent: November 6, 2018Assignee: Amkor Technology, Inc.Inventors: Siang Miang Yeo, Mohd Hasrul Bin Zulkifli
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Publication number: 20180269147Abstract: A method for forming packaged semiconductor devices comprises providing a first conductive frame structure. The method includes coupling a second conductive frame structure to the first conductive frame structure to provide a first sub-assembly, wherein the second conductive frame structure comprises a plurality of interconnected conductive connective structures. The method includes encapsulating the first sub-assembly with an encapsulating layer to provide an encapsulated sub-assembly. The method includes removing joined conductive portions of the first conductive frame structure to form a plurality of conductive flank surfaces disposed on side surfaces of the encapsulated sub-assembly. The method includes forming a conductive layer on the conductive flank surfaces. The method includes separating the encapsulated sub-assembly to provide the packaged semiconductor devices each having portions of the conductive flank surfaces covered by the conductive layer.Type: ApplicationFiled: March 15, 2017Publication date: September 20, 2018Applicant: AMKOR TECHNOLOGY, INC.Inventors: Siang Miang Yeo, Mohd Hasrul Bin ZULKIFLI